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Silicon oxide

About: Silicon oxide is a research topic. Over the lifetime, 22220 publications have been published within this topic receiving 260986 citations.


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Patent
22 Sep 1998
TL;DR: In this article, the authors proposed a method of film formation in which a silicon oxide film (a NSG film: a Non-doped Silicate Glass) is formed on a substrate having a recess by a CVD method using a mixed gas containing TEOS and ozone.
Abstract: This invention relates to a method of film formation in which, when a silicon oxide film (a NSG film: a Non-doped Silicate Glass) is formed on a substrate having a recess by a CVD method using a mixed gas containing TEOS and ozone, surface dependency on the substrate is eliminated to embed a silicon oxide film into the recess of the surface. The invention includes forming a phosphorus containing insulating film as a base layer on the surface of a substrate and forming a silicon-containing insulating film on the phosphosilicate glass film by the chemical vapor deposition method, using a mixture of a ozone-containing gas and a silicon-containing gas.

167 citations

Patent
Koga Hiroki1
11 Mar 2003
TL;DR: In this article, a gate is formed between two impurity regions in a semiconductor substrate, and a gate electrode is formed on the gate insulating film, and then a silicon oxide film is created on the side of the gate electrode.
Abstract: A semiconductor device has a pair of impurity regions in a semiconductor substrate. A silicon layer is formed on the impurity region. A gate insulating film is formed between the impurity regions. A gate electrode is formed on the gate insulating film. A first silicon nitride film is formed on the gate electrode. A silicon oxide film is formed on a side surface of the gate electrode. A second silicon nitride film is partially formed on the silicon layer and on a side surface of the silicon oxide film. A conductive layer is formed on the silicon layer.

167 citations

Journal ArticleDOI
TL;DR: The integration of electronic circuitry and neuronal networks requires a bidirectional electrical communication between silicon elements and nerve cells and the successful assembly of a neuron-to-silicon junction is reported with direct signal transfer from an individual neuron to a microscopic metal-free fieldeffect transistor.
Abstract: An identified nerve cell of the leech is attached to a planar silicon microstructure of p-doped silicon covered by a thin layer of insulating silicon oxide. A voltage step, applied between silicon and electrolyte, induces a capacitive transient in the cell which elicits an action potential. The capacitive extracellular stimulation is described by an equivalent electrical four-pole.

166 citations

Patent
Li-Qun Xia1, Fabrice Geiger1, Frederic Gaillard1, Ellie Yieh1, Tian H. Lim1 
04 May 1999
TL;DR: In this article, a low dielectric constant (LDC) film is a carbon-doped silicon oxide layer deposited from a thermal, as opposed to plasma, CVD process.
Abstract: A method for providing a dielectric film having a low dielectric constant. The deposited film is particularly useful as an intermetal or premetal dielectric layer in an integrated circuit. The low dielectric constant film is a carbon-doped silicon oxide layer deposited from a thermal, as opposed to plasma, CVD process. The layer is deposited from a process gas of ozone and an organosilane precursor having at least one silicon-carbon (Si—C) bond. During the deposition process the wafer is heated to a temperature less than 250° C. and preferably to a temperature between 100-200° C. Enhancements to the process include adding Boron and/or Phosphorus dopants, two step deposition, and capping the post cured layer.

166 citations

Journal ArticleDOI
TL;DR: In this article, Braun et al. present a survey of the state of the art in the field of bioinformatics with respect to the use of artificial neural networks (ANNs).
Abstract: Received date: August 27, 2001 Final version: October 17, 2001 ± [1] D. Braun, A. J. Heeger, Appl. Phys. Lett. 1995, 66, 2540. [2] J. H. Schön, C. Kloc, A. Dodabalapur, B. Batlogg, Science 2000, 289, 599. [3] N. Karl, J. Lumin. 1976, 12/13, 851. [4] M. Nagawa, M. Ichikawa, T. Koyama, H. Shirai, Y. Taniguchi, A. Hongo, S. Tsuji, Y. Nakano, Appl. Phys. Lett. 2000, 77, 2641. [5] R. Gupta, M. Stevenson, A. Dogariu, M. D. McGehee, J. Y. Park, V. Srdanov, A. J. Heeger, H. Wang, Appl. Phys. Lett. 1998, 73, 3492. [6] M. Berggren, A. Dodabalapur, R. E. Slusher, Appl. Phys. Lett. 1997, 71, 2230. [7] V. G. Kozlov, V. Bulovi, P. E. Burrows, S. R. Forrest, Nature 1997, 389, 362. [8] Y. C. Kim, T.-W. Lee, O. O. Park, C. Y. Kim, H. N. Cho, Adv. Mater. 2001, 13, 646. [9] D. Fichou, S. Delysse, J.-M. Nunzi, Adv. Mater. 1997, 9, 1178. [10] M. D. McGehee, A. J. Heeger, Adv. Mater. 2000, 12, 1655. [11] H. Yanagi, T. Morikawa, Appl. Phys. Lett. 1999, 75, 187. [12] H. Yanagi, T. Morikawa, S. Hotta, K. Yase, Adv. Mater. 2001, 13, 313. [13] a) S. Hotta, H. Kimura, S. A. Lee, T. Tamaki, J. Heterocycl. Chem. 2000, 37, 281. b) S. Hotta, S. A. Lee, T. Tamaki, J. Heterocycl. Chem. 2000, 37, 25. [14] M. G. Liu, M. H. Jiang, X. T. Tao, D. R. Yuan, D. Xu, N. Zhang, Z. S. Shao, J. Mater. Sci. Lett. 1994, 13, 146. [15] S. A. Lee, Y. Yoshida, M. Fukuyama, S. Hotta, Synth. Met. 1999, 106, 39. [16] a) M. R. Unroe, B. A. Reinhardt, Synthesis, 1987, 981. b) W. Kern, W. Heitz, H. O. Wirth, Makromol. Chem. 1960, 40, 189. [17] S. Hotta, Y. Ichino, Y. Yoshida, M. Yoshida, J. Phys. Chem. B 2000, 104, 10 316. [18] S. Hotta, K. Waragai, Adv. Mater. 1993, 5, 896.

165 citations


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Performance
Metrics
No. of papers in the topic in previous years
YearPapers
202323
202253
2021199
2020524
2019649
2018621