Resist

About: Resist is a research topic. Over the lifetime, 40991 publications have been published within this topic receiving 371548 citations.

Pattern‐Transfer Fidelity in Soft Lithography: The Role of Pattern Density and Aspect Ratio

Abstract: Using high-aspect-ratio nanostructures fabricated via two-photon laser-scanning lithography, we examine the deformation of elastomeric stamps used in soft nanolithography and the fidelity of patterns and replicas made using these stamps. Two-photon laser-scanning lithography enables us to systematically regulate the aspect ratio and pattern density of the nanostructures by varying laser-scanning parameters such as the intensity of the laser beam, the scanning speed, the focal depth inside the resist, and the scanning-line spacing. Two commercially available stamp/mold materials with different moduli have been investigated. We find that the pattern-transfer fidelity is strongly affected by the pattern density. In addition, we demonstrate that true three-dimensional structures can be successfully replicated because of the flexible nature of elastomeric poly(dimethylsiloxane).

Growth of carbon nanotubes with resist-assisted patterning process

Abstract: The authors developed a growth method for carbon nanotubes (CNTs) by using a resist-assisted patterning process. The CNTs can be grown directly on the patterned catalyst surface without a diffusion barrier. The growth-site patterns were fabricated on a nickel/silicon (Ni∕Si) substrate by a conventional lithography method using a photopatternable resist. The growth mechanism of the CNTs without diffusion barrier was confirmed by Raman spectroscopy and transmission-electron microscope measurement. The carbon-network formation during forming the process is a key parameter for CNT growth. The technique will be applicable to a low-cost fabrication process of electron-emitter arrays.

Lithography patterning with a gas phase resist

Abstract: Disclosed is a method for lithography patterning. The method includes providing a substrate, forming a deposition enhancement layer (DEL) over the substrate, and flowing an organic gas near a surface of the DEL. During the flowing of the organic gas, the method further includes irradiating the DEL and the organic gas with a patterned radiation. Elements of the organic gas polymerize upon the patterned radiation, thereby forming a resist pattern over the DEL. The method further includes etching the DEL with the resist pattern as an etch mask, thereby forming a patterned DEL.

Process flows for formation of fine structure layer pairs on flexible films

Abstract: Processes for forming conductive vias between circuit elements formed on either side of a flexible substrate are disclosed. In one embodiment, the inventive process starts with a flexible film polyimide substrate on each side of which is arranged a layer of copper. Both of the copper surfaces are coated with photoresist. Blind vias are then drilled through the top copper layer and substrate using a laser. The photoresist is then exposed (patterned). A plating operation is used to fill the vias with a conductive material. The resist is then developed and the line and pad structures on the surface of the copper layer are plated. The photoresist is then stripped. In a variation of this embodiment, the photoresist is imaged prior to drilling of the vias using a laser. In an alternative embodiment of the inventive process, a through hole is drilled instead of a blind via. In either embodiment, there is no process step between the photo-exposure of the resist and the laser drilling which can impact the dimensions of the substrate.