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Power integrity

About: Power integrity is a research topic. Over the lifetime, 983 publications have been published within this topic receiving 6867 citations.


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Proceedings ArticleDOI
01 Dec 2007
TL;DR: In this paper, a coupled scattering matrix method (SMM) with integral equation (IE) method is presented for signal traces with large number of vertical power/ground vias in electronic package.
Abstract: A novel co-simulation method for signal traces with large number of vertical power/ground vias in electronic package using a coupled scattering matrix method (SMM) with integral equation (IE) method is presented. The SMM for the parallel- plate waveguide modes is developed using the Foldy-Lax equations to analyze the scattering effects between the P/G vias. Two-port admittance (Y) matrix is modeled to represent multiple scattering of the P/G vias with signal vias. The IE method is used to extract equivalent circuit models for coupling between external signal traces and the vertical vias. The extracted model is co-simulated with the Y-matrix for signal response.

1 citations

Proceedings ArticleDOI
01 Dec 2014
TL;DR: In this article, a new PDN design methodology in time domain is proposed, with a newly defined contribution factor (CF) based on known switching current requirements, a sound criterion is derived for effective capacitor selection process.
Abstract: To achieve power integrity (SI) in high-speed electrical systems, power distribution network (PDN) should be well designed to satisfy the current demand of integrated circuits (IC), provided the power supply voltage drop does not exceed the IC specifications. In this paper, we propose a new PDN design methodology in time domain. With a newly-defined contribution factor (CF) based on known switching current requirements, a sound criterion is derived for effective capacitor selection process. With two PDN designs as case studies, the proposed capacitor selection process is validated.

1 citations

Proceedings ArticleDOI
01 Aug 2014
TL;DR: In this article, the authors studied the methodology of power integrity analysis for high speed printed circuit board (PCB) design, which involves the analysis of AC and DC characteristic of the PCB, and also the loop stability of the switch mode voltage source.
Abstract: This paper studies the methodology of power integrity (PI) analysis for high speed printed circuit board (PCB) design. This involves the analysis of AC and DC characteristic of the PCB, and also the loop stability of the switch mode voltage source. Besides this, the best practices of designing a power rail with excellent fidelity are discussed in detail in this paper. The basic theory of operation of the switch mode voltage source and the concept of loop stability are also discussed. The results of simulated PI DC and AC analysis of PCB using Hyperlynx from Mentor Graphic, simulated and measured loop stability and transient response of switch mode voltage source are presented in this paper.

1 citations

Proceedings ArticleDOI
09 Oct 2006
TL;DR: This paper compares two compact 2D FDFD methods using four and six components of electromagnetic fields, which are applied to analyzing transmission lines with open boundaries, and applies them to extraction of circuit parameters for signal integrity analysis of high-speed circuit systems.
Abstract: Compact 2D FDFD (two-dimensional finite- difference frequency-domain) methods were initially proposed by other researchers to solve the propagation constant of shielded uniform guided wave structures. In this paper, firstly we compare two compact 2D FDFD methods using four and six components of electromagnetic fields, which are applied to analyzing transmission lines with open boundaries. Then we extend them to extract the frequency-dependent circuit parameters of transmission lines. These R, L, C, G circuit parameters extracted via 1D transmission line theory are readily to be used for signal integrity analysis of high-speed circuits. I. INTRODUCTION High-speed effects of interconnect structures due to the increase in operating speed and decrease of the feature size in modern VLSI circuits, have to be carefully accounted for accurate signal integrity, power integrity and EMI/EMC analysis of modern circuit systems. The use of transmission line model becomes necessary in order to accurately capture the high-speed effects of interconnects. For the purpose of creating a proper transmission line model, very often the equivalent circuit parameters (R, L, C and G) need to be known in advance (1). This paper will focus on the compact 2D FDFD methods and apply them to extraction of circuit parameters. Characterization of transmission lines has been a topic of interest for many years, especially the analysis of the basic microstrip-like transmission line. Recently the compact two dimensional finite-difference frequency domain (2D FDFD) methods have been studied by several researchers (2-5) to analyze guided wave structures. Apart from its simple formulation, the advantage of 2D FDFD method is that we can obtain all the modes and modal field distribution of a uniform guided wave structure by solving an eigenvalue problem. The compact 2D FDFD method using four (3) and six (2, 5) field components have been proposed. In this paper, we will compare these two compact 2D FDFD methods used for analysis of guided wave structures. Then we will apply them to extract circuit parameters for the purpose of signal integrity analysis of high-speed circuit systems.

1 citations


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Performance
Metrics
No. of papers in the topic in previous years
YearPapers
202312
202267
202139
202045
201965
201852