About: PMOS logic is a research topic. Over the lifetime, 10483 publications have been published within this topic receiving 108464 citations. The topic is also known as: p-type metal-oxide-semiconductor logic.
Papers published on a yearly basis
TL;DR: This work demonstrates logic circuits with field-effect transistors based on single carbon nanotubes that exhibit a range of digital logic operations, such as an inverter, a logic NOR, a static random-access memory cell, and an ac ring oscillator.
Abstract: We demonstrate logic circuits with field-effect transistors based on single carbon nanotubes. Our device layout features local gates that provide excellent capacitive coupling between the gate and nanotube, enabling strong electrostatic doping of the nanotube from p-doping to n-doping and the study of the nonconventional long-range screening of charge along the one-dimensional nanotubes. The transistors show favorable device characteristics such as high gain (>10), a large on-off ratio (>10(5)), and room-temperature operation. Importantly, the local-gate layout allows for integration of multiple devices on a single chip. Indeed, we demonstrate one-, two-, and three-transistor circuits that exhibit a range of digital logic operations, such as an inverter, a logic NOR, a static random-access memory cell, and an ac ring oscillator.
TL;DR: Dense, perfectly aligned arrays of long, perfectly linear SWNTs are reported as an effective thin-film semiconductor suitable for integration into transistors and other classes of electronic devices, representing a route to large-scale integrated nanotube electronics.
Abstract: †Single-walled carbon nanotubes (SWNTs) have many exceptional electronic properties. Realizing the full potential of SWNTs in realistic electronic systems requires a scalable approach to device and circuit integration. We report the use of dense, perfectly aligned arrays of long, perfectly linear SWNTs as an effective thin-film semiconductor suitable for integration into transistors and other classes of electronic devices. The large number of SWNTs enable excellent device-level performance characteristics and good device-to-device uniformity, even with SWNTs that are electronically heterogeneous. Measurements on p- and n-channel transistors that involve as many as 2,100 SWNTs reveal device-level mobilities and scaled transconductances approaching 1,000 cm 2 V 21 s 21 and 3,000 S m 21 , respectively, and with current outputs of up to 1 A in devices that use interdigitated electrodes. PMOS and CMOS logic gates and mechanically flexible transistors on plastic provide examples of devices that can be formed with this approach. Collectively, these results may represent a route to large-scale integrated nanotube electronics.
01 Dec 2007
TL;DR: In this paper, a 45 nm logic technology is described that for the first time incorporates high-k + metal gate transistors in a high volume manufacturing process, resulting in the highest drive currents yet reported for NMOS and PMOS.
Abstract: A 45 nm logic technology is described that for the first time incorporates high-k + metal gate transistors in a high volume manufacturing process. The transistors feature 1.0 nm EOT high-k gate dielectric, dual band edge workfunction metal gates and third generation strained silicon, resulting in the highest drive currents yet reported for NMOS and PMOS. The technology also features trench contact based local routing, 9 layers of copper interconnect with low-k ILD, low cost 193 nm dry patterning, and 100% Pb-free packaging. Process yield, performance and reliability are demonstrated on 153 Mb SRAM arrays with SRAM cell size of 0.346 mum2, and on multiple microprocessors.
08 Dec 2003
TL;DR: In this article, the authors describe a novel strained transistor architecture which is incorporated into a 90nm logic technology on 300mm wafers, which features an epitaxially grown strained SiGe film embedded in the source drain regions.
Abstract: This paper describes the details of a novel strained transistor architecture which is incorporated into a 90nm logic technology on 300mm wafers The unique strained PMOS transistor structure features an epitaxially grown strained SiGe film embedded in the source drain regions Dramatic performance enhancement relative to unstrained devices are reported These transistors have gate length of 45nm and 50nm for NMOS and PMOS respectively, 12nm physical gate oxide and Ni salicide World record PMOS drive currents of 700/spl mu/A//spl mu/m (high V/sub T/) and 800/spl mu/A//spl mu/m (low V/sub T/) at 12V are demonstrated NMOS devices exercise a highly tensile silicon nitride capping layer to induce tensile strain in the NMOS channel region High NMOS drive currents of 126mA//spl mu/m (high VT) and 145mA//spl mu/m (low VT) at 12V are reported The technology is mature and is being ramped into high volume manufacturing to fabricate next generation Pentium/spl reg/ and Intel/spl reg/ Centrino/spl trade/ processor families
TL;DR: In this paper, a leading-edge 90-nm technology with 1.2-nm physical gate oxide, 45-nm gate length, strained silicon, NiSi, seven layers of Cu interconnects, and low/spl kappa/CDO for high-performance dense logic is presented.
Abstract: A leading-edge 90-nm technology with 1.2-nm physical gate oxide, 45-nm gate length, strained silicon, NiSi, seven layers of Cu interconnects, and low-/spl kappa/ CDO for high-performance dense logic is presented. Strained silicon is used to increase saturated n-type and p-type metal-oxide-semiconductor field-effect transistors (MOSFETs) drive currents by 10% and 25%, respectively. Using selective epitaxial Si/sub 1-x/Ge/sub x/ in the source and drain regions, longitudinal uniaxial compressive stress is introduced into the p-type MOSEFT to increase hole mobility by >50%. A tensile silicon nitride-capping layer is used to introduce tensile strain into the n-type MOSFET and enhance electron mobility by 20%. Unlike all past strained-Si work, the hole mobility enhancement in this paper is present at large vertical electric fields in nanoscale transistors making this strain technique useful for advanced logic technologies. Furthermore, using piezoresistance coefficients it is shown that significantly less strain (/spl sim/5 /spl times/) is needed for a given PMOS mobility enhancement when applied via longitudinal uniaxial compression versus in-plane biaxial tension using the conventional Si/sub 1-x/Ge/sub x/ substrate approach.
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