Topic
Power integrity
About: Power integrity is a research topic. Over the lifetime, 983 publications have been published within this topic receiving 6867 citations.
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09 Jul 2007
TL;DR: A novel method for system-level modeling of advanced electronic packages is presented which is able to provide fast yet accurate simulation for signal and power integrity analysis of the multilayered electronic packages.
Abstract: A novel method for system-level modeling of advanced electronic packages is presented which is able to provide fast yet accurate simulation for signal and power integrity analysis of the multilayered electronic packages. The method is a semi- numerical approach based on the combination of the moment method and the scattering matrix method.
1 citations
24 Nov 2014
TL;DR: In this paper, a 3D-integrated test vehicle that emulates noise generation and propagation in a heterogeneous integrated system has been developed, where in-stack waveform capturers are embedded on each tier which captured the generated and propagation of noise.
Abstract: A 3D-integrated test vehicle that emulates noise generation and propagation in a heterogeneous integrated system has been developed. In-stack waveform capturers are embedded on each tier which captured the generation and propagation of noise. A consistent analytical model is created and analysis using that model has allowed us to develop a design strategy for the power delivery network to attenuate noise propagation in the stacked system.
1 citations
01 Dec 2016
TL;DR: This work summarizes key steps for the design of low noise power domains in datacenter and cloud computing platforms using ferrite beads.
Abstract: This work summarizes key steps for the design of low noise power domains in datacenter and cloud computing platforms using ferrite beads. The methodology described here has been implemented in multiple products including Xeon servers and more specifically in high speed IO power domains that, due to their sensitivity, must have low voltage noise.
1 citations
TL;DR: Today's mobile and interconnected society poses complex and growing challenges to the electronic systems that back emerging big data and Internet of Things technologies, and ensuring their signal and power integrity (SPI) is essential to safeguarding their functionality and interoperability.
1 citations
TL;DR: A fast time-domain simulation technique of plane circuits via two-layer Cellular Neural Network -based modeling, which is necessary for power/signal integrity evaluation in VLSIs, printed circuit boards, and packages is presented.
Abstract: A fast time-domain simulation technique of plane circuits via two-layer Cellular Neural Network (CNN) -based modeling, which is necessary for power/signal integrity evaluation in VLSIs, printed circuit boards, and packages, is presented. Using the new notation expressed by the two-layer CNN, 1,553 times faster simulation is achieved, compared with Berkeley SPICE (ngspice). In CNN community, CNNs are generally simulated by explicit numerical integration such as the forward Euler and Runge-Kutta methods. However, since the two-layer CNN is a stiff circuit, we cannot analyze it by using an explicit numerical integration method. Hence, to analyze the two-layer CNN and reduce the computational cost, the leapfrog method is introduced. This procedure would open an application of CNN to electronic design automation area.
1 citations