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Process variable

About: Process variable is a research topic. Over the lifetime, 3983 publications have been published within this topic receiving 43130 citations. The topic is also known as: process parameter.


Papers
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Journal ArticleDOI
TL;DR: In this paper, the effect of process parameters on machinability performance characteristics and there by optimization of the turning of Titanium (Grade 5) based on Taguchi method was investigated and the degree of influence of each process parameter on individual performance was analyzed from the experimental results obtained using Taguchi Method.

23 citations

Journal ArticleDOI
TL;DR: In this paper, an attempt has been made to optimize the parameters of activated tungsten inert gas (A-TIG) welding of sintered hot-forged AISI 4135 steel produced through the powder metallurgy route.
Abstract: Weld quality is a very important working aspect of the manufacturing and construction industries In this research work, an attempt has been made to optimize the parameters of activated tungsten inert gas (A-TIG) welding of sintered hot-forged AISI 4135 steel produced through the powder metallurgy route Experiments were performed based on Taguchi L9 orthogonal array Response surface methodology was used to create regression equations, and process parameters were optimized using genetic algorithm (GA) and simulated annealing (SA) Process parameter optimization is multi-input to single output (tensile strength), in which the quality of output depends upon input parameters like current, voltage, welding speed, and gas flow rate The present study was conducted to maximize the output of the A-TIG welding of sintered hot-forged AISI 4135 steel and fix the input parameters The results indicate that the voltage and current have a maximum influence on tensile strength in A-TIG-welded joint Confirmation experiments have also been conducted to validate the optimized parameters

23 citations

Patent
20 Jul 2011
TL;DR: In this paper, a five-axis side milling machining process parameter design method, belongs to the technology of numerical control machining, and solves the problem that real machining conditions cannot be reflected in cutting force calculation in the conventional process parameters design method.
Abstract: The invention discloses a five-axis side milling machining process parameter design method, belongs to the technology of numerical control (NC) machining, and solves the problem that real machining conditions cannot be reflected in cutting force calculation in the conventional process parameter design method. The method comprises the following steps of: tool path planning, cutting force calculation and process parameter optimization; in the tool path planning step, an NC code is generated by using computer-aided manufacturing (CAM) software; in the cutting force calculation step, first, a continuous tool path is generated from the NC code; then, a cutting thickness is obtained; and finally, the cutting force is calculated according to the cutting thickness; and in the process parameter optimization step, whether the calculated cutting force is not greater than a design threshold is judged; if the calculated cutting force is not greater than the design threshold, the NC code, the cutting depth and a feed rate are taken as input parameters; and otherwise, an NC code is regenerated. In the method, the real machining conditions are reflected by utilizing a tool enveloping surface analytical expression and the obtained transient cutting thickness is more accurate, so that the accuracy of the calculation of the cutting thickness and the cutting force is improved, and reliable assurance is provided for precisely and efficiently machining a spatial curved surface.

22 citations

Proceedings ArticleDOI
23 Jun 2000
TL;DR: In this article, the shrinkage performance of the RELACS TM process largely depends on the resist chemistry used as the underlying layer of the photogenerated acid and its acidity.
Abstract: Mitsubishi Electric Corporation (MELCO) has developed an advanced microlithographic process for producing 0.1 micrometer contact holes (CH). A chemical shrink technology, RELACS TM (Resolution Enhancement Lithography Assisted by Chemical Shrink), utilizes the crosslinking reaction catalyzed by the acid component existing in a predefined resist pattern. This 'RELACS TM ' process is a hole shrinking procedure that includes simple coating, baking, and rinse steps applied after conventional photolithography. This paper examines the process parameters affecting shrinkage of CH size. We subsequently evaluated the dependency of CH shrinkage on resist formulation. We conducted investigations of shrink magnitude dependency on each process parameter. (1) Photoresist lithography process: CH size, exposure dose, post development bake temperature. (2) AZ R R200 [a product of Clariant (Japan) K.K.] RELACS TM process: Soft bake temperature, film thickness, mixing bake temperature (diffusion bake temperature), etc. We found that the mixing bake condition (diffusion bake temperature) is one of most critical parameters to affect the amount of CH shrink. Additionally, the structural influence of photoacid generators on shrinkage performance was also investigated in both high and low activation energy resist systems. The shrinkage behavior by the photoacid generator of the resist is considered in terms of the structure (molecular volume) of the photogenerated acid and its acidity (pKa). The results of these studies are discussed in terms of base polymer influence on shrinkage performance and tendency. Process impact of the structure and acidity of the photogenerated acid is explored. Though the experimental acetal type KrF positive resist (low activation energy system) can achieve around 0.1 micrometer CH after RELACS TM processing under the optimized condition, the experimental acrylate type positive resist (high activation energy system) showed less shrinkage under the same process condition. The shrinkage performance of RELACS TM process largely depends on the resist chemistry used as the underlying layer. Further, shrinkage degree can be controlled by process optimization even for the high activation energy type photoresist.

22 citations

Journal ArticleDOI
TL;DR: In this paper, a mathematical model was developed to calculate the absorptivity and the resulting temperature field as a function of space and time during pulsed laser heating of a plane surface.

22 citations


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Performance
Metrics
No. of papers in the topic in previous years
YearPapers
202329
202266
2021289
2020318
2019281
2018274