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Single crystal

About: Single crystal is a research topic. Over the lifetime, 59617 publications have been published within this topic receiving 870828 citations.


Papers
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Journal ArticleDOI
TL;DR: In this article, the Fowler-Nordheim theory was applied to the (011) and (112) planes of tungsten and the results showed that the current density in the (1) plane is 4 to 5 orders of magnitude smaller than in strongly emitting planes.
Abstract: The work functions of the low emitting crystallographic planes of tungsten, (011) and (112), are not well known. In previous experiments scattered secondaries and some other disturbing effects covered the small emission particularly of the (011) plane. A method combining the field emission microscope with a probe collector has been applied. The current density in the (011) plane turned out to be 4 to 5 orders of magnitude smaller than in strongly emitting planes. Applying the Fowler‐Nordheim theory, φ011 was found between 5.70 and 5.99 ev and φ112 between 4.65 and 4.88 ev depending on the temperature at which the tungsten crystal has been annealed previously. This is not a temperature effect of the work function, but the result of freezing in thermal imperfections of the planes. The work function of the ideal (011) plane appears to be as high as 5.99 ev. The existence of such a high value is further suggested by the ionization of aluminum on a hot polycrystalline tungsten wire, indicating that a part of t...

152 citations

Patent
16 Apr 1993
TL;DR: In this paper, a gallium nitride type semiconductor device with a single crystal of (Ga 1-x Al x ) 1-y In y N, which suppresses the occurrence of crystal defects and thus has very high crystallization and considerably excellent flatness, and a method of fabricating the same.
Abstract: Disclosed are a gallium nitride type semiconductor device that has a single crystal of (Ga 1-x Al x ) 1-y In y N, which suppresses the occurrence of crystal defects and thus has very high crystallization and considerably excellent flatness, and a method of fabricating the same. The gallium nitride type semiconductor device comprises a silicon substrate, an intermediate layer consisting of a compound containing at least aluminum and nitrogen and formed on the silicon substrate, and a crystal layer of (Ga 1-x Al x ) 1-y In y N (0≦x≧1, 0≦y≦1, excluding the case of x=1 and y=0). According to the method of fabricating a gallium nitride base semiconductor device, a silicon single crystal substrate is kept at a temperature of 400° to 1300° C. and is held in the atmosphere where a metaloganic compound containing at least aluminum and a nitrogen-containing compound are present to form a thin intermediate layer containing at least aluminum and nitrogen on a part or the entirety of the surface of the single crystal substrate, and then at least one layer or multiple layers of a single crystal of (Ga 1-x Al x ).sub. 1-y In y N are formed on the intermediate layer.

152 citations

Journal ArticleDOI
TL;DR: In this article, the diffusion coefficient of hydrogen in zirconium, Zircaloy-2 and Zirca-4 was determined in the temperature range, 275 °C to 700 °C.

152 citations

Journal ArticleDOI
01 Jan 1991-Polymer
TL;DR: In this article, the structural relationship between α and γ phases makes it possible to determine the left or right-handed chirality of all helices in the single crystals.

152 citations


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Performance
Metrics
No. of papers in the topic in previous years
YearPapers
2023485
20221,042
20211,353
20201,795
20191,797
20181,782