Showing papers on "Process corners published in 1981"
TL;DR: In this paper, the existence of hot spots in full-wafer technology was examined and a possible cause of difficulty in utilizing spiral programmed interconnection in full wafer technology is examined.
Abstract: A possible cause of difficulty in utilizing spiral programmed interconnection in full wafer technology is examined. This is the existence of hot spots. It is shown that hot spots are likely to occur and, in which case, to impair seriously the wafer performance. Means of avoiding such degradation are indicated.
1 citations