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Power integrity

About: Power integrity is a research topic. Over the lifetime, 983 publications have been published within this topic receiving 6867 citations.


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Book
19 Nov 2007
TL;DR: This book's system-level focus and practical examples will make it indispensable for every student and professional concerned with power integrity, including electrical engineers, system designers, signal integrity engineers, and materials scientists.
Abstract: The First Comprehensive, Example-Rich Guide to Power Integrity ModelingProfessionals such as signal integrity engineers, package designers, and system architects need to thoroughly understand signal and power integrity issues in order to successfully design packages and boards for high speed systems Now, for the first time, there's a complete guide to power integrity modeling: everything you need to know, from the basics through the state of the artUsing realistic case studies and downloadable software examples, two leading experts demonstrate today's best techniques for designing and modeling interconnects to efficiently distribute power and minimize noiseThe authors carefully introduce the core concepts of power distribution design, systematically present and compare leading techniques for modeling noise, and link these techniques to specific applications Their many examples range from the simplest (using analytical equations to compute power supply noise) through complex system-level applicationsThe authors Introduce power delivery network components, analysis, high-frequency measurement, and modeling requirements Thoroughly explain modeling of power/ground planes, including plane behavior, lumped modeling, distributed circuit-based approaches, and much more Offer in-depth coverage of simultaneous switching noise, including modeling for return currents using time- and frequency-domain analysis Introduce several leading time-domain simulation methods, such as macromodeling, and discuss their advantages and disadvantages Present the application of the modeling methods on several advanced case studies that include high-speed servers, high-speed differential signaling, chip package analysis, materials characterization, embedded decoupling capacitors, and electromagnetic bandgap structures This book's system-level focus and practical examples will make it indispensable for every student and professional concerned with power integrity, including electrical engineers, system designers, signal integrity engineers, and materials scientists It will also be valuable to developers building software that helps to analyze high-speed systems

271 citations

Book
01 Jul 2009
TL;DR: This book brings together up-to-the-minute techniques for finding, fixing, and avoiding signal integrity problems in your design and will be an invaluable resource for getting signal integrity designs right the first time, every time.
Abstract: The #1 Practical Guide to Signal Integrity DesignNow Updated with Extensive New Coverage!This book brings together up-to-the-minute techniques for finding, fixing, and avoiding signal integrity problems in your design. Drawing on his work teaching more than five thousand engineers, world-class signal and power integrity expert Eric Bogatin systematically reviews the root causes of all six families of signal integrity problems and shows how to design them out early in the design cycle. This editions extensive new content includes a brand-new chapter on S-parameters in signal integrity applications, and another on power integrity and power distribution network designtopics at the forefront of contemporary electronics design.Coverage includesA fully up-to-date introduction to signal integrity and physical designHow design and technology selection can make or break the performance of the power distribution networkExploration of key concepts, such as plane impedance, spreading inductance, decoupling capacitors, and capacitor loop inductancePractical techniques for analyzing resistance, capacitance, inductance, and impedanceSolving signal integrity problems via rules of thumb, analytic approximation, numerical simulation, and measurementUnderstanding how interconnect physical design impacts signal integrityManaging differential pairs and lossesHarnessing the full power of S-parameters in high-speed serial link applicationsEnsuring power integrity throughout the entire power distribution pathRealistic design guidelines for improving signal integrity, and much moreUnlike books that concentrate on theoretical derivation and mathematical rigor, this book emphasizes intuitive understanding, practical tools, and engineering discipline. Designed for electronics industry professionals from beginners to experts it will be an invaluable resource for getting signal integrity designs right the first time, every time.

251 citations

Journal ArticleDOI
TL;DR: In this article, the authors reviewed possible solutions based on decoupling or isolation for suppressing power distribution network (PDN) noise on package or printed circuit board (PCB) levels.
Abstract: Mitigating power distribution network (PDN) noise is one of the main efforts for power integrity (PI) design in high-speed or mixed-signal circuits. Possible solutions, which are based on decoupling or isolation concept, for suppressing PDN noise on package or printed circuit board (PCB) levels are reviewed in this paper. Keeping the PDN impedance very low in a wide frequency range, except at dc, by employing a shunt capacitors, which can be in-chip, package, or PCB levels, is the first priority way for PI design. The decoupling techniques including the planes structure, surface-mounted technology decoupling capacitors, and embedded capacitors will be discussed. The isolation approach that keeps part of the PDN at high impedance is another way to reduce the PDN noise propagation. Besides the typical isolation approaches such as the etched slots and filter, the new isolation concept using electromagnetic bandgap structures will also be discussed.

200 citations

Journal ArticleDOI
TL;DR: In this article, the state of the arts of IC, electronic package, and printed circuit board simulation and modeling technologies are summarized for both available structures [multilayered powerground planes and macromodeling of interconnect (INC)] and novel structures (nano-INCs and 3-D ICs based on through-silicon via technology).
Abstract: The ever-increasing demands of digital computing and wireless communication have been driving the semiconductor technology to change with each passing day. Modern electronic systems integrate more complex components and devices, which results in a very complex electromagnetic (EM) field environment. EM compatibility has become one of the major issues in ICs redesign, mainly due to the lack of efficient and accurate simulation tools and expertise on noise reduction and immunity improvement. This paper reviews the state of the arts of IC, electronic package, and printed circuit board simulation and modeling technologies. It summarizes the modeling technologies for both available structures [multilayered power-ground planes and macromodeling of interconnect (INC)] and novel structures (nano-INCs and 3-D ICs based on through-silicon via technology). It also illustrates the trends of simulation and modeling technologies in EM compatibility, signal integrity, and power integrity.

166 citations

Journal ArticleDOI
TL;DR: In this article, a novel L-bridged electromagnetic bandgap (EBG) power/ground planes is proposed with super-wideband suppression of the ground bounce noise (GBN) from 600Mz to 4.6GHz.
Abstract: A novel L-bridged electromagnetic bandgap (EBG) power/ground planes is proposed with super-wideband suppression of the ground bounce noise (GBN) from 600Mz to 4.6GHz. The L-shaped bridge design on the EBG power plane not only broadens the stopband bandwidth, but also can increase the mutual coupling between the adjacent EBG cells by significantly decreasing the gap between the cells. It is found the small gap design can prevent from the severe degradation of the signal quality for the high-speed signal referring to the perforated EBG power plane. The excellent GBN suppression performance with keeping reasonably good signal integrity for the proposed structure is validated both experimentally and numerically. Good agreement is seen.

163 citations


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Performance
Metrics
No. of papers in the topic in previous years
YearPapers
202312
202267
202139
202045
201965
201852