Topic
Potassium iodate
About: Potassium iodate is a research topic. Over the lifetime, 611 publications have been published within this topic receiving 5940 citations. The topic is also known as: KIO3.
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TL;DR: In this article, the most chemically and thermally stable sample is prepared by adding a mixture of aqueous solutions of 0·5 mol L−1 sodium tungstate, potassium iodate, and 1 mol l−1 orthophosphoric acid to a q = 0.1 mol L − 1 zirconium(IV) oxychloride.
Abstract: Zirconium(IV) tungstoiodophosphate has been synthesized under a variety of conditions. The most chemically and thermally stable sample is prepared by adding a mixture of aqueous solutions of 0·5 mol L−1 sodium tungstate, potassium iodate and 1 mol L−1 orthophosphoric acid to aqueous solution of 0·1 mol L−1 zirconium(IV) oxychloride. Its ion exchange capacity for Na+ and K+ was found to be 2·20 and 2·35 meq g−1 dry exchanger, respectively. The material has been characterized on the basis of chemical composition, pH titration, Fourier transform infrared spectroscopy (FTIR) and thermogravimetric analysis. The effect on the exchange capacity of drying the exchanger at different temperatures has been studied. The analytical importance of the material has been established by quantitative separation of Pb2+ from other metal ions.
41 citations
TL;DR: In this paper, the condition that polyaniline (PANI) formed selectively on wool was found out, and PANI was selectively formed on wool in the case of polymerization of aniline, using potassium iodate as an oxidizing agent in the presence of wool.
40 citations
TL;DR: In this paper, the role of colloid species and slurry chemistry in tungsten chemical mechanical polishing was investigated, and it was shown that the colloid surface chemistry had a large effect on polish rate and process temperature, however, the trend in polish rate did not always follow that of process temperature.
Abstract: We investigated the role of colloid species and slurry chemistry in tungsten chemical mechanical polishing. Specifically, we measured polish rate and process temperature in potassium iodate-based slurries as a function of colloid species and concentration, slurry pH, and potassium iodate concentration, as well as polish pressure and polish rotation rate. We investigated slurries containing yttrium-, zirconium-, cerium-, and aluminum-based oxide and hydroxide colloids. We found that the colloid species had a large effect on polish rate and process temperature. The colloids showed two orders of magnitude in the polish rate range from ∼15 to ∼1975 A min -1 under otherwise identical experimental conditions (same polisher, pad, slurry chemistry, pressure, and rotation rates). Colloids of the same metal species from different sources also showed a large range in polish rates. Process temperature was a function of colloid species, however, the trend in polish rate did not always follow that of process temperature. Both polish rate and process temperature were dependent on potassium iodate concentration and slurry pH (controlled with a buffer). We also introduce a heuristic polish mechanism to investigate the role of the colloid surface chemistry and its interaction with the tungsten surface. The data indicate that the surface characteristics of the colloid and how this surface interacts with the tungsten surface play a significant role in the mechanism of tungsten removal during polish.
39 citations
TL;DR: In this article, single crystals of the potassium uranyl iodate, K[UO2(IO3)3] (1), have been grown under mild hydrothermal conditions.
39 citations
TL;DR: Genotoxic effects of potassium iodate were evaluated in vitro using the alkaline comet assay and the cytokinesis-block micronucleus assay and showed that potassium bromate would induce DNA damage by several mechanisms besides oxidative stress.
39 citations