Silicon nitride

About: Silicon nitride is a research topic. Over the lifetime, 32678 publications have been published within this topic receiving 413599 citations. The topic is also known as: N₄Si₃.

Barrier coating for vitreous materials

Abstract: A chemical vapor deposition apparatus comprises a reaction chamber and one or more vitreous components having an outer surface that is covered at least in part by a devitrification barrier layer. In some arrangements, the one or more vitrious components can include a thermocouple. In a preferred arrangement, the devitrification barrier coating is formed from silicon nitride, which can be deposited on the vitreous component using chemical vapor deposition (CVD).

MgSiN2 Addition as a Means of Increasing the Thermal Conductivity of β‐Silicon Nitride

Abstract: Si3N4 powders with the concurrent addition of Yb2O3 and MgSiN2 were sintered at 1900°C for 2–48 h under 0.9 MPa nitrogen pressure. Microstructure, lattice oxygen content, and thermal conductivity of the sintered specimens were evaluated and compared with Si3N4, Yb2O3, and MgO addition. MgSiN2 addition was effective for improving the thermal conductivity of Si3N4 ceramics, and a material with high thermal conductivity over 140 W·(m·K)−1 could be obtained. For both specimens, lattice oxygen content was decreased with sintering time. However, the thermal conductivity of the MgSiN2-doped specimen was slightly higher than the MgO-doped specimen with the same oxygen content.

Tribological properties of Si3N4–graphene nanocomposites

Abstract: Mechanical and tribological properties of nanocomposites with silicon nitride matrix with addition of 1 and 3 wt% of various types of graphene platelets were studied. The wear behavior was observed by means of the ball-on-disk technique with a silicon nitride ball used as the tribological counterpart at room temperature in dry sliding. Coefficient of friction and specific wear rates were calculated and related to the damage mechanisms observed in the wear tracks. The measured properties were then assessed with respect to the type and volume fraction of the graphene additives. It is shown that addition of such amounts of carbon phases does not lower the coefficient of friction. Graphene platelets seem to be integrated into the matrix very strongly and they do not participate in lubricating processes. The best performance offers materials with 3 wt% of larger sized graphene, which have the highest wear resistance.

Methods for forming high-performing dual-damascene interconnect structures

Abstract: Dual damascene methods and structures are provided for IC interconnects which use a dual-damascene process incorporating a low-k dielectric material, high conductivity metal, and an improved hard mask scheme. A pair of hard masks are employed: a silicon dioxide layer and a silicon nitride layer, wherein the silicon dioxide layer acts to protect the silicon nitride layer during dual damascene etch processing, but is subsequently sacrificed during CMP, allowing the silicon nitride layer to act as a the CMP hard mask. In this way, delamination of the low-k material is prevented, and any copper-contaminated silicon dioxide material is removed.

Processing of crystalline ceramics

Abstract: Keynote Address.- Some Considerations in the State of the Art in Processing Crystalline Ceramics.- I: Fine Particle Science, Technology and Characterization.- Physical and Chemical Parameters Controlling the Homogeneity of Fine Grained Powders and Sintering Materials.- Ultrafine Powders of Oxide and Non-Oxide Ceramic Materials and Their Sinterability.- Handling and Green Forming of Fine Powders.- The Potential of Fine Particle Technology Applied to Ceramic Raw Materials.- Particle Size and Permeability in Slip Casting.- Chemical Processing for Ceramics (and Polymers).- Ceramics Sintered Directly from Sol-Gels.- Characterization of Ceramic Microprocessing.- Packing and Sintering Relations for Binary Powders.- Stress and Density Distributions in the Compaction of Powders.- Pore Morphography in Ceramic Processing.- II: Solid State Sintering and Grain Growth.- Fundamentals of the Sintering of Ceramics.- Current Paradigms in Powder Processing.- Some Effects of Aggregates and Agglomerates in the Fabrication of Fine Grained Ceramics.- The Sintering of Conductive Rutile: A Model System for Sintering Electronic Ceramics.- Sintering of Mullite.- Rate Controlled Sintering as a Processing Method.- A Multiple-Lognormal Model of a Normal Grain Growth.- III: Liquid Phase Sintering And Post-Firing Technology.- Rearrangement During Liquid Phase Sintering of Ceramics.- Reactivity of Alumina Substrates with High Lead Glasses.- Influence of the Processing Parameters on the Properties of Rapid Fired Porcelain.- Strengthening of Lime-Stabilized Zirconia by Post Sintering Heat Treatments.- Strain and Surface Energy Effects in Ceramic Processes.- Dynamic and Material Parameters in Brittle Fracture in Ceramics.- Processing Induced Sources of Mechanical Failure in Ceramics.- IV: Dielectric and Magnetic Ceramics.- Processing of High Density Piezoelectric Ceramic Compositions.- The Role of ZrO2 Powders in Microstructural Development of PZT Ceramics.- Novel Uses of Gravimetry in the Processing of Crystalline Ceramics.- Deformation Processing of Magnetic Hexaferrites for Hc Maximization Through Grain Growth Control.- Processing and Magnetic Properties of Low-Loss and High-Stability Mn-Zn Ferrites.- Relationship Between Processing Conditions, Oxygen Stoichiometry and Strength of MnZn Ferrites.- Sintering of High Density Ferrites.- V: Energy Related Ceramics I: Fast Ion Conductors MHD, Nuclear and Refractory Ceramics.- Processing and Characterization of Polycrystalline ?"-Alumina Ceramic Electrolytes.- Microstructural Control During Sintering of ?"-Alumina Compositions Through Ceramic Processing Modification.- Transient Eutectics in Sintering of Sodium Beta Alumina.- Microstructural Evolution During the Processing of Sodium ?-Alumina.- Fabrication and Performance of MHD Electrodes.- Fabrication and Property Control of LaCrO3 Based Oxides.- Strontium Containing Perovskites and Related Conductive Electronic Ceramics.- Hot Pressed Composite Ceramic MHD Electrode Development.- Processing Variables Affecting the Thermomechanical Degradation of Monolithic Refractory Concretes.- UO2-Gd2O3 Sintering Behavior.- Processing Requirements for Property Optimization of EU2O3-W Cermets for Fast Reactor Neutron Absorber Applications.- Ceramic Processing of Boron Nitride Insulators.- VI: Energy Related Ceramics II: Non-Oxide Ceramics.- Grain Boundary Engineering in Non-Oxide Ceramics.- The Fabrication of Dense Nitrogen Ceramics.- Ceramics in the Si-Al-O-N System Fabricated by Conventional Powder Processing and Sintering Techniques.- Polytypism in Magnesium Sialons.- Dense Silicon Nitride Ceramics: Fabrication and Interrelations with Properties.- High-Pressure Hot-Pressing of Silicon Nitride Powders.- The Structure of Grain Boundaries in Silicon Nitride Based Alloys.- Evolution of Microstructure in Polycrystalline Silicon Carbide.- Thermal Gradient Deposition of SiC Diffusion Tracers.- Contributors.