Topic
RLC circuit
About: RLC circuit is a research topic. Over the lifetime, 14490 publications have been published within this topic receiving 142697 citations.
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TL;DR: In this article, the authors describe the plasma display driver circuit, which includes a panel inter-electrode capacitor, a charging/discharging circuit, and a voltage clamp circuit.
Abstract: The plasma display panel driver circuit disclosed includes a panel inter-electrode capacitor, a charging/discharging circuit, and a voltage clamp circuit. The panel inter-electrode capacitor is provided between scanning and sustain electrodes of a panel. The charging/discharging circuit is connected in parallel with the panel inter-electrode capacitor and formed by a combination of a coil, FET switches and reverse current blocking diodes. The voltage clamp circuit includes four switches connected to terminals of the panel inter-electrode capacitor. The panel inter-electrode capacitor, together with a series circuit of the coil and the FET switches, forms a parallel resonance circuit. The panel inter-electrode capacitor 40 is repeatedly charged and discharged through the control of the switches with switch drive inputs. In the driving of a plasma display panel, ineffective power is reduced when charging and discharging the panel inter-electrode capacitor.
89 citations
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TL;DR: In this article, a new modeling technique for plasmon-based metallic nanoparticles under the influence of an electromagnetic field is presented, which approximates the coefficients of the admittance rational function.
Abstract: In this paper, we present a new modeling technique for plasmon-based metallic nanoparticles under the influence of an electromagnetic field. The model approximates the coefficients of the admittance rational function. The proposed model utilizes spherical wave functions to describe the field and it provides an equivalent ladder-form RLC realization. Simulation results show that our model matches very closely with the exact solution. Our newly developed model can be used as a basic building block to develop an equivalent circuit model for metallic nanoparticle-based plasmonic waveguides
89 citations
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TL;DR: A repeater insertion methodology is presented for achieving the minimum power in an RC interconnect while satisfying delay and bandwidth constraints, and the effects of inductance on the delay, bandwidth, and power of an RLC interconnect with repeaters are analyzed.
Abstract: Interconnect plays an increasingly important role in deep-submicrometer very large scale integrated technologies. Multiple design criteria are considered in interconnect design, such as delay, power, and bandwidth. In this paper, a repeater insertion methodology is presented for achieving the minimum power in an RC interconnect while satisfying delay and bandwidth constraints. These constraints determine a design space for the number and size of the repeaters. The minimum power is shown to occur at the edge of the design space. With delay constraints, closed form solutions for the minimum power are developed, where the average error is 7% as compared with SPICE. With bandwidth constraints, the minimum power can be achieved with minimum-sized repeaters. The effects of inductance on the delay, bandwidth, and power of an RLC interconnect with repeaters are also analyzed. By including inductance, the minimum interconnect power under a delay or bandwidth constraint decreases as compared with an RC interconnect.
89 citations
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TL;DR: In this paper, the fundamental mode of a miniature cantilever was cooled by capacitively coupling it to a driven rf resonant circuit and cooling results from the rf capacitive force, which is phase shifted relative to the cantilevers motion.
Abstract: We cool the fundamental mode of a miniature cantilever by capacitively coupling it to a driven rf resonant circuit. Cooling results from the rf capacitive force, which is phase shifted relative to the cantilever motion. We demonstrate the technique by cooling a 7 kHz cantilever from room temperature to 45 K, obtaining reasonable agreement with a model for the cooling, damping, and frequency shift. Extending the method to higher frequencies in a cryogenic system could enable ground state cooling and may prove simpler than related optical experiments in a low temperature apparatus.
89 citations
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27 Mar 2008TL;DR: A wireless IC device includes a wireless IC chip for processing a transmission/reception signal, a printed wiring circuit board on which the IC chip is mounted, a ground electrode disposed on the circuit board, and a substantially loop-shaped electrode that is electrically conducted to the wireless IC and disposed on circuit board so as to be coupled to the ground electrode by an electromagnetic field as discussed by the authors.
Abstract: A wireless IC device includes a wireless IC chip for processing a transmission/reception signal, a printed wiring circuit board on which the wireless IC chip is mounted, a ground electrode disposed on the circuit board, and a substantially loop-shaped electrode that is electrically conducted to the wireless IC chip and disposed on the circuit board so as to be coupled to the ground electrode by an electromagnetic field The ground electrode is coupled to the wireless IC chip via the substantially loop-shaped electrode to transmit/receive a radio frequency signal A feeder circuit board including a resonant circuit and/or a matching circuit may be interposed between the wireless IC chip and the substantially loop-shaped electrode
88 citations