Topic
Resist
About: Resist is a research topic. Over the lifetime, 40991 publications have been published within this topic receiving 371548 citations.
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3M1
TL;DR: In this paper, a method for enhancing the conductivity of transparent conductive electrodes on display substrates by providing patterned auxiliary metallic layers adjacent to the opaque conductive material was proposed.
Abstract: A method for enhancing the conductivity of transparent conductive electrodes on display substrates by providing patterned auxiliary metallic layers adjacent to the transparent conductive material. The method of the present invention eliminates the need for aligning the auxiliary metal layers (26) with transparent conductive electrodes (22) a) by using an inclined collimated beam of metallic material (28) for depositing a metal coating (26) on resist strips (24), or b) by providing resist residuals at the corner of the metal coating, or by forming a contignous metallic coating with a periodic array of holes therein which can be etched simultaneously with the underlying transparent conductive layer.
58 citations
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TL;DR: In this paper, an oxide buffer layer between the reflective multilayer (ML) stacks and the absorber is employed to protect the ML during repair of EUV mask defect.
Abstract: The key challenge in extreme ultraviolet (EUV) mask defect repair is to avoid or limit the damage to the sensitive reflective multilayer (ML) stacks on the mask substrate and repair <55 nm mask defects. Our EUV mask design employs an oxide buffer layer between the ML and the absorber to protect the ML during repair. We have developed both opaque and clear EUV mask defect repair processes using focus ion beam (FIB) based gas-assisted etching (GAE) and ion-induced deposition. The process has been successfully demonstrated on our TiN baseline mask by 10× EUV print tests of 100 nm resist lines/spaces. More importantly we have assessed the current FIB tool performance capability and compared it with the general requirements for repairing the EUV mask for the 70 nm lithography node. The characterization includes minimum “effective” beam size, etch selectivity, and edge placement precision. We discussed the required improvements and future directions in repair tool research and development in order for the mask ...
58 citations
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TL;DR: The fabrication of metallic nanostructures down to 20 and 50 nm in size on polymer materials such as polyimide, parylene, SU-8, and PDMS substrates without any resist processing using stencil lithography is reported.
Abstract: The development of nanoscale lithographic methods on polymer materials is a key requirement to improve the spatial resolution and performance of flexible devices. Here, we report the fabrication of metallic nanostructures down to 20 and 50 nm in size on polymer materials such as polyimide, parylene, SU-8, and PDMS substrates without any resist processing using stencil lithography. Metallic nanodot array analysis of their localized surface plasmon spectra is included. We demonstrate plasmon resonance detection of biotin and streptavidin using a PDMS flexible film with gold nanodots. We also demonstrate the fabrication of metallic nanowires on polyimide substrates with their electrical characteristics showing an ohmic behavior. These results demonstrate high-resolution nanopatterning and device nanofabrication capability of stencil lithography on polymer and flexible substrates.
58 citations
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TL;DR: In this article, the antisticking properties and structural morphologies of the formed self-assembled monolayer are investigated using contact angle, Fourier transform infrared spectroscopy, and x-ray photoelectron spectroscope (XPS) measurements.
Abstract: The adhesion between the fused silica mold and the resist remains a key issue in ultraviolet nanoimprint lithography (UV-NIL), especially in step and repeat processes. In this paper, we present results on antisticking layers (ASLs) of tridecafluoro-1,1,2,2-tetrahydrooctyltrichlorosilane (F13-TCS) deposited in vapor phase and of a commercial product, Optool DSX™, from Daikin Chemical, deposited in liquid phase. The antisticking properties and structural morphologies of the formed self-assembled monolayer are investigated using contact angle, Fourier transform infrared spectroscopy, and x-ray photoelectron spectroscopy (XPS) measurements. Obtained surface energies are as low as 10mN∕m for both types of ASL. The stability of these formed layers during the UV-NIL process remains the main important issue. It was tested on an EVG® step and repeat UV-NIL equipment using acrylate-based resists. After only 50 prints, we observed a high increase in the surface energy of the mold, which indicates a drastic degradati...
58 citations
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TL;DR: In this paper, two alternative methods for fabrication of nanoimprint lithography stamps in SiO2 with sub-20 nm features are presented: (a) optimized electron beam lithography (EBL) and lift-off patterning of a 15-nm thick Cr mask, and (b) aerosol deposition of W particles in the 20-nm size range.
58 citations