Silicon nitride

About: Silicon nitride is a research topic. Over the lifetime, 32678 publications have been published within this topic receiving 413599 citations. The topic is also known as: N₄Si₃.

Method for producing substoichiometric silicon nitride of preselected proportions

Abstract: An apparatus and method for producing films of silicon nitride whose index of refraction varies continuously with film depth by preselected amounts between n=3.9 and n=1.99. This is done by producing an amorphous film of silicon nitride, Si1-x Nx, of pre-selected stoichiometry between x=0 and x=0.57. In a vacuum-chamber, a target substrate is exposed to vaporized silicon while being simultaneously bombarded with an ion beam of relatively high kinetic energy, ionized, nitrogen particles. The nitrogen embeds in the silicon film deposited on the substrate to form amorphous silicon nitride, the stoichiometry of which depends on the intensity of the ion beam. Instruments measure during the deposition the relative rate of arrival at the target for silicon and nitrogen, and, with pre-generated calibration data for the apparatus, enable an operator to selectively control the film's stoichiometry by controlling the ion beam's intensity response to the measured rate of silicon deposition.

Influence of substrate nitridation temperature on epitaxial alignment of GaN nanowires to Si(111) substrate.

Abstract: An arrangement of self-assembled GaN nanowires (NWs) grown by plasma-assisted molecular beam epitaxy on a Si(111) substrate is studied as a function of the temperature at which the substrate is nitridized before GaN growth. We show that the NWs grow with the c-axis perpendicular to the substrate surface independently of nitridation temperature with only a slight improvement in tilt coherency for high nitridation temperatures. A much larger influence of the substrate nitridation process on the in-plane arrangement of NWs is found. For high (850 °C) and medium (450 °C) nitridation temperatures angular twist distributions are relatively narrow and NWs are epitaxially aligned to the substrate in the same way as commonly observed in GaN on Si(111) planar layers with an AlN buffer. However, if the substrate is nitridized at low temperature (~150 °C) the epitaxial relationship with the substrate is lost and an almost random in-plane orientation of GaN NWs is observed. These results are correlated with a microstructure of silicon nitride film created on the substrate as the result of the nitridation procedure.

Influence of stoichiometry of direct plasma-enhanced chemical vapor deposited SiNx films and silicon substrate surface roughness on surface passivation

Abstract: In this article, we report on the use of direct plasma-enhanced chemical vapor deposited silicon nitride (SiNx) films deposited at low excitation frequency (440 kHz) on low-resistivity (1.5 Ω cm) p-type Czochralski silicon substrate surfaces with different textures, to elucidate the influence of microroughness of the substrate surface on the surface-passivating properties of thin SiNx films. Whereas flat surfaces get the best passivation from Si-rich SiNx films, the optimum passivation shifts towards stoichiometric nitride as the microroughness increases, which points to the increasing relative importance of a charge-induced field effect. When short high-temperature (firing) treatments are applied upon passivation layer deposition, the process window to yield good surface passivation broadens, although very Si-rich films tend to suffer from blistering.

Semiconductor integrated circuit device and a method of manufacturing the same

Abstract: A barrier layer and a copper film are successively formed on a silicon oxide film including a groove for wiring in the silicon oxide film and a silicon nitride film, both formed on a semiconductor substrate. Thereafter, the barrier layer and the copper film are removed from outside of the groove for wiring, thereby forming a wiring. Tungsten is selectively or preferentially grown on the wiring to selectively form a tungsten film on the wiring. After the formation of the copper film, a treatment with hydrogen may be performed. After the formation of the wiring, the semiconductor substrate may be cleaned with a cleaning solution capable of removing a foreign matter or a contaminant metal. After the formation of the wiring, a treatment with hydrogen is carried out.

NbTiN superconducting nanowire detectors for visible and telecom wavelengths single photon counting on Si3N4 photonic circuits

Abstract: We demonstrate niobium titanium nitride superconducting nanowires patterned on stoichiometric silicon nitride waveguides for detecting visible and infrared photons. The use of silicon nitride on insulator on silicon substrates allows us to simultaneously realize photonic circuits for visible and infrared light and integrate them with nanowire detectors directly on-chip. By implementing a traveling wave detector geometry in this material platform, we achieve efficient single photon detection for both wavelength regimes. Our detectors are an ideal match for integrated quantum optics as they provide crucial functionality on a wideband transparent waveguide material.