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Resist

About: Resist is a research topic. Over the lifetime, 40991 publications have been published within this topic receiving 371548 citations.


Papers
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Journal ArticleDOI
TL;DR: In this paper, the authors provide a survey of conventional and unconventional lithography techniques used to fabricate complex micro-and nano-structured surfaces, including printing, molding, and embossing.

149 citations

Patent
18 Dec 1998
TL;DR: In this paper, a dielectric layer is formed upon a substrate that is substantially conformal to the upper surface of the substrate and a subsequent etch forms a depression within the depression and a ledge on the surface that is adjacent to the depression.
Abstract: The present invention relates to the formation of a ball grid array testing receiver that is scalable for design consideration of miniaturization. A dielectric layer is formed upon a substrate that is substantially conformal to the upper surface of the substrate. A patterned masking layer is formed upon the dielectric layer and a subsequent etch forms a depression within the substrate and forms a ledge on the surface of the substrate that is adjacent to the depression. After formation of the ledge, a metal layer is formed continuously on the ledge and within the depression. Following the formation of the metal layer, a masking layer is formed upon the metal layer. The masking layer is patterned so as to form a desired arrangement of metal lines by etching the underlying metal layer. The formation of the ledge enables the masking layer to resist formation of a breach between the surface of the substrate and the depression. As such, metal lines are formed so as to extend into the depression without a breach that would otherwise leave an open circuit during attempted use.

149 citations

Journal ArticleDOI
08 Mar 2000-Langmuir
TL;DR: An atomic force microscopy (AFM)-based procedure, a nanopen reader and writer (NPRW), is developed to produce nanometer scale patterns on surfaces in this paper, where a self-assembled monolayer serves as the resist, while an AFM tip displaces the resist molecules from desired locations by using a high shear force.
Abstract: An atomic force microscopy (AFM)-based procedure, a nanopen reader and writer (NPRW), is developed to produce nanometer scale patterns on surfaces. In each NPRW experiment, a self-assembled monolayer serves as the resist, while an AFM tip displaces the resist molecules from desired locations by using a high shear force. The AFM tip is precoated with adsorbate molecules which can adsorb to the newly exposed substrate areas. This procedure combines the advantages of two recently developed AFM lithography methods: nanografting (Xu, S.; Liu, G. Y. Langmuir 1997, 13, 127) and dip-pen nanolithography (Piner, R. D.; Zhu, J.; Xu, F.; Hong, S.; Mirkin, C. A. Science 1999, 283, 661). NPRW is easy to complete and able to produce desired patterns with multiple components. In addition, NPRW can reach high spatial resolution, independent of the texture of the paper and the humidity of the environment. The size and geometry of these nanopatterns are well preserved because the resist molecules efficiently prevent diffus...

149 citations

Patent
30 Apr 2001
TL;DR: In this paper, a method for readily forming a bump with a desired width, a semiconductor device and a method to make the same, a circuit board, and an electronic device is presented.
Abstract: The invention provides a method for readily forming a bump with a desired width, a semiconductor device and a method for making the same, a circuit board, and an electronic device. A method for forming a bump includes forming an opening in an insulating film which exposes at least a part of a pad, and forming the bump so as to be connected to the pad. A resist layer 20 defines a through hole which extends over at least a part of the pad in plan view. A metal layer is formed in the opening so as to connect to the exposed portion of the pad.

148 citations

Journal ArticleDOI
TL;DR: In this paper, negative photoresists (SU-8 and photosensitive polyimide) were fabricated by the pyrolysis of a closed quartz tube furnace in a forming gas (95% N 2, 5% H 2 ).
Abstract: Carbon structures were fabricated by the pyrolysis of photopatterned negative photoresists (SU-8 and photosensitive polyimide) on silicon and fused silica wafers. Results here are compared with those of positive resists published earlier by this group. Negative resist films need exposure to ultraviolet light prior to pyrolysis to produce carbon films. The pyrolysis was carried out in a closed quartz tube furnace in a forming gas (95% N 2 , 5% H 2 ) atmosphere. The pyrolysis process was characterized using a combination of thermogravimetric analysis and differential thermal analysis. The pyrolysis of SU-8 involved gas evolution in a narower range of temperature than polyimide, The adhesion of the carbon film was found to depend on the resist, the substrate, and the heating cycle used. The carbon structures were characterized in terms of their shrinkage during the pyrolysis, the resistivity, the degree of crystallinity and the peak separation in cyclic voltammetry. Carbons derived from pyrolysis of negative resists showed higher resistivity, vertical shrinkage, and peak-to-peak separation voltage than positive resists. Transmission electron microscope results showed a distinct lack of crystallinity even after pyrolysis at 1100°C, unlike the positive resist derived carbon.

148 citations


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Performance
Metrics
No. of papers in the topic in previous years
YearPapers
2023275
2022625
2021225
2020398
2019489
2018501