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Snapback

About: Snapback is a research topic. Over the lifetime, 742 publications have been published within this topic receiving 8225 citations.


Papers
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Book ChapterDOI
01 Jan 1998
TL;DR: In this paper, a SiGe heterojunction buried layer structure was proposed to eliminate non-simultaneous triggering effects in finger-type ESD protection transistor using SiGe Heterojunction (HJ) structures.
Abstract: This paper presents a novel technique to eliminate non-simultaneous triggering effects in finger-type ESD protection transistor using SiGe heterojunction buried layer structures. It is confirmed that lower snapback voltage and maximum lattice temperature are obtainable in the new structure based on device simulation. As a result, current localization and lattice overheating of a finger-type protection transistor caused by process variations can be avoided in this structure.

3 citations

Proceedings Article
01 Sep 2006
TL;DR: In this article, a dual-direction NWELL isolated snapback NMOS and a lateral SCR structure using a shared regions approach was proposed for system level ESD protection.
Abstract: A novel dual-direction device is suggested for system level ESD protection. The device combines both a deep NWELL isolated snapback NMOS and a lateral SCR structure using a shared regions approach. ESD pulse operation of the device has been experimentally studied for a 0.35 mum 5 V CMOS process by numerical simulation and then experimentally validated for system level IEC specification requirements.

3 citations

Patent
09 Jan 2003
TL;DR: In this paper, an ESD protection circuit and method of protecting the ports of the multiple port circuit, including providing a plurality of bi-directional snapback devices such as DIACs and connecting only one electrode to ground while connecting the other electrodes to the ports that are to be protected.
Abstract: In multiple port chip circuit, an ESD protection circuit and method of protecting the ports of the multiple port circuit, includes providing a plurality of bi-directional snapback devices such as DIACs and connecting only one electrode to ground while connecting the other electrodes to the ports that are to be protected.

3 citations

Journal ArticleDOI
TL;DR: In this paper, an improved grounded-gate N-channel metal-oxide semiconductor (GGNMOS) transistor triggered silicon-controlled rectifier (SCR) structure, named GGSCR, is proposed for high holding voltage ESD protection applications.
Abstract: Developing an electrostatic discharge (ESD) protection device with a better latch-up immunity has been a challenging issue for the nanometer complementary metal-oxide semiconductor (CMOS) technology. In this work, an improved grounded-gate N-channel metal-oxide semiconductor (GGNMOS) transistor triggered silicon-controlled rectifier (SCR) structure, named GGSCR, is proposed for high holding voltage ESD protection applications. The GGSCR demonstrates a double snapback behavior as a result of progressive trigger-on of the GGNMOS and SCR. The double snapback makes the holding voltage increase from 3.43 V to 6.25 V as compared with the conventional low-voltage SCR. The TCAD simulations are carried out to verify the modes of operation of the device.

3 citations

Proceedings ArticleDOI
Wei Mao1, Weiying Li1, Yu Tian1, B. Vrignon1, John Shepherd1, Richard Wang1 
21 May 2012
TL;DR: In this article, a precise integrated circuit immunity model (ICIM) of electrostatic discharge (ESD) protection pads is developed and validated, which consists of a parasitic RC network model and an ESD snapback model.
Abstract: Accurate prediction of the response of integrated circuit (IC) to electromagnetic interferences (EMI) is increasingly important. In this paper, a precise integrated circuit immunity model (ICIM) of electrostatic discharge (ESD) protection pads is developed and validated. The model consists of a parasitic RC network model and an ESD snapback model. The parameters of the physically-based parasitic RC network model are extracted from specifically designed structures with ESD pads and validated by S-parameter measurement data. The combined model is able to predict the immunity level more precisely and better support the immunity simulation of circuit under direct power injection (DPI) test.

3 citations


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Performance
Metrics
No. of papers in the topic in previous years
YearPapers
202310
202227
202127
202033
201939
201824