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Showing papers on "Power module published in 2000"


Journal ArticleDOI
01 Sep 2000
TL;DR: There has been considerable interest in the development and applications of active filters because of the increasing concern over power quality, at both distribution and consumer levels, and the need to control reactive power and voltage stability at transmission levels as mentioned in this paper.
Abstract: There has been considerable interest in the development and applications of active filters because of the increasing concern over power quality, at both distribution and consumer levels, and the need to control reactive power and voltage stability at transmission levels. The existing approaches are classified and assessed to provide a framework of references for both researchers in this field and for generators, suppliers and consumers of electrical power who are, or may be, concerned about the problems associated with power quality and are considering installing active filters for their particular sets of problems.

668 citations


BookDOI
28 Sep 2000
TL;DR: In this article, the authors present a power system analysis and simulation based on transformer transformers, power system operation/control, and power system safety and reliability. But they do not discuss power system performance.
Abstract: Electric Power. Electric Power Utilization. Transformers. Transmission Systems. Substations. Distribution Systems. Electric Power Utilization. Power System Analysis and Simulation. Power System Protection. Power System Transients. Power System Dynamics/Stability. Power System Operation/Control. Power System Planning (Reliability). Power Electronics. Power Quality.

308 citations


Proceedings ArticleDOI
06 Feb 2000
TL;DR: The main electrical bus of the future will be 42 V, and it will be buffered by a 36 V battery as mentioned in this paper, which is the result of increasingly sophisticated engine and body controls, as well as the introduction of new, electrically controlled functions.
Abstract: The automobile is undergoing a revolution in the design of its electrical system. This is the result of increasingly sophisticated engine and body controls, as well as the introduction of new, electrically controlled functions. The main electrical bus of the future will be 42 V, and it will be buffered by a 36 V battery. As many devices and electronic control units require voltages different from 42, conversion from the 42 V bus to these other voltages will be necessary. Some anticipated features, such as electromechanical engine valves, will demand both conversion and sophisticated control at power levels in the 2 kW to 10 kW range. These, and other developments in automotive engineering, are promising to create a vital and challenging new market for power electronics in the next decade.

170 citations


Proceedings ArticleDOI
21 May 2000
TL;DR: An electrical model for data buses designed with submicron technologies is presented and a family of coding techniques is proposed that can reduce the average power consumption of the bus by 40%.
Abstract: The power dissipation associated with driving data buses can be significant, especially considering the increasing component of inter-wire capacitance. Previous work on bus encoding has focused on minimizing transitions to reduce power dissipation. In this paper, it is shown that transition reduction is not necessarily the best approach for reducing power when the effects of inter-wire capacitance are considered. An electrical model for data buses designed with submicron technologies is presented and a family of coding techniques is proposed that can reduce the average power consumption of the bus by 40%.

147 citations


Patent
29 Feb 2000
TL;DR: In this article, a cost efficient electronic power supply system that handles a range of supported electronic circuits is presented, where a controller confirms electronic circuit presence and queries for electronic circuit power on requirements.
Abstract: A system and method for developing a cost efficient electronic power supply system that handles a range of supported electronic circuits is provided. The electronic power supply system adaptively configures the power applied to electronic circuits. Thereby, eliminating redesign of a power supply system when a newly developed or different electronic circuit is implemented. When an electronic circuit is attached to the electronic power supply, a controller confirms electronic circuit presence and queries for electronic circuit power on requirements. As more electronic circuits are added, the controller examines each electronic circuit power on requirements and determines if a power conflict is present. If a conflict exists, the controller will not supply power to the electronic circuits until the conflict is resolved. If a conflict does not exist, the controller powers up the present electronic circuits according to desired power on requirements by broadcasting commands to power supplies, some of which are programmable.

140 citations


Proceedings ArticleDOI
15 Sep 2000
TL;DR: A low-cost receiver for a commercial PLCC system is described and demonstrated, demonstrating the feasibility of PLCC-based islanding prevention and considerations for maximum anti-islanding effectiveness.
Abstract: Islanding of grid-connected photovoltaic (PV) power systems jeopardizes personnel and equipment and must therefore be prevented. Existing islanding prevention schemes are undesirable because they fail for certain relatively common customer loads and when more than one PV power system is present, degrade PV power quality, reduce system efficiency, and increase system complexity. These problems can be overcome using power line carrier communications. (PLCC) and an inexpensive, purpose-designed receiver. The use of PLCC for islanding prevention is discussed. In this paper, including considerations for maximum anti-islanding effectiveness. Also, a low-cost receiver for a commercial PLCC system is described and demonstrated. This receiver demonstrates the feasibility of PLCC-based islanding prevention.

136 citations


Proceedings ArticleDOI
23 Jan 2000
TL;DR: In this paper, an overview of methods used in the mitigation of voltage sags is given, and different solutions for improving the performance of the power system, as well as the immunity of the equipment, are described.
Abstract: This paper gives an overview of methods used in the mitigation of voltage sags. Different solutions for improving the performance of the power system, as well as the immunity of the equipment, are described. Finally, mitigation devices to be installed at the system-load interface for power quality enhancement are presented.

111 citations


Patent
27 Jan 2000
TL;DR: In this paper, a power source is provided with a holder-case housing a plurality of slender power modules, and an airduct is formed in the holder case and intermediate air-inlets are opened in a central portion of the air-duct.
Abstract: A power source is provided with a holder-case housing a plurality of slender power modules. Cooling-air passes through on the surfaces of power modules by passing air through the holder-case. An air-duct is formed in the holder-case and intermediate air-inlets are opened in a central portion of the air-duct. A plurality of rows of power modules housed in the holder-case are cooled by the air inhaled from the intermediate air-inlets.

103 citations


Journal ArticleDOI
TL;DR: In this article, the authors investigate the performance of microwave power amplifiers fabricated from wide bandgap semiconductor transistors and demonstrate that microwave power amplifier fabricated from 4H-SiC and AlGaN/GaN transistors offer superior RF power performance, particularly at elevated temperatures.
Abstract: Explores the RF power performance of microwave amplifiers fabricated from wide bandgap semiconductor transistors and demonstrates that microwave power amplifiers fabricated from 4H-SiC and AlGaN/GaN transistors offer superior RF power performance, particularly at elevated temperatures. Theoretical models predict room temperature RF output power on the order of 4-6 W/mm and 10-12 W/mm, with power-added efficiency (PAE) approaching the ideal values for class A and B operation, available from 4H-SiC MESFETs and AlGaN/GaN HFETs, respectively. All calculations were thoroughly calibrated against dc and RF experimental data. The simulations indicate operation at elevated temperature at least up to 5000/spl deg/C is possible. The RF output power capability of these devices compares very favorably with the 1 W/mm available from GaAs MESFETs. The wide bandgap semiconductor devices will find application in power amplifiers for base station transmitters for wireless telephone systems, HDTV transmitters, power modules for phased-array radars, and other applications. The devices are particularly attractive for applications that require operation at elevated temperature.

100 citations


Journal ArticleDOI
TL;DR: In this article, the early history of power electronics is traced from magnetic amplifiers, thyratrons, and ignitrons to power semiconductors, and the characteristic attributes of such power electronics equipment are high power capability, controllability and static switching to meet the goals of high efficiency and high dependability.
Abstract: Distinctive attributes of power electronics equipment are high power capability, controllability and static switching to meet the goals of high efficiency and high dependability. Aspects of the early history of power electronics are traced from magnetic amplifiers, thyratrons, and ignitrons to power semiconductors.

100 citations


Patent
03 Aug 2000
TL;DR: In this paper, a power controller for controlling an engine-driven generator includes a high voltage DC bus interconnecting various power modules, which cooperate in various combinations to provide a wide variety of power transfer functions.
Abstract: A power controller for controlling an engine-driven generator includes a high voltage DC bus interconnecting various power modules. In electrical communication with the DC bus are: a bi-directional DC-DC converter constructed to transfer electrical power from the DC bus to a battery to charge the battery, and from the battery to the DC bus; a rectifier constructed to rectify electrical power from the generator and to supply the rectified power to the DC bus; an invester constructed to convert DC bus electrical power to AC electrical power and to supply the AC power to an output connector; and an AC-DC constructed to convert AC electrical power, supplied via an input connector, to DC bus electrical power. The controller may be employed in a power supply on a mobile vehicle or boat, for example. The power modules of the controller cooperate in various combinations to provide a wide variety of power transfer functions.

Proceedings ArticleDOI
08 Oct 2000
TL;DR: In this article, the authors describe how to estimate power losses from simulation using ideal switches combined with measured power loss data, where the semiconductor behavior is put into a look-up table to replace the advanced semiconductor models and shortens the simulation time.
Abstract: Ideally, converter losses should be determined without using an excessive amount of simulation time. State-of-the-art power semiconductor models provide good accuracy; unfortunately they often require a very long simulation time. This paper describes how to estimate power losses from simulation using ideal switches combined with measured power loss data. The semiconductor behavior is put into a look-up table, which replaces the advanced semiconductor models and shortens the simulation time. To extract switching and conduction losses, converter is simulated and the semiconductor power losses are estimated. Measurement results on a laboratory converter are compared with the estimated losses and a good agreement is shown. Using the ideal switch simulation and the post processing power estimation program, a ten to twenty fold increase in simulation speed is obtained, compared to simulations using advanced models of semiconductors.

Proceedings ArticleDOI
08 Oct 2000
TL;DR: In this article, the authors presented the theory, characterisation and experimental validation of an accurate electric double-layer supercapacitor model based on the physics of phenomena governing charges storage, which theoretically leads to a transmission line with voltage dependant distributed capacitance.
Abstract: Recent developments in the field of supercapacitors have led to the achievement of high specific energy and high specific power devices. Due to capacitances of several hundred farads and serial resistances of less than one milliohm, these new components are suitable for energy storage in high power electronic applications, especially in the field of management of embarked electrical power (hybrid power sources, energy recovery). This paper presents the theory, characterisation and experimental validation of an accurate electric double-layer supercapacitor model based on the physics of phenomena governing charges storage, which theoretically leads to a transmission line with voltage dependant distributed capacitance.

Patent
02 Mar 2000
TL;DR: In this paper, the design and fabrication of a highly integrated, intelligent integral horsepower, three-phase induction motor drive is based on multichip module (MCM) technology.
Abstract: The design and fabrication of a highly integrated, intelligent integral horsepower, three-phase induction motor drive is based on multichip module (MCM) technology. A conventional three-phase induction motor is transformed into a stand-alone variable-speed drive by way of MCM technology. This solid-state controller-known as a multichip power module (MCPM)-uses known good die (KGD) to obtain minimal footprint, volume, and mass, while maximizing efficiency, reliability, and manufacturability. This is done by integrating the low-power control and high-power sections onto a single substrate. In accordance with one embodiment of the present invention, an integrated circuit assembly formed on a single substrate is capable of transforming and controlling AC power input to DC power output responsive to input signals. In accordance with another embodiment, an integrated circuit assembly on a single substrate is capable of receiving direct current power and controlling it and transforming it to alternating current power in single phase or multiphase form having variable magnitude and/or variable frequency. In accordance with a further embodiment, an integrated circuit assembly on a single substrate is capable of receiving alternating current power and controlling it and transforming it to alternating current power in single phase or multiphase form having variable magnitude and/or variable frequency.

01 Jan 2000
TL;DR: A vibration-induced power generator with total volume of -1 cm3 that uses laser-micromachined springs as resonating structures to create a minimally sized electric power generator capable of producing enough voltage to drive low-power IC circuit systems or micro sensors for robotic and automation applications where mechanical vibrations are present.
Abstract: This paper presents the design, analysis, and experimental results of a vibration-induced power generator with total volume of -1 cm3 that uses laser-micromachined springs as resonating structures. The goal of our research is to create a minimally sized electric power generator capable of producing enough voltage to drive low-power IC circuit systems or micro sensors for robotic and automation applications where mechanical vibrations are present. Potential applications for the generator may also include mobile phone and heart-pacers where human motions can be used as a source of mechanical energy. Thus far, we have produced a generator capable of producing 2V DC with 64Hz input frequency with <200pm input vibration amplitude.

Patent
29 Mar 2000
TL;DR: An electrical cabinet or chassis for an uninterruptible power system (UPS system) includes universal bays or slots that can receive either power modules or battery backs as discussed by the authors, and the back plane of the slot has separate connector terminals for battery packs and power modules.
Abstract: An electrical cabinet or chassis for an uninterruptible power system (UPS system) includes universal bays or slots that can receive either power modules or battery backs. The back plane of the slot has separate connector terminals for battery packs and power modules. The slots may also receive battery chargers if so desired. All of the slots of a chassis can be utilized to full capacity before another cabinet needs to be employed. The cabinet is also readily adaptable and can be easily reconfigured as desired without particular concern as to the number of power modules or battery packs that are being used. Sensors are provided which indicate the capacity of the cabinet that has been used (e.g. the number of slots still open and not used by a power module or a battery pack). The sensors also indicate whether a battery pack, power module or other device is inserted into the slot, and whether it is properly inserted, thereby providing an indication of the specifications of the UPS system as presently configured to the user.

Journal ArticleDOI
TL;DR: The concept of Integrated Power Modules (IPMs) was introduced in this article, in which the electronic control circuitry and the high power electronics of the converter are integrated into a single compact standardized module.

Patent
08 Dec 2000
TL;DR: In this article, a power manager with a network agent in communication over a network with an network manager is connected to control several intelligent power modules each able to independently control the power on/off status of several network appliances.
Abstract: A network comprises a power manager with a network agent in communication over a network with an network manager. The power manager is connected to control several intelligent power modules each able to independently control the power on/off status of several network appliances. Power-on and load sensors within each intelligent power module are able to report the power status of each network appliance to the network manager with variables in response to commands. Each intelligent power module is equipped with an output that is connected to cause an interrupt signal to the network appliance being controlled. The network manager is able to test which network appliance is actually responding before any cycling of the power to the corresponding appliance is tried.

Patent
24 Jan 2000
TL;DR: In this paper, a controller for an electric motor, which self-contains a current control system, is mounted in a power module to be hermetically encapsulated without being exposed to the external ambient atmosphere.
Abstract: In a controller, for use in an electric motor, which self-contains a current control system, a conducting portion of a feedback element from a current detector up to a summing point, and a conducting portion of a forward element from the summing point for the current control up to a gate terminal of each of switching devices are mounted in a power module to be hermetically encapsulated without being exposed to the external ambient atmosphere The distributed processing is executed in the two portions, ie, a current control loop, and a position control unit, a velocity control unit and an interface processing unit other than the current control loop Therefore, the current control loop including the current feedback portion is constituted by another sub-microprocessor to be mounted together with the associated devices in a power module which is molded with resin such as epoxy resin

Proceedings ArticleDOI
06 Feb 2000
TL;DR: In this article, the use of flip-chip technology, widely used in IC packaging, for the fabrication of three-dimensional packaged integrated power electronics modules (IPEMs) was presented.
Abstract: We present the use of flip-chip technology, widely used in IC packaging, for the fabrication of three-dimensional packaged integrated power electronics modules (IPEMs). In the flip-chip IPEM (FC-IPEM), power devices are bonded to the flexible substrate with circuit pattern for gate-drive components using triple-stacked solder bumps. The devices are encapsulated using underfill polymer materials to distribute thermomechanical stresses caused by mismatching coefficients of thermal expansion (CTEs) among the silicon chips and substrates. The power semiconductor dies are attached to direct-bond copper (DEC) substrate. The feasibility of this approach was demonstrated by constructing modules consisting of two IGBTs, two diodes, and simple gate driver and control circuit. The FC-IPEM was successfully tested at power levels up to 10 kW. The electrical test result shows that this three-dimensional area bond packaging structure has much lower parasitics than a commercial wire-bond module. Issues relating to materials and process design and selection for the construction of the packaged power module are presented along with some electrical and reliability test results and discussions.

Proceedings ArticleDOI
23 Jun 2000
TL;DR: In this article, the authors developed a scheme to control a parallel connected, multiterminal DC power distribution system without the need of central control unit for fast communication, which utilizes superconductors on the DC bus and incorporates UPS properties with the ability to supply large passive loads than conventional UPSs.
Abstract: This paper develops a scheme to control a parallel connected, multiterminal DC power distribution system without the need of central control unit for fast communication. The described scheme utilizes superconductors on the DC bus and incorporates UPS properties with the ability to supply large passive loads than conventional UPSs. A five terminal, mesh connected study system is used to demonstrate the basic characteristics of DC power distribution system such as the ability to ride through an AC system outage. In this paper, a simulation model of the study system is developed and the simulation results show that the proposed DC power distribution system has a high power quality performance.

Patent
15 Aug 2000
TL;DR: In this article, a power supply apparatus having an AC power supply, a transformer, a switching element and a control circuit for controlling an operation of the switching element is presented, where an electrical current is supplied to the primary side of the transformer intermittently when a main unit of an electrical appliance to which the power supply is applied is in a standby mode so that unnecessary power consumption is reduced.
Abstract: A power supply apparatus having an AC power supply, a transformer, a switching element and a control circuit for controlling an operation of the switching element: where an electrical current is supplied to the primary side of the transformer intermittently when a main unit of an electrical appliance to which the power supply apparatus is applied is in a standby mode so that unnecessary power consumption is reduced. Further, a capacitance is provided between the AC power supply and the control circuit instead of the conventional initializing resistance and the control circuit is driven using an electrical current going through a reactance component of the capacitor, so that the energy loss is not caused any more by the initializing resistance.

Journal ArticleDOI
Tien-Yu Lee1
TL;DR: In this paper, the authors presented a novel approach to optimize pin array design of an integrated, liquid-cooled, insulated gate bipolar transistor (IGBT) power module with the aid of a computational fluid dynamics (CFD) code.
Abstract: This paper presents a novel approach to optimize pin array design of an integrated, liquid-cooled, insulated gate bipolar transistor (IGBT) power module. With the aid of a computational fluid dynamics (CFD) code, the fluid field and heat transfer inside the module were analyzed, and several design options on pin arrays were examined. For IGBT die circuitry, the uniformity of temperature distribution among dies is as critical as the magnitude of the die temperature. A noticeable variation in temperature among dies can accelerate the thermal runaway and reduce the reliability of the devices. With geometrically-optimized-pin designs located both upstream and downstream of the channel, a total power dissipation of 1200 W was achieved. The maximum junction temperature was maintained at 100/spl deg/C and the maximum variation among dies was controlled within 1/spl deg/C. The results from this study indicated that the device junction temperatures were not only reduced in magnitude but were equalized as well. In addition, the maximum power dissipation of the module was enhanced. Comparison with other direct- (pool boiling) and indirect- (cold plate) liquid cooling techniques was also discussed.

Patent
18 Feb 2000
TL;DR: A modular power distribution system includes a three level approach to power distribution: a power module level, a transfer module level and a distribution module level At each level, the number of modules used can be varied based on the power requirements of the site as discussed by the authors.
Abstract: A modular power distribution system includes a three level approach to power distribution: a power module level, a transfer module level, and a distribution module level At each level, the number of modules used can be varied based on the power requirements of the site The power modules receive power from either a main, off-site generator (such as from an electric utility), or from an in-module backup generator Additionally, the power, transfer, and distribution modules at each of the levels are arranged in a redundant topology, so that if any of the modules should fail, the remaining modules seamlessly assume the functions of the failing module

Patent
14 Dec 2000
TL;DR: In this article, the authors present means and methods for power sharing for a lower voltage programmable means for operating a switch which operates at a substantially higher voltage, where power is stored by capacitance or in rechargeable batteries.
Abstract: The present invention comprises means and methods for power sharing for a lower voltage programmable means for operating a switch which operates at a substantially higher voltage. The present invention is preferably applied to two power line thermostat control of HVAC equipment. Although a programmable thermostat is described in the specific description of the invention as the programmable means, it is intended that the present invention be applicable to other such devices where power is stored by capacitance or in rechargeable batteries for use by lower voltage programmable means while at the same time permitting sufficient current flow through a substantially higher power switch to operate directly or indirectly electrical power equipment.

Patent
13 Sep 2000
TL;DR: In this article, an hourglass shaped stacked solder bumps are used to reduce resistance and parasitic inductance resulting from interconnection of semiconductor chips in power modules, which completely avoids use of wire bonds through use of ball bonding and flip-chip manufacturing processes.
Abstract: Resistance and parasitic inductance resulting from interconnection of semiconductor chips in power modules are reduced to negligible levels by a robust structure which completely avoids use of wire bonds through use of ball bonding and flip-chip manufacturing processes, possibly in combination with chip scale packaging and hourglass shaped stacked solder bumps of increased compliance and controlled height/shape. Turn-off voltage overshoot is reduced to about one-half or less than a comparable wire bond packaged power module. Hourglass shaped solder bumps provide increased compliance and reliability over much increased numbers of thermal cycles over wide temperature excursions.

Patent
Daniel J. Powers1
05 Jul 2000
TL;DR: In this article, the authors describe a power management system that selectively routes power provided by one or more installed power modules to the device components and, preferably, to other power module receptacles.
Abstract: A device such as an electrotherapy device implementing the invention includes multiple power module receptacles each of which is configured to received at least one type of power module, and a power management system that selectively routes power provided by one or more installed power modules to the device components and, preferably, to other power module receptacles. The types of power modules that operate in the power module receptacles include, for example, rechargeable battery packs, non-rechargeable battery packs and AC power packs. Preferably these power modules are each fully integrated, functionally self-contained power modules. For example, the rechargeable battery pack includes a charge controller specifically designed to charge the battery pack in which it is implemented.

Patent
Michael T. Zhang1
16 Aug 2000
TL;DR: In this article, a power supply for a computer is described, which is capable of providing power in both a DC domain and a high frequency AC domain, and a first power consuming component can be coupled to the power supply to receive power in the DC domain.
Abstract: A power supply for a computer is disclosed. The power supply is capable of providing power in both a DC domain and a high frequency AC domain. A first power consuming component can be coupled to the power supply to receive power in the DC domain, and a second power consuming component can be coupled to the power supply to receive power in the high frequency AC domain.

Patent
23 Mar 2000
TL;DR: In this article, a power electronics device for controlling an electric machine including a power section arranged within a housing which can be closed via a cover element, and a control device is provided for controlling the power electronics devices.
Abstract: A power electronics device for controlling an electric machine including a power section arranged within a housing which can be closed via a cover element. The power section has a plurality of capacitors and a plurality of power semiconductors which are connected to a power bus bar. In addition, a control device is provided for controlling the power electronics device. The capacitors, power semiconductors, and control device are cooled via a cooling device which is formed as a profile having an essentially U-shaped cross section. The cooling device has two lateral limbs and a base region through which cooling ducts are arranged. A suitable cooling medium flows through the cooling ducts and the ends of the cooling ducts opposite the housing cover are closed by a covering element. The capacitors, the power semiconductors and the control device are connected to the cooling device such that thermal exchange occurs between these components and the cooling device.

Patent
27 Jan 2000
TL;DR: In this paper, a photovoltaic power generation system is constructed such that the plurality of power converters do not simultaneously suspend operation when an abnormal state is detected, in order to prevent generation of an electrical stress or reduction of the power generation amount caused by simultaneous operation suspension or repeated operation suspension and operation resume.
Abstract: A photovoltaic power generation apparatus having a plurality of power converters, respectively connected to a plurality of solar battery arrays, for converting direct-current power generated by the solar battery arrays to alternating-current power so as to provide the alternating-current power to a commercial power system. The photovoltaic power generation apparatus is so constructed that the plurality of power converters do not simultaneously suspend operation when an abnormal state is detected, in order to prevent generation of an electrical stress or reduction of the power generation amount caused by simultaneous operation suspension of the power converters or repeated operation suspension and operation resume. When the power generation amount of each solar battery array is different, a power converter connected to the solar battery array of the smallest power generation amount is set in the first-to-suspend condition.