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PowerPC

About: PowerPC is a research topic. Over the lifetime, 1184 publications have been published within this topic receiving 22297 citations. The topic is also known as: ppc.


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Proceedings ArticleDOI
22 Sep 2002
TL;DR: Novel single-chip system architecture options, based on the Xilinx Virtex-II Pro part, which includes up to four PowerPC cores and was launched in Spring 2002 are considered, to carry out more frequent, and less control intensive, functions in logic, and other functions in the processor.
Abstract: This paper concerns novel single-chip system architecture options, based on the Xilinx Virtex-II Pro part, which includes up to four PowerPC cores and was launched in Spring 2002. The research described here was carried out pre-launch (i.e., prior to availability of real parts), so the paper focuses on initial architectural experiments based on simulation. The application is a Mixed-version IP Router, named MIR, servicing gigabit ethernet ports. This would be of use to organizations with several gigabit ethernets, with a mixture of IPv4 and IPv6 hosts and routers attached directly to the networks. A particular benefit of a programmable approach based on Virtex-II Pro is that the router's functions can evolve smoothly, maintaining router performance as the organization migrates from IPv4 to IPv6 internally, and also as the Internet migrates externally. The basic aim is to carry out more frequent, and less control intensive, functions in logic, and other functions in the processor. Two prototypes are described here. Both support four ethernet ports, but the designs are scalable upwards. The second one, the more ambitious of the two, instantiates a configuration appropriate when the bulk of the incoming packets are IPv4. Such packets are processed and switched entirely by logic, with no internal copying of packets between buffers and virtually no delay between packet receipt and onward forwarding. This involves a specially-tailored internal interconnection network between the four ports, and also processing performed in parallel with packet receipt, i.e. multi-threading in logic. IPv6 packets, or some rare IPv4 cases, are passed to a PowerPC core for processing. In essence, the PowerPC acts as a slave to the logic, rather than the more common opposite master-slave relationship.

31 citations

Proceedings ArticleDOI
14 Apr 1999
TL;DR: New algorithms based on power series approximations were developed which provide significantly better performance than the Newton-Raphson algorithm for this processor and reduce the divide latency and square root latency.
Abstract: The Power3 processor is a 64-bit implementation of the PowerPC/sup TM/ architecture and is the successor to the Power2/sup TM/ processor for workstations and servers which require high performance floating point capability. The previous processors used Newton-Raphson algorithms for their implementations of divide and square root. The Power3 processor has a longer pipeline latency, which would substantially increase the latency for these instructions. Instead, new algorithms based on power series approximations were developed which provide significantly better performance than the Newton-Raphson algorithm for this processor. This paper describes the algorithms, and then shows how both the series based algorithms and the Newton-Raphson algorithms are affected by pipeline length. For the Power3, the power series algorithms reduce the divide latency by over 20% and the square root latency by 35%.

31 citations

Proceedings ArticleDOI
03 Dec 2011
TL;DR: A self-checking method that accelerates silicon validation and significantly increases the number of applied random tests to improve bug detection efficiency and reduce time-to-market.
Abstract: Microprocessor design validation is a time consuming and costly task that tends to be a bottleneck in the release of new architectures. The validation step that detects the vast majority of design bugs is the one that stresses the silicon prototypes by applying huge numbers of random tests. Despite its bug detection capability, this step is constrained by extreme computing needs for random tests simulation to extract the bug-free memory image for comparison with the actual silicon image. We propose a self-checking method that accelerates silicon validation and significantly increases the number of applied random tests to improve bug detection efficiency and reduce time-to-market. Analysis of four major ISAs (ARM, MIPS, PowerPC, and x86) reveals their inherent diversity: more than three quarters of the instructions can be replaced with equivalent instructions. We exploit this property in post-silicon validation and propose a methodology for the generation of random tests that detect bugs by comparing results of equivalent instructions. We support our bug detection method in hardware with a light-weight mechanism which, in case of a mismatch, replays the random test replacing the offending instruction with its equivalent. Our bug detection method and corresponding hardware significantly accelerate the post-silicon validation process. Evaluation of the method on an x86 microprocessor model demonstrates its efficiency over simulation-based and self-checking alternatives, in terms of bug detection capabilities and validation time speedup.

30 citations

Proceedings ArticleDOI
04 May 2005
TL;DR: The BlueGene/L supercomputer as mentioned in this paper has been designed with a focus on power/performance efficiency to achieve high application performance under the thermal constraints of common data centers, and emphasis was put on system solutions to engineer a power-efficient system.
Abstract: The BlueGene/L supercomputer has been designed with a focus on power/performance efficiency to achieve high application performance under the thermal constraints of common data centers. To achieve this goal, emphasis was put on system solutions to engineer a power-efficient system. To exploit thread level parallelism, the BlueGene/L system can scale to 64 racks with a total of 65536 computer nodes consisting of a single compute ASIC integrating all system functions with two industry-standard PowerPC microprocessor cores in a chip multiprocessor configuration. Each PowerPC processor exploits data-level parallelism with a high-performance SIMD oating point unitTo support good application scaling on such a massive system, special emphasis was put on efficient communication primitives by including five highly optimized communification networks. After an initial introduction of the Blue-Gene/L system architecture, we analyze power/performance efficiency for the BlueGene system using performance and power characteristics for the overall system performance (as exemplified by peak performance numbers.To understand application scaling behavior, and its impact on performance and power/performance efficiency, we analyze the NAMD molecular dynamics package using the ApoA1 benchmark. We find that even for strong scaling problems, BlueGene/L systems can deliver superior performance scaling and deliver significant power/performance efficiency. Application benchmark power/performance scaling for the voltage-invariant energy delay 2 power/performance metric demonstrates that choosing a power-efficient 700MHz embedded PowerPC processor core and relying on application parallelism was the right decision to build a powerful, and power/performance efficient system

30 citations

Proceedings ArticleDOI
G.B. Kromann1, D. Gerke1, W. Huang1
21 May 1995
TL;DR: In this article, the authors introduce the C4/CBGA interconnect technology and address the following: (1) the PCB land definition and board preparation requirements, (2) the ball-grid-array to board assembly methods, (3) the electrical design considerations, (4) the heat transfer mechanism and thermal control options, and (5) the CBGA-to-PCB testing and reliability.
Abstract: The Motorola PowerPC 603 and PowerPC 604 microprocessors are available in the 21 mm controlled-collapsed-chip-connection/ceramic-ball-grid-array single-chip package (C4/CBGA). This paper will introduce the C4/CBGA interconnect technology and address the following: (1) the PCB land definition and board preparation requirements, (2) the ball-grid-array to board assembly methods, (3) the electrical design considerations, (4) the heat transfer mechanism and thermal control options, and (5) the CBGA-to-PCB testing and reliability.

30 citations


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Performance
Metrics
No. of papers in the topic in previous years
YearPapers
20232
20226
20215
20208
201916
201823