Topic
Potassium iodate
About: Potassium iodate is a research topic. Over the lifetime, 611 publications have been published within this topic receiving 5940 citations. The topic is also known as: KIO3.
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TL;DR: It is interesting to observe here that the iodate titrations may be carried out effectively in the presence of saturated organic acids, alcohol and a host of other organic substances.
Abstract: Potassium iodate is a fairly strong oxidizing agent that may be used in the assay of a number of pharmaceutical substances, for instance : benzalkonium chloride, cetrimide, hydralazine hydrochloride, potassium iodide, phenylhydrazine hydrochloride, semicarbazide hydrochloride and the like. Under appropriate experimental parameters the iodate reacts quantitatively with both iodides and iodine. It is, however, interesting to observe here that the iodate titrations may be carried out effectively in the presence of saturated organic acids, alcohol and a host of other organic substances.
57 citations
TL;DR: The most stable combination, containing 50 mg iodine and 1000 mg iron per kg salt, retained more than 75% of the added iodine for a year at 40°C, 100% RH as mentioned in this paper.
54 citations
TL;DR: In this article, a new sensitive method is proposed for the determination of traces of arsenic(III) in Rhodamine-B. The method involves bleaching of the pinkish red colored dye, Rhodamine B, by the action of iodine which is released by the reaction between potassium iodate and arsenic in slightly acidic medium.
51 citations
TL;DR: In this article, the technique of iodide estimation in brine by ion chromatography with amperometric detection was applied to iodate estimation in salt and the method involved reduction of iodate to iodide with excess sodium bisulphite followed by estimation of the iodide.
51 citations
TL;DR: In this article, the polishing rates of copper and tantalum were measured using potassium iodate-based slurries containing silica abrasives for several concentrations of iodate and pH.
Abstract: Polish rates of copper and tantalum were measured using potassium iodate-based slurries containing silica abrasives for several concentrations of potassium iodate and pH. The tantalum polish rate increases rapidly with pH beyond pH 10.0 and with 3% silica reaches a value of about 215 nm/min while copper polish rate under the same conditions is only about 45 nm/min. Also, the dissolution/passivation behaviors of copper as well as tantalum were investigated by electrochemical measurements. © 2001 The Electrochemical Society. All rights reserved.
50 citations