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Process variable

About: Process variable is a research topic. Over the lifetime, 3983 publications have been published within this topic receiving 43130 citations. The topic is also known as: process parameter.


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Journal ArticleDOI
TL;DR: In this article, the impact of process parameters on tensile strength, mesostructure and in-process crystallinity of poly(lactic acid) specimens has been investigated using a statistically designed experiment.
Abstract: This study aims to investigate the impact of layer thickness, extrusion temperature, extrusion speed and build plate temperature on the tensile strength, crystallinity achieved during fabrication (herein, in-process crystallinity) and mesostructure of Poly(lactic acid) specimens. Both tensile strength and in-process crystallinity were optimized and verified as the function of processing parameters, and their relationship was thoroughly examined.,The four key technological parameters were systematically varied as factors on three levels, using the statistically designed experiment. Surface response methodology was used to optimize tensile strength and crystallinity for the given ranges of input factors. Optimized factor settings were used in a set of confirmation runs, where the result of optimization was experimentally confirmed. Material characterization was performed using differential scanning calorimetry and X-ray diffraction analysis, while the effect of processing parameters on mesostructure was examined by scanning electron microscopy.,Layer thickness and its quadratic effect are dominant contributors to tensile strength. Significant interaction between layer thickness and extrusion speed implies that these parameters should always be varied simultaneously within designed experiment to obtain adequate process model. As regards, the in-process crystallinity, extrusion speed is part of two significant interactions with plate temperature and layer thickness, respectively. Quality of mesostructure is vital contributor to tensile strength during FDM process, while the in-process crystallinity exhibited no impact, remaining below the 20 per cent margin regardless of process parameter settings.,According to available literature, there have been no previously published investigations which studied the effect of process parameters on tensile strength, mesostructure and in-process crystallinity through systematic variation of four critical processing parameters.

27 citations

Journal ArticleDOI
TL;DR: Particle size and particle size distribution are measured in-line in fluidized bed processes as discussed by the authors, which is a useful Process Analytical Tool (PAT) in the process control and can detect agglomerates in lots of small particles.

27 citations

Journal ArticleDOI
Lloyd Axworthy1, Rui Chen2, Tao Luo2, Da Geng2, Zheng Shen, Wei Zhou2 
01 Feb 2022-Carbon
TL;DR: In this article, a fast response flexible temperature sensor is fabricated in a facile manner on the basis of laser-reduced graphene oxide(GO) for contactless human-machine interface.

27 citations

Journal ArticleDOI
TL;DR: In this article, the authors evaluated the overall formability of a series of polymeric sheets deformed by the single point incremental forming (SPIF) process, including biocompatible and non-biocompatibility materials, while considering a variety of process parameters including spindle speed.

27 citations

Proceedings ArticleDOI
16 Apr 2007
TL;DR: In this article, a self-test scheme for analog and mixed-signal devices based on die-level process monitoring is proposed, which provides a reliable method for early identification of excessive process parameter variations in production tests that allows quickly discarding of the faulty circuits.
Abstract: This paper reports a new built-in self-test scheme for analog and mixed-signal devices based on die-level process monitoring. The objective of this test is not to replace traditional specification-based tests, but to provide a reliable method for early identification of excessive process parameter variations in production tests that allows quickly discarding of the faulty circuits. Additionally, the possibility of on-chip process deviation monitoring provides valuable information, which is used to guide the test and to allow the estimation of selected performance figures. The information obtained through guiding and monitoring process variations is re-used and supplement the circuit calibration

27 citations


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Performance
Metrics
No. of papers in the topic in previous years
YearPapers
202329
202266
2021289
2020318
2019281
2018274