Power integrity

About: Power integrity is a research topic. Over the lifetime, 983 publications have been published within this topic receiving 6867 citations.

A time domain approach to power integrity for printed circuit boards

Abstract: Power integrity is becoming increasingly relevant due to increases in device functionality and switching speeds along with reduced operating voltage. Large current spikes at the device terminals result in electromagnetic disturbances which can establish resonant patterns affecting the operation of the whole system. These effects have been examined using a finite difference time domain approach to solve Maxwell?s equations for the PCB power and ground plane configuration. The simulation domain is terminated with a uniaxial perfectly matched layer to prevent unwanted reflections. This approach calculates the field values as a function of position and time and allows the evolution of the field to be visualized. The propagation of a pulse over the ground plane was observed demonstrating the establishment of a complex interference pattern between source and reflected wave fronts and then between multiply reflected wave fronts. This interference which affects the whole ground plane area could adversely affect the operation of any device on the board. These resonant waves persist for a significant time after the initial pulse. Examining the FFT of the ground plane electric field response showed numerous resonant peaks at frequencies consistent with the expected values assuming the PCB can be modelled as a resonant cavity with two electric and four magnetic field boundaries.

PI Timing Measurements in High Speed Flash Memory Embedded Systems

Abstract: This paper presents a case study on how to prevent the power distribution network's performance of a flash memories related to setup and hold times violations. We first review different high-speed factors [1], and point out how data timing can influence power distribution networks (PDNs) at frequencies in the range of megahertz. Experimental results show that even by applying usual PI recommendations could not solve the errors that appear on the supply voltage and in data waveforms, errors that could lead to incorrect values at the output of the NOR flash memory.

Importance of vibration testing for new technological configurations in electronics

Abstract: This paper is related to EURIPIDES project “Board on Board” (BoB) supervised by Thales Communication. The aim of this project is to develop and validate an innovative solution for realization of high-density boards beyond the SMD limits found, remaining reliable and reparable. In more the challenge is to satisfy the customer demand regarding the reliability in harsh environments and in long mission profile. An innovative solution is to have two boards with components only on one face and assembled then in such a way that it is possible to take them apart if repairing is needed. To reach such challenging objective, all the supply chain is needed, from base materials provider up to end-users, including PCB manufacturer and SMD assembler shall be considered. Additional important issues like signal and power integrity, thermal studies or mechanical assembly considerations coupling with design rules will be highly desired. A part of each new construction is also mechanical and thermomechanical reliability. There is the fact that vibrations and shocks cause some tens of percent of the mechanical failures in the airborne electronics [1]. Therefore each new solution for board's design and their arrangement under operation asks for ensuring equipment survival in harsh environment a mechanical testing. Shock and vibration tests are also essential step to the assurance of relevant quality and reliability. There is described an approach to vibration testing of the new designed configuration including vibration simulations through software ANSYS. This results help to designers to choose the optimal configuration including placement of components and to avoid later problems in the application area.

Effect of EBG structure and ferrite film on power/ground layers for performance maintenance and noise suppression in wireless communication

Abstract: Noise suppression and power integrity are two requirements for power/ground layers of printed circuit boards. To accomplish the requirements, we proposed the application of electromagnetic bandgap (EBG) structure and ferrite film to power/ground layers. To evaluate the proposed EBG structure, we have so far measured the electric characteristics of both driving-point impedance and transmission coefficient. Although these evaluation indices are helpful, the evaluation using an actual device is also indispensable. In this paper, we evaluated the suppression of noise propagation through power bus by the proposed EBG structure in wireless communication module. The proposed structure provided sufficient result of the effective maintenance of communication quality by suppressing the propagation of electromagnetic noise.