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Resist

About: Resist is a research topic. Over the lifetime, 40991 publications have been published within this topic receiving 371548 citations.


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Journal ArticleDOI
TL;DR: In this paper, a base layer technique is described that makes it possible to fabricate lower numerical aperture lenses in resist, com-pared with microlenses on glass substrates, in particular on lenses with numerical apertures ranging from 0.1 to 0.3.
Abstract: . We report on the fabrication of novel refractive microlens ar- rays in photoresists, in particular on lenses with numerical apertures ranging from 0.1 to 0.3. A base layer technique is described that makesit possible to fabricate lower numerical aperture lenses in resist, com-pared with microlenses on glass substrates. The wave aberrations weremeasured in a Mach-Zehnder interferometer. Diffraction-limited perfor-mance was achieved for a numerical aperture of 0.2 and a lens diameter of 270 jtm. Subject terms: micro/ens arrays; numerical apertures; Mach-Zehnder interferom-eter.Optical Engineering 32(6), 1322-1324 (June 1993). the substrate is coated with a 1-rim-thick layer ofresist usinga spin coater. Shipley AZ 1518 showed the best results. After30 mm at 160°C the resist is polymerized. The base layer isnow inert against UV exposure.Next, the base layer is covered with a thicklayer of positivephotoresist (Shipley AZ 4620 A). For a fabricated lens witha diameter of 272 im and a focal length of 666 pm, a layerof 1 1 im of positive resist was necessary. After prebakingin a convection oven at 90°C for 30 mm, the prepared sub-strate is exposed through a binary chrome-glass mask usinga UV lamp. After development, an array of cylindrical pho-toresist islands in the transparent regions of the mask is ob-tamed. The focal length of the lens depends on the thicknessof this layer as well as on the diameter of the resist cylinders.The final fabrication process consists of melting the cyl-inders on a hot plate at a temperature of 160°C, for 6 mm.At temperatures above 110°C the resist melts and polymerizescompletely. Because of the base layer below the resist cyl-inders, the critical angle becomes smaller than on the "na-ked" glass substrate. The surface tension pulls the meltedcylinder into a spherical lens with an identical volume. Ascheme of the fabrication process is shown in Fig. 2.

98 citations

Journal ArticleDOI
TL;DR: In this paper, a dual poly gate is fabricated using a process where the poly and source/drain (S/D) are doped simultaneously, and a reduced operating voltage of 2.5 V is used which allows the application of shallow junctions with abrupt profiles (no LDD) to minimize the device series resistance as well as gate to source/Drain overlap capacitance.
Abstract: For Pt. I, see ibid., vol.39, no.4, pp.959-966 (1992). The key technology elements and their integration into a high-performance, selectively scaled, 0.25- mu m CMOS technology are presented. Dual poly gates are fabricated using a process where the poly and source/drain (S/D) are doped simultaneously. The critical issues related to the dual poly gate are addressed. A reduced operating voltage of 2.5 V is used which allows the application of shallow junctions with abrupt profiles (no LDD) to minimize the device series resistance as well as gate to source/drain overlap capacitance. The poly gate and the S/D sheet resistances are lowered, using a thin salicide (TiSi/sub 2/) process. The TiSi/sub 2/ thickness is reduced to maintain low leakage and low contact resistance for the shallow S/D junctions. The gate level with 0.4- mu m physical length is defined using optical lithography with a contrast enhanced layer (CEL) resist system. >

97 citations

Patent
23 Jul 2009
TL;DR: In this article, a method of manufacturing a magnetic recording medium is described, which includes forming a first hard mask including carbon as a main component, a second hard mask with a component other than carbon and a resist on the magnetic recording layer, contacting a stamper to the resist to transfer patterns of protrusions and recesses, removing residues in the recesses of the patterned resist, etching the second hard masks and removing the first hard masks.
Abstract: According to one embodiment, there is provided a method of manufacturing a magnetic recording medium, including forming a first hard mask including carbon as a main component, a second hard mask including a main component other than carbon and a resist on a magnetic recording layer, contacting a stamper to the resist to transfer patterns of protrusions and recesses to the resist, removing residues in the recesses of the patterned resist, etching the second hard mask, etching the first hard mask, patterning the magnetic recording layer, and removing the first hard mask, the method further including, between etching the first hard mask and removing the first hard mask, removing the second hard mask remaining on the protrusions of the first hard mask, and removing a contaminating layer on a surface of the first hard mask by a mixed gas of oxygen-based gas and a fluorine compound.

97 citations

Journal ArticleDOI
TL;DR: The fabrication of high-Q polymeric microdisks on silicon via direct laser writing utilizing two-photon absorption induced polymerization using flexible three-dimensional lithography method, useful for rapid prototyping of active and passive optical microcavities.
Abstract: We report the fabrication of high-Q polymeric microdisks on silicon via direct laser writing utilizing two-photon absorption induced polymerization. The quality factors of the passive cavities are above 106 in the 1300 nm wavelength region. The flexible three-dimensional (3D) lithography method allows for the fabrication of different cavity thicknesses on the same substrate, useful for rapid prototyping of active and passive optical microcavities. Microdisk lasers are realized by doping the resist with dye, resulting in laser emission at visible wavelengths.

97 citations


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Performance
Metrics
No. of papers in the topic in previous years
YearPapers
2023275
2022625
2021225
2020398
2019489
2018501