Topic
Power integrity
About: Power integrity is a research topic. Over the lifetime, 983 publications have been published within this topic receiving 6867 citations.
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15 Oct 2015
TL;DR: In this paper stochastic approach for Power Integrity, Signal Integrity, EMC and EMI analysis of moving objects is proposed and circuit building blocks including mixers and distributed sensors for harmonic radars are presented.
Abstract: In this paper stochastic approach for Power Integrity, Signal Integrity, EMC and EMI analysis of moving objects is proposed. Circuit building blocks including mixers and distributed sensors for harmonic radars are presented. Dedicated wireless links for energy transfer, designed using Bond-Wire loops with scalable geometric profile and length, are experimentally characterized. Perspectives for multi-Physics Co-Design & Co-Analysis of moving probes for efficiently coupling signal information and material properties are drawn.
7 citations
28 May 2013
TL;DR: In this paper, the authors optimize electrical and thermal performance using genetic algorithm to achieve optimized power map profile for minimizing voltage drop and temperature, which can benefit the thermal and power integrity.
Abstract: Heat dissipation causing temperature increase has posed new challenges for design of 3D integrated circuits (IC). In addition to the thermal problem, 3D ICs also require careful design of power grids/network because many inter-tier resistive through-silicon vias (TSV) in 3D IC can cause larger voltage drop than 2D ICs. The performance optimization of a 3D stack requires validation of thermal and electrical integrity in a co-design. In this paper, we perform steady-state electrical and thermal simulations to analyze the properties of a 3D stack. We optimize electrical and thermal performance using genetic algorithm to achieve optimized power map profile for minimizing voltage drop and temperature, which can benefit the thermal and power integrity.
7 citations
26 Mar 2018
TL;DR: Two efforts to make computational electromagnetic algorithms compatible to machine learning methods are introduced: solving method of moments (MoM) can be seen as a training training process, and the artificial neural network could be used to solve MoM naturally through training.
Abstract: While machine learning is becoming a demanding request in every corner of modern technology development, we are trying to see if we could make computational electromagnetic algorithms compatible to machine learning methods. In this paper, we introduce two efforts in line with this direction: solving method of moments (MoM) can be seen as a training training process. Consequently, the artificial neural network (ANN) could be used to solve MoM naturally through training. Amazon Web Service (AWS) can be used as the computations platform to utilize the existing hardware and software resources for machine learning. Another effort regarding to the nonlinear IO of ICs can be modeled through ANN. Hence, a behavior model with growing accuracy can be obtained for the signal integrity and power integrity analysis. It can be further hybridized into discontinuous Galerkin time domain (DGTD) method for CEM characterizations. Benchmarks are provided to demonstrate the feasibility of the proposed methods.
7 citations
25 Jul 2010
TL;DR: In this article, the impact of return path discontinuities on both signal and power integrity of high speed interconnects is investigated and a test board is built for the purpose and four different configurations are analyzed and correlation between measurements and simulations (coming from a full wave 3D EM field simulator) results is also presented.
Abstract: This paper investigates the impact of return path discontinuities on both signal and power integrity of high speed interconnects. A test board is built for the purpose and 4 different configurations are analyzed and correlation between measurements and simulations (coming from a full wave 3D EM field simulator) results is also presented. Both time and frequency domain results are analyzed and design guidelines are provided. It is observed that return path discontinuities have a sensible impact on ground bounce in single-ended signals; however the differential signaling can drastically reduces it. Discontinuities from gaps in return paths (e.g. plane splits) and connectors impact the differential signals on both insertion loss and cross talk. The real value of return/grounding vias is to reduce the common signal noise.
7 citations
TL;DR: The proposed modeling approach extends the state-of-the-art methods that are currently available, yielding to a modular and scalable tool for model generation, possibly exhibiting a rich dynamical behavior due to large supply fluctuations or internal voltage regulators.
Abstract: This paper addresses the generation of accurate and efficient macromodels of high-speed input/output buffers. The proposed modeling approach extends the state-of-the-art methods that are currently available, yielding to a modular and scalable tool for model generation. The modeling procedure applies to both single-ended and differential devices, possibly exhibiting a rich dynamical behavior due to large supply fluctuations or internal voltage regulators. The models are defined by the combination of static surfaces described via compact tensor approximations and linear dynamical state-space relations generated using a robust time-domain vector fitting algorithm. A simple and effective solution is adopted to account for the overclocking operation of output buffer models as well. The feasibility and strength of the proposed method are demonstrated using real devices and complex application test cases for signal and power integrity cosimulations.
7 citations