Showing papers on "Silicon oxide published in 2013"

Barrier materials for display devices

Abstract: Described herein are apparatus comprising one or more silicon-containing layers and a metal oxide layer. Also described herein are methods for forming one or more silicon-containing layers to be used, for example, as passivation layers in a display device. In one particular aspect, the apparatus comprises a transparent metal oxide layer, a silicon oxide layer and a silicon nitride layer. In this or other aspects, the apparatus is deposited at a temperature of 350° C. or below. The silicon-containing layers described herein comprise one or more of the following properties: a density of about 1.9 g/cm3 or greater; a hydrogen content of about 4×1022 cm−3 or less, and a transparency of about 90% or greater at 400-700 nm as measured by a UV-visible light spectrometer.

Quantum Conductance in Silicon Oxide Resistive Memory Devices

Abstract: Resistive switching offers a promising route to universal electronic memory, potentially replacing current technologies that are approaching their fundamental limits. In many cases switching originates from the reversible formation and dissolution of nanometre-scale conductive filaments, which constrain the motion of electrons, leading to the quantisation of device conductance into multiples of the fundamental unit of conductance, G0. Such quantum effects appear when the constriction diameter approaches the Fermi wavelength of the electron in the medium – typically several nanometres. Here we find that the conductance of silicon-rich silica (SiOx) resistive switches is quantised in half-integer multiples of G0. In contrast to other resistive switching systems this quantisation is intrinsic to SiOx, and is not due to drift of metallic ions. Half-integer quantisation is explained in terms of the filament structure and formation mechanism, which allows us to distinguish between systems that exhibit integer and half-integer quantisation.

Low Temperature Formation of Silicon Oxide Thin Films by Atomic Layer Deposition Using NH3/O2 Plasma

Abstract: High-quality silicon oxide (SiO2) thin films are deposited by plasma-enhanced atomic layer deposition (PEALD) using bis(diethylamino)silane as a Si precursor and ammonia/oxygen plasmas at a substrate temperature of 150 ◦ C. The SiO2 films are formed at a growth rate of ∼0.137 nm/cycle in high purity. The overall quality of the PEALD-SiO2 films are assessed by infrared spectroscopy, wet etch rate in 0.5% hydrofluoric solution, Auger electron spectroscopy, and current-voltage analysis. The quality of the films formed at low temperature using the combination of ammonia/oxygen plasmas compares well with deposition at higher temperatures (350 ◦ C) using oxygen plasma only.

Charateristics of Low Temperature High Quality Silicon Oxide by Plasma Enhanced Atomic Layer Deposition with In Situ Plasma Densification Process

Abstract: We have researched low temperature silicon oxide (SiO2) with improved electrical properties and excellent film step-coverage. In-situ O2 plasma densification (DENSIFICATION) effect on SiO2 that has been deposited by PE-ALD at temperature (<400°C) was investigated. The wet etch rate was controllable as a function of DENSIFICAION time due to repairing of the SiO2 network defects by the oxygen radicals. Angle Resolved X-ray Photoelectron Spectroscopy (AR-XPS) analysis was carried out to observe the core-level binding energies shifts (chemical shifts) in the different SiO2 films. The characteristics of wet etch rate of high quality low temperature SiO2 demonstrated lower than high temperature LP-CVD SiO2 values. Compared to LP-CVD SiO2, PE-ALD SiO2 with DENSIFICATION showed excellent I-V characteristics with lower leakage current and similar to the thermal SiO2 carrier transport plot.

Method for cleaning reaction chamber using pre-cleaning process

Abstract: A method for cleaning a reaction chamber is conducted after depositing an oxide, nitride, or oxynitride film on a substrate in a reaction chamber having interior surfaces on which oxide, nitride, or oxynitride is accumulated as a result of the deposition, said oxide, nitride, or oxynitride being selected from the group consisting of silicon oxide, silicon nitride, silicon oxynitride, metal oxide, metal nitride, and metal oxynitride. The method includes: oxidizing or nitriding the oxide, nitride, or oxynitride is accumulated on the interior surfaces of the reaction chamber, by RF-excited plasma of an oxygen- or nitrogen-containing gas in the absence of halide gas as a pre-cleaning step; and cleaning the interior surfaces of the reaction chamber, by RF-excited plasma of a halide cleaning gas.

Tungsten oxide processing

Abstract: Methods of selectively etching tungsten oxide relative to tungsten, silicon oxide, silicon nitride and/or titanium nitride are described. The methods include a remote plasma etch using plasma effluents formed from a fluorine-containing precursor in combination with ammonia (NH 3 ). Plasma effluents from the remote plasma are flowed into a substrate processing region where the plasma effluents react with the tungsten oxide. The plasmas effluents react with exposed surfaces and selectively remove tungsten oxide while very slowly removing other exposed materials. Increasing a flow of ammonia during the process removes a typical skin of tungsten oxide having higher oxidation coordination number first and then selectively etching lower oxidation tungsten oxide. In some embodiments, the tungsten oxide etch selectivity results partly from the presence of an ion suppression element positioned between the remote plasma and the substrate processing region.

Differential silicon oxide etch

Abstract: A method of etching exposed silicon oxide on patterned heterogeneous structures is described and includes a gas phase etch created from a remote plasma etch. The remote plasma excites a fluorine-containing precursor. Plasma effluents from the remote plasma are flowed into a substrate processing region where the plasma effluents combine with water vapor. Reactants thereby produced etch the patterned heterogeneous structures to remove two separate regions of differing silicon oxide at different etch rates. The methods may be used to remove low density silicon oxide while removing less high density silicon oxide.

Radical-component oxide etch

Abstract: A method of etching exposed silicon oxide on patterned heterogeneous structures is described and includes a remote plasma etch formed from a fluorine-containing precursor. Plasma effluents from the remote plasma are flowed into a substrate processing region where the plasma effluents combine with a nitrogen-and-hydrogen-containing precursor. Reactants thereby produced etch the patterned heterogeneous structures with high silicon oxide selectivity while the substrate is at high temperature compared to typical Siconi™ processes. The etch proceeds without producing residue on the substrate surface. The methods may be used to remove silicon oxide while removing little or no silicon, polysilicon, silicon nitride or titanium nitride.

Dry-etch for selective tungsten removal

Abstract: Methods of selectively etching tungsten relative to silicon-containing films (e.g. silicon oxide, silicon carbon nitride and (poly)silicon) as well as tungsten oxide are described. The methods include a remote plasma etch formed from a fluorine-containing precursor and/or hydrogen (H2). Plasma effluents from the remote plasma are flowed into a substrate processing region where the plasma effluents react with the tungsten. The plasma effluents react with exposed surfaces and selectively remove tungsten while very slowly removing other exposed materials. Sequential and simultaneous methods are included to remove thin tungsten oxide which may, for example, result from exposure to the atmosphere.

Selective titanium nitride removal

Abstract: Methods are described herein for selectively etching titanium nitride relative to dielectric films, which may include, for example, alternative metals and metal oxides lacking in titanium and/or silicon-containing films (e.g. silicon oxide, silicon carbon nitride and low-K dielectric films). The methods include a remote plasma etch formed from a chlorine-containing precursor. Plasma effluents from the remote plasma are flowed into a substrate processing region where the plasma effluents react with the titanium nitride. The plasma effluents react with exposed surfaces and selectively remove titanium nitride while very slowly removing the other exposed materials. The substrate processing region may also contain a plasma to facilitate breaking through any titanium oxide layer present on the titanium nitride. The plasma in the substrate processing region may be gently biased relative to the substrate to enhance removal rate of the titanium oxide layer.

Removal of native oxide with high selectivity

Abstract: Provided are methods and systems for removing a native silicon oxide layer on a wafer. In a non-sequential approach, a wafer is provided with a native silicon oxide layer on a polysilicon layer. An etchant including a hydrogen-based species and a fluorine-based species is introduced, exposed to a plasma, and flowed onto the wafer at a relatively low temperature. The wafer is then heated to a slightly elevated temperature to substantially remove the native oxide layer. In a sequential approach, a wafer is provided with a native silicon oxide layer. A first etchant including a hydrogen-based species and a fluorine-based species is flowed onto the wafer. Then the wafer is heated to a slightly elevated temperature, a second etchant is flowed towards the wafer, and the second etchant is exposed to a plasma to complete the removal of the native silicon oxide layer and to initiate removal of another layer such as a polysilicon layer.

Methods And Apparatus For Forming Tantalum Silicate Layers On Germanium Or III-V Semiconductor Devices

Abstract: Described are apparatus and methods for forming tantalum silicate layers on germanium or III-V materials. Such tantalum silicate layers may have Si/(Ta+Si) atomic ratios from about 0.01 to about 0.15. The tantalum silicate layers may be formed by atomic layer deposition of silicon oxide and tantalum oxide, followed by interdiffusion of the silicon oxide and tantalum oxide layers.

Silicon-carbon-nitride selective etch

Abstract: A method of etching exposed silicon-nitrogen-and-carbon-containing material on patterned heterogeneous structures is described and includes a remote plasma etch formed from a fluorine-containing precursor and an oxygen-containing precursor. Plasma effluents from the remote plasma are flowed into a substrate processing region where the plasma effluents react with the exposed regions of silicon-nitrogen-and-carbon-containing material. The plasma effluents react with the patterned heterogeneous structures to selectively remove silicon-nitrogen-and-carbon-containing material from the exposed silicon-nitrogen-and-carbon-containing material regions while very slowly removing selected other exposed materials. The silicon-nitrogen-and-carbon-containing material selectivity results partly from the presence of an ion suppression element positioned between the remote plasma and the substrate processing region. The ion suppression element controls the number of ionically-charged species that reach the substrate. The methods may be used to selectively remove silicon-nitrogen-and-carbon-containing material at a faster rate than exposed silicon oxide or exposed silicon nitride.

Dry-etch for selective oxidation removal

Abstract: Methods of selectively etching tungsten oxide relative to tungsten, silicon oxide, silicon nitride and/or titanium nitride are described. The methods include a remote plasma etch formed from a fluorine-containing precursor and/or hydrogen (H 2 ). Plasma effluents from the remote plasma are flowed into a substrate processing region where the plasma effluents react with the tungsten oxide. The plasmas effluents react with exposed surfaces and selectively remove tungsten oxide while very slowly removing other exposed materials. In some embodiments, the tungsten oxide selectivity results partly from the presence of an ion suppression element positioned between the remote plasma and the substrate processing region. The ion suppression element reduces or substantially eliminates the number of ionically-charged species that reach the substrate.

SiOx process chemistry development using microwave plasma CVD

Abstract: Methods for processing a substrate are described herein. Methods can include positioning a substrate in a processing chamber, maintaining the processing chamber at a temperature below 400° C., flowing a reactant gas comprising either a silicon hydride or a silicon halide and an oxidizing precursor into the process chamber, applying a microwave power to create a microwave plasma from the reactant gas, and depositing a silicon oxide layer on at least a portion of the exposed surface of a substrate.

A high capacity silicon–graphite composite as anode for lithium-ion batteries using low content amorphous silicon and compatible binders

Abstract: In this study, silicon–graphite composites were prepared and investigated as anode materials for Li-ion batteries with small amounts of silicon and different binders. The silicon powders were prepared by ball-milling crystalline silicon for 100 h and 200 h. After 200 h, an average silicon particle size of 0.73 μm was obtained and XRD measurements confirmed the formation of an amorphous powder embedded within nanocrystalline regions. XPS analysis of the silicon samples showed that silicon particles were covered with a native silicon oxide layer that grows during ball-milling. Battery cycling of the silicon powders in half cells showed that the powder ball milled for 200 h gave the lowest first-cycle irreversible capacity and the highest reversible capacity reaching over 500 mA h g−1 after 50 cycles at C/12. Composites were made using graphite and only 5 wt% silicon powders. The silicon was found to be uniformly dispersed into the composites as evidenced by X-ray mapping and SEM. When tested in half cells using different binders, it was found that the polyetherimide binder showed the highest capacity reaching 514 mA h g−1 after 350 cycles at C/12, which is 1.6 times greater than commercial graphite anode. High rate cycling showed good capacity retention reaching half the capacity at 5 C.

Roles of Oxygen and Interfacial Stabilization in Enhancing the Cycling Ability of Silicon Oxide Anodes for Rechargeable Lithium Batteries

Abstract: Film model electrodes of silicon oxide (SiOx) with various oxygen content (x = 0.4, 0.85, 1.0 and 1.3) have been studied for the effects of oxygen content and interfacial reaction behavior on cycling ability. IR and XPS analyses on the origin of initial charge plateau in 1M LiPF6/EC:DEC indicate that the contribution of electrolyte reduction to the plateau is far larger than the formation of lithium silicates, lithium oxide and silicon. Higher oxygen content of SiOx induces to decrease initial electrolyte reduction, whereas larger fraction of oxides is subjected to dissolution by acid (e.g., HF)-etching. Cycling ability at higher oxygen content however is remarkably improved when constructing a surface protective siloxane network at the electrodes using silane electrolyte additive. The SiO1.0 electrode exhibits superior capacity retention of 84% at the 200th cycle delivering discharge capacity of 1206–1017 mAh/g. The SEI layer formed over surface siloxane network consists of a plenty of organic compounds and lithium carbonate, in contrast to mainly inorganic salts and organic phosphorus fluoride compounds upon cycling without silane adidtive. A better protection and passivation of electrode surface should be of the effects of siloxane network, and in that fashion cycling ability is greatly stabilized.

Directional SiO2 etch using plasma pre-treatment and high-temperature etchant deposition

Abstract: Methods for processing a substrate are described herein. Methods can include positioning a substrate with an exposed surface comprising a silicon oxide layer in a processing chamber, biasing the substrate, treating the substrate to roughen a portion of the silicon oxide layer, heating the substrate to a first temperature, exposing the exposed surface of the substrate to ammonium fluoride to form one or more volatile products while maintaining the first temperature, and heating the substrate to a second temperature, which is higher than the first temperature, to sublimate the volatile products.

Characteristics and Mechanisms of Silicon-Oxide-Based Resistance Random Access Memory

Abstract: Traditionally, a large number of silicon oxide materials are extensively used as various dielectrics for semiconductor industries. In general, silicon oxide cannot be used as resistance random access memory (RRAM) due to its insulating electrical properties. In this letter, we have successfully produced resistive switching and forming-free behaviors by zinc doped into silicon oxide. The current-voltage fitting data show that current transport mechanism is governed by Poole-Frenkel behavior in high-resistance state and Ohm's law in low-resistance state, consisting with filament theory. Additionally, good endurance and retention reliabilities are exhibited in the zinc-doped silicon oxide RRAM.

Silicon oxide recess etch

Abstract: A method of etching silicon oxide from a trench is described which allows more homogeneous etch rates across a varying pattern on a patterned substrate. The method also provides a more rectilinear profile following the etch process. Methods include a sequential exposure of gapfill silicon oxide. The gapfill silicon oxide is exposed to a local plasma treatment prior to a remote-plasma dry etch which may produce salt by-product on the surface. The local plasma treatment has been found to condition the gapfill silicon oxide such that the etch process proceeds at a more even rate within each trench and across multiple trenches. The salt by-product may be removed by raising the temperature in a subsequent sublimation step.

Semiconductor packages, methods of manufacturing the same, and semiconductor package structures including the same

Abstract: A semiconductor device includes a substrate including a first surface and a second surface opposite to each other, a through-via electrode extending through the substrate The through-via electrode has an interconnection metal layer and a barrier metal layer surrounding a side surface of the interconnection metal layer One end of the through-via electrode protrudes above the second surface A spacer insulating layer may be provided on an outer sidewall of the through-via electrode A through-via electrode pad is connected to the through-via electrode and extends on the spacer insulating layer substantially parallel to the second surface A first silicon oxide layer and a silicon nitride layer are stacked on the second surface A thickness of the first silicon oxide layer is greater than a thickness of the silicon nitride layer

FinFET device and method of fabricating same

Abstract: An integrated circuit structure includes a semiconductor substrate, and isolation regions extending into the semiconductor substrate, wherein the isolation regions have opposite sidewalls facing each other. A fin structure includes a silicon fin higher than top surfaces of the isolation regions, a germanium-containing semiconductor region overlapped by the silicon fin, silicon oxide regions on opposite sides of the germanium-containing semiconductor region, and a germanium-containing semiconductor layer between and in contact with the silicon fin and one of the silicon oxide regions.

Temperature-Stable Silicon Oxide (SilOx) Micromechanical Resonators

Abstract: This paper presents a passive temperature compensation technique that can provide full cancellation of the linear temperature coefficient of frequency (TCF1) in silicon resonators. A uniformly distributed matrix of silicon dioxide pillars is embedded inside the silicon substrate to form a homogenous composite silicon oxide platform (SilOx) with nearly perfect temperature-compensated stiffness moduli. This composite platform enables the implementation of temperature-stable microresonators operating in any desired in- and out-of-plane resonance modes. Full compensation of TCF1 is achieved for extensional and shear modes of SilOx resonators resulting in a quadratic temperature characteristic with an overall frequency drift as low as 83 ppm over the industrial temperature range ( -40°C to 80°C). Besides a 40 times reduction in temperature-induced frequency drift in this range, SilOx resonators exhibit improved temperature stability of Q compared with their single crystal silicon counterparts.

Method for manufacturing semiconductor device

Abstract: According to one embodiment, a method for manufacturing a semiconductor device includes forming a film containing boron on a semiconductor substrate, forming a film containing silicon oxide on the film containing boron, patterning the film containing silicon oxide and etching the film containing boron with a gas containing chlorine by using the patterned film containing silicon oxide as a mask.

Optimized amorphous silicon oxide buffer layers for silicon heterojunction solar cells with microcrystalline silicon oxide contact layers

Abstract: We report on the systematic optimization of the intrinsic amorphous silicon oxide buffer layer in interplay with doped microcrystalline silicon oxide contact layers for silicon heterojunction solar cells using all silicon oxide based functional layers on flat p-type float-zone wafers. While the surface passivation quality is comparably good within a wide range of low oxygen contents, the optical band gap increases and the dark conductivity decreases with increasing oxygen content, giving rise to an inevitable trade-off between optical transparency and electrical conductivity. On the cell level, fill factor FF and short circuit current density Jsc losses compete with the open circuit voltage Voc gains resulting from a thickness increase of the front buffer layers, whereas Jsc and Voc gains compete with FF losses resulting from increasing thickness of the rear buffer layers. We obtained the highest active area efficiency of ηact = 18.5% with Voc = 664 mV, Jsc = 35.7 mA/cm2, and FF = 78.0% using 4 nm front a...

Oxide removal by remote plasma treatment with fluorine and oxygen radicals

Abstract: Oxides (e.g., native or thermal silicon oxide) are etched from underlying silicon with a mixture of fluorine and oxygen radicals generated by a remote plasma. The oxygen radicals rapidly oxidize any uncovered bare silicon areas, preventing the pitting that can result from fluorine etching bare silicon more rapidly than it etches the surrounding oxide. A very thin (few Å), highly uniform passivation layer remaining on the silicon after the process may be left in place or removed. An oxygen-impermeable layer may be formed in-situ immediately afterward to prevent further oxidation. A pre-treatment with oxygen radicals alone fills pores and gaps in the oxide before etching begins.

Methods for depositing films on sensitive substrates

Abstract: Methods and apparatus to form films on sensitive substrates while preventing damage to the sensitive substrate are provided herein. In certain embodiments, methods involve forming a bilayer film on a sensitive substrate that both protects the underlying substrate from damage and possesses desired electrical properties. Also provided are methods and apparatus for evaluating and optimizing the films, including methods to evaluate the amount of substrate damage resulting from a particular deposition process and methods to determine the minimum thickness of a protective layer. The methods and apparatus described herein may be used to deposit films on a variety of sensitive materials such as silicon, cobalt, germanium-antimony-tellerium, silicon-germanium, silicon nitride, silicon carbide, tungsten, titanium, tantalum, chromium, nickel, palladium, ruthenium, or silicon oxide.