Schottky barrier

About: Schottky barrier is a research topic. Over the lifetime, 22570 publications have been published within this topic receiving 427746 citations. The topic is also known as: Schottky barrier junction.

Vertical GaN Junction Barrier Schottky Rectifiers by Selective Ion Implantation

Abstract: This letter demonstrates vertical GaN junction barrier Schottky (JBS) rectifiers fabricated with novel ion implantation techniques. We used two different methods to form the lateral p-n grids below the Schottky contact: 1) Mg implantation into n-GaN to form p-wells and 2) Si implantation into p-GaN to form n-wells. Specific differential ON-resistances ( ${R}_{ \mathrm{\scriptscriptstyle ON}}$ ) of 1.5–2.5 $\text{m}\Omega ~\cdot $ cm2 and 7–9 $\text{m}\Omega ~\cdot $ cm2 were obtained in the Mg-implanted and Si-implanted JBS rectifiers, respectively. A breakdown voltage of 500–600 V was achieved in both devices, with a leakage current at high reverse biases at least 100-fold lower than conventional vertical GaN Schottky barrier diodes. The impact of n-well and p-well widths on the ${R}_{ \mathrm{\scriptscriptstyle ON}}$ and BV was investigated. Fast switching capability was also demonstrated. This letter shows the feasibility of forming patterned p-n junctions by novel ion implantation techniques, to enable high-performance vertical GaN power devices.

Does p-type ohmic contact exist in WSe2–metal interfaces?

Abstract: Formation of low-resistance metal contacts is the biggest challenge that masks the intrinsic exceptional electronic properties of two dimensional WSe2 devices. We present the first comparative study of the interfacial properties between monolayer/bilayer (ML/BL) WSe2 and Sc, Al, Ag, Au, Pd, and Pt contacts by using ab initio energy band calculations with inclusion of the spin-orbital coupling (SOC) effects and quantum transport simulations. The interlayer coupling tends to reduce both the electron and hole Schottky barrier heights (SBHs) and alters the polarity for the WSe2-Au contact, while the SOC chiefly reduces the hole SBH. In the absence of the SOC, the Pd contact has the smallest hole SBH. Dramatically, the Pt contact surpasses the Pd contact and becomes the p-type ohmic or quasi-ohmic contact with inclusion of the SOC. Therefore, p-type ohmic or quasi-ohmic contact exists in WSe2-metal interfaces. Our study provides a theoretical foundation for the selection of favorable metal electrodes in ML/BL WSe2 devices.

High mobility Ge-on-insulator p-channel MOSFETs using Pt germanide Schottky source/drain

Abstract: We demonstrate, for the first time, successful operation of Schottky-barrier source/drain (S/D) germanium-on-insulator (GOI) MOSFETs, where a buried oxide and a silicon substrate are used as a gate dielectric and a bottom gate electrode, respectively. Excellent performance of p-type MOSFETs using Pt germanide S/D is presented in the accumulation mode. The hole mobility enhancement of 50%/spl sim/40% against the universal hole mobility of Si MOSFETs is obtained for the accumulated GOI channel with the SiO/sub 2/-Ge interface.

Ab initio study of Schottky barriers at metal-nanotube contacts

Abstract: The type of barrier at a metal/CNT junction is one of the key issues in nanotube electronics. Despite the extensive experimental work done to clarify this issue, there is no consensus in the nano-electronics community. We present here the first ab initio calculation on the Schottky barrier and tunneling barrier height of an idealized metal (Au, Pd, Pt) semiconducting (8,0) nanotube junction. All three metal species form Schottky barriers when contacting small diameter nanotubes. Two most important atomic geometrical factors influencing the Schottky barrier height are identified as the metal species and its surface orientation. Pd is found to have the lowest Schottky barrier. Our simulation results give useful insight into the on going experiments.