Power integrity

About: Power integrity is a research topic. Over the lifetime, 983 publications have been published within this topic receiving 6867 citations.

Wideband ssn suppression in high-speed pcb using novel planar ebg

Abstract: Simultaneous switching noise (SSN) is a signiflcant problem in high-speed circuits. To minimize its efiect and improve the electrical characteristics of circuits such as signal integrity (SI) and power integrity (PI), a novel power plane with planar electromagnetic bandgap (EBG) structure is proposed for SSN suppression in printed circuit boards (PCB) in this paper. In which a kind of improved long bridge is used and the equivalent parallel inductance can be increased signiflcantly. Compared to the typical spiral bridge EBG structure with the same parameters, the long bridge EBG structure will change bandgap into dual-band, with lower center frequency and wider bandwith. The efiectiveness and accuracy of this structure are verifled by both simulations and measurements.

Fast and concurrent simulations for SI, PI, and EMI analysis of multilayer printed circuit boards

Abstract: In previous work of the authors, a hybridization of four efficient techniques, namely the physics-based via model, the modal decomposition technique, the contour integral method, and the field equivalence principle, has been proposed for fast and concurrent analysis of signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI) effects on printed circuit boards (PCBs). This paper focuses on the application of the method to simulate multilayer PCBs. An application example is demonstrated and the results with respect to SI, PI and EMI analysis, including S-parameter, field distributions between power planes, as well as radiated power, are discussed. Full-wave simulation results are also provided for comparison and validation. It is shown that the combined method is more than one hundred times faster than general purpose full-wave solvers.

Signal integrity: Efficient, physics-based via modeling: Integration of striplines

Abstract: In the first article of this series, principles and methods of physics-based via modeling were discussed. It was shown how the electromagnetic behavior of vias can be captured by an equivalent circuit based modeling approach that describes all relevant full-wave effects. In this follow-up article, the authors present an approach to integrate striplines into the physics-based via model. The striplines can be located at any layer of the stackup and they may constitute both single and multiconductor transmission lines. The integration of striplines extends the via representation to a full, efficient interconnect model of, for instance, printed circuit board signal links. An intuitive integration approach at a circuit simulator level and application examples are discussed in this article as well.

A novel method for equivalent circuit synthesis from frequency response of multi-port networks

Abstract: Interconnects in electrical/electronic systems are commonly modeled in frequency-domain. However system level electrical analysis involving signal and power integrity simulations are typically done in time-domain, which calls for circuit level representation of the interconnect networks. In this paper, we demonstrate a novel iterative method that approximates a multi-port frequency responses to an equivalent circuit netlist consisting of the basic elements — resistor, capacitor and inductor. Each iteration picks a few consecutive points from the frequency response, identifies a local transfer function matching their response and synthesizes it as a branch in the approximant. A 3-port network comprised of power delivery planes with three vias is synthesized. The equivalent circuit response closely matches the given frequency response, demonstrating the potential of the method for signal/power integrity modeling and simulation of interconnect networks.