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Semiconductor device fabrication

About: Semiconductor device fabrication is a research topic. Over the lifetime, 5459 publications have been published within this topic receiving 53011 citations. The topic is also known as: semiconductor engineering & semiconductor fabrication.


Papers
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BookDOI
09 Jul 2007
TL;DR: A glossary of manufacturing terms acronyms used in semiconductor manufacturing standards and specifications units of measure and conversion tables useful constants can be found in this paper, along with a detailed overview of process control in-line metrology in-situ metrology yield modelling yield management electrical, physical and chemical characterization failure analysis.
Abstract: Overview of semiconductor devices introduction to semiconductor equipment silicon materials surface preparation ion implantation dopant diffusion oxidation silicidation rapid thermal processing overview of interconnect chemical vapourdeposition alternate interlevel dielectrics polymide dielectrics physical vapour deposition chemical-mechanical polish optical lithography photoresist materials and processing x-ray lithography electron-beam lithography photomask fabrication plasma etching equipment reliability overview of process control in-line metrology in-situ metrology yield modelling yield management electrical, physical and chemical characterization failure analysis. Appendices: glossary of manufacturing terms acronyms used in semiconductor manufacturing standards and specifications units of measure and conversion tables useful constants.

572 citations

Journal ArticleDOI
Meikei Ieong1, Bruce B. Doris1, J. Kedzierski1, K. Rim1, Min Yang1 
17 Dec 2004-Science
TL;DR: Challenges and possible solutions are discussed for continued silicon device performance trends down to the sub-10-nm gate regimes, which will lead to devices with gate lengths below 10 nanometers.
Abstract: In the next decade, advances in complementary metal-oxide semiconductor fabrication will lead to devices with gate lengths (the region in the device that switches the current flow on and off) below 10 nanometers (nm), as compared with current gate lengths in chips that are now about 50 nm. However, conventional scaling will no longer be sufficient to continue device performance by creating smaller transistors. Alternatives that are being pursued include new device geometries such as ultrathin channel structures to control capacitive losses and multiple gates to better control leakage pathways. Improvement in device speed by enhancing the mobility of charge carriers may be obtained with strain engineering and the use of different crystal orientations. Here, we discuss challenges and possible solutions for continued silicon device performance trends down to the sub-10-nm gate regimes.

549 citations

Book
01 Jan 2000
TL;DR: In this article, the authors present a detailed overview of the IC fabrication process and its application in the semiconductor industry, including the following: 1. IC Fabrication Process Overview. 2. Characteristics of Semiconductor Materials. 3. Device Technologies.
Abstract: 1. Introduction to the Semiconductor Industry. 2. Characteristics of Semiconductor Materials. 3. Device Technologies. 4. Silicon and Wafer Preparation. 5. Chemicals in Semiconductor Fabrication. 6. Contamination Controls in Wafer Fabs. 7. Metrology and Defect Inspection. 8. Gas Control in Process Chambers. 9. IC Fabrication Process Overview. 10. Oxidation. 11. Deposition. 12. Metallization. 13. Photolithography: Vapor Prime to Soft Bake. 14. Photolithography: Alignment and Exposure. 15. Photolithography: Photoresist Development and Advanced Lithography. 16. Etch. 17. Ion Implant. 18. Chemical Mechanical Planarization. 19. Wafer Test. 20. Assembly and Packaging. Appendices. Glossary. Index.

489 citations

Book
01 Jul 2000
TL;DR: The Plan for This Book as mentioned in this paper is a collection of key ideas, references, and problems related to semiconductor manufacturing, including the history, development and basic concepts, manufacturing methods and equipment, measurement methods, models and simulation, limits and future trends in technologies and models.
Abstract: (NOTE: Chapters 3-11 include an Introduction, Historical Development and Basic Concepts, Manufacturing Methods and Equipment, Measurement Methods, Models and Simulation, Limits and Future Trends in Technologies and Models, Summary of Key Ideas, References, and Problems.) 1. Introduction and Historical Perspective. Introduction. Integrated Circuits and the Planar Process-Key Inventions That Made It All Possible. Semiconductors. Semiconductor Devices. Semiconductor Circuit Families. Modern Scientific Discovery-Experiments, Theory and Computer Simulation. The Plan for This Book. 2. Modern CMOS Technology. CMOS Process Flow. 3. Crystal Growth, Wafer Fabrication and Basic Properties of Silicon Wafers. 4. Semiconductor Manufacturing- Clean Rooms, Wafer Cleaning and Gettering. 5. Lithography. 6. Thermal Oxidation and the Si/SiO2 Interface. 7. Dopant Diffusion. 8. Ion Implantation. 9. Thin Film Deposition. 10. Etching. 11. Backend Technology.

473 citations

Journal ArticleDOI
TL;DR: Target applications including surface-roughening for on-chip decoupling capacitors, patterning nanocrystal floating gates for FLASH devices, and defining FET channel arrays are discussed.
Abstract: We are inspired by the beauty and simplicity of self-organizing materials and the promise they hold for enabling continued improvements in semiconductor technology. Self assembly is the spontaneous arrangement of individual elements into regular patterns," under suitable conditions, certain materials self organize into useful nanometer-scale patterns of importance to high-performance microelectronics applications. Polymer self assembly is a nontraditional approach to patterning integrated circuit elements at dimensions and densities inaccessible to traditional lithography methods. We review here our efforts in IBM to develop and integrate self-assembly processes as high-resolution patterning alternatives and to demonstrate targeted applications in semiconductor device fabrication. We also provide a framework for understanding key requirements for the adoption of polymer self-assembly processes into semiconductor technology, as well as a discussion of the ultimate dimensional scalability of the technique.

450 citations


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Performance
Metrics
No. of papers in the topic in previous years
YearPapers
2023128
2022180
202191
2020162
2019184
2018169