Showing papers on "Sodium hypophosphite published in 1988"
TL;DR: In this article, the phase transformation temperature was independent of the phosphorus content, whereas the texture approached the random orientation with increasing phosphorus content in the Ni-P solid-solution grains.
Abstract: Electroless Ni-7.4 to 10% P deposits obtained from acidic nickel sulphate baths with sodium hypophosphite as a reducing agent were analysed by transmission electron microscopy, X-ray diffraction and thermal analysis. The deposits could be represented better by a microcrystalline structure composed of 4 to 5 nm fcc Ni-P solid-solution grains rather than an amorphous structure. The deposits also had the (111) texture, which persisted in nickel grains even after phase separation of nickel and Ni3P by heating in the case of the low nickel content, whereas the texture approached the random orientation with increasing phosphorus content. The phase transformation temperature was independent of the phosphorus content.
107 citations
Patent•
29 Nov 1988
TL;DR: In this article, an Al disk as a disk substrate is degreased, pickled, zincated, and plated with an Ni-P alloy to 20mum thickness, and it is lapped and immersed in a plating bath.
Abstract: PURPOSE:To obtain a magnetic disk having high resolving power and satisfactory overwriting characteristics by forming magnetic layers whose coercive force is increased toward the center of a disk. CONSTITUTION:An Al disk as a disk substrate is degreased, pickled, zincated, and plated with an Ni-P alloy to 20mum thickness, and it is lapped and immersed in a plating bath. The plating bath is prepd. by adjusting an aqueous soln. contg. CoSO4, NiSO4, sodium hypophosphite, sodium malate, sodium tartrate, (NH4)2SO4 and boric acid to 9.0pH with an NaOH soln. The substrate is rotated at 150r.p.m. in the plating bath at 70 deg.C with a plating jig having 5-200r.p.m. variable speed, and the substrate is plated to obtain a magnetic disk having magnetic films each having 580Angstrom thickness and 750Oe coercive force at the inner part and 750Angstrom thickness and 650Oe coercive force at the outer part by making use of a change in plating speed due to the difference in relative speed between the plating soln. and the substrate to be plated. The change in plating speed is characteristic of electroless magnetic plating. The resulting magnetic disk has high resolving power, satisfactory overwriting characteristics and uniform output characteristics at the inner and outer parts.
70 citations
TL;DR: In this article, the optimum conditions for the electrodeposition of amorphous fe-P alloys from sulphate electrolytes, containing complex-forming additives (glycine and oxalic acid) and sodium hypophosphite, were established.
Abstract: Optimum conditions have been established for the electrodeposition of amorphous fe-P alloys from sulphate electrolytes, containing complex-forming additives (glycine and oxalic acid) and sodium hypophosphite. It was shown that the increase of pH, current density and glycine content in the plating solution leads to a decrease of the amount of phosphorus in the Fe-P alloy. The cathodic current yield decreases with the increase of glycine concentration in the electrolyte. Small amounts of Cu2+ and Mn2+ act as brighteners. Sodium hypophosphite exerts a depolarizing effect on the alloy formation process. This effect is more pronounced at low hypophosphite concentrations and low cathodic current densities (CCD). The measurement of the cathodic potential during the deposition of the investigated alloy provides no evidence for a concentration change of phosphorus in the electrodeposited layers. No qualitative alterations of the surface morphology of the amorphous coatings studied have been established as the composition of the alloy and the plating conditions are changed.
34 citations
TL;DR: Several nitrite-free meat-curing mixtures have been formulated that imparted to meat a similar oxidative stability as that of sodium nitrite and dinitrosyl ferrochemochrome (DNFH).
30 citations
Patent•
16 Mar 1988
TL;DR: In this paper, a process to make high corrosion resistant of Nickel-phosphorus alloy (P10-11%) layer by electroplating is described, where the electroplate is carried out at 65 to 75 deg.C and at 1 to 2 A/DM2 of current density on the cathode and by using nickel as anode.
Abstract: :The present invention relates to a process to make high corrosion resistant of Nickel-phosphorus alloy (P10-11%) layer by electroplating. Wherein electroplating solution consists fo 120 to 300 g/l of Nickel sulphate, 45 g/l Nickel chloride, 45 to 90 g/l sodium hypophosphite, 30 to 40 g/l orthoboric acid and 20 to 40 g/l sodium chloride. The electroplate is carried out at 65 to 75 deg.C and at 1 to 2 A/dm2 of current density on the cathode and by using nickel as anode. The present invention is characterized in that a special treatment of the electroplate solution before electroplating makes sodium hypophosphite with nickel ion form complex ion and increase chemical stability of the electroplate solution. PH value of the elevtroplating solution must be controled within 2.0 to 2.8, P/Ni (by weight ) in the solution be kept at 0.3 or more.
8 citations
Patent•
18 Jan 1988
TL;DR: In this article, an electroless tin-lead alloy plating bath contains org. sulfonic acid, bivalent tin and lead salts thereof, sodium hypophosphite as a reducing agent and thiourea as a complexing agent as essential components or further contains a pH adjusting agent such as citric acid, tartaric acid or malic acid, a surfactant such as lauryl pyridinium chloride or sodium laurylsulfate and a brightener.
Abstract: PURPOSE:To weaken attack on a substrate and to improve the adhesion of a plating film to it by using specified org. sulfonic acid, tin and lead salts thereof, sodium hypophosphite as a reducing agent and thiourea as a complexing agent for essential components of the plating bath. CONSTITUTION:This electroless tin-lead alloy plating bath contains org. sulfonic acid selected among alkanesulfonic acid, alkanosulfonic acid and arom. sulfonic acid, bivalent tin and lead salts thereof, sodium hypophosphite as a reducing agent and thiourea as a complexing agent as essential components or further contains a pH adjusting agent such as citric acid, tartaric acid or malic acid, a surfactant such as lauryl pyridinium chloride or sodium laurylsulfate and a brightener as required. When electroless plating is carried out with the plating bath, a uniform, smooth tin-lead alloy plating film can be formed with high work efficiency.
8 citations
Patent•
16 Jun 1988TL;DR: In this paper, a process for the fabrication of a polyamide article is disclosed, in which a composition of a linear aliphatic polyamide, 0.01-5% by weight of an epoxide and 0.005-1.0% of a catalyst selected from catalysts of the type used in the polymerization of polyamides and epoxide ring-opening compounds is admixed in a manner that provides an effectively uniform admixture and extruded.
Abstract: OF THE DISCLOSURE A process for the fabrication of a polyamide article is disclosed, in which a composition of a linear aliphatic polyamide, 0.01-5% by weight of an epoxide and 0.005-1.0% by weight of a catalyst selected from catalysts of the type used in the polymerization of polyamides and epoxide ring-opening compounds is admixed in a manner that provides an effectively uniform admixture and extruded. The epoxide compounds have at least two terminal epoxy groups and a molecular weight of less than 1000. A preferred catalyst is sodium hypophosphite. Increases in melt viscosity of the polyamide in excess of four-fold may be obtained. The compositions may be used in the formation of film by a blown film process, the blow moulding of bottles, thermoforming processes or the like.
7 citations
Patent•
20 May 1988
TL;DR: In this article, Japio et al. proposed to obtain high mold release ability without using an external mold releasing agent, by forming nickel-phosphorus films on the surface of metal molds.
Abstract: PURPOSE: To obtain high mold release ability without using an external mold releasing agent, by forming nickel-phosphorus films on the surface of metal molds. CONSTITUTION: Nickel-phosphorus films 3 and 4 are formed on the surface of seal metal molds 1 and 2 for resin-sealed type semiconductor device which are used in sealing a semiconductor element 6 mounted on a lead frame 5 with resin by transfer shaping. For example, the nickel-phosphorus films 3 and 4 are formed by electroless deposition with plating liquid having pH 3 to 6, the principal components of which are sodium hypophosphite and nickel sulfate, and containing 7 to 15% of phosphorus. Desirable conditions of heat treatment after plating are at 280°C and for 30 minutes to form films of about 800Hv of Vickers hardness or higher. The films about 40μm thick are formed first and are then polished to be 3 to 5μm thick finally. COPYRIGHT: (C)1989,JPO&Japio
6 citations
Patent•
14 Jun 1988TL;DR: In this paper, a process for the fabrication of a polyamide article is disclosed, in which a composition of a linear aliphatic polyamide, 0.01-5% by weight of an epoxide and 0.005-1.0% of a catalyst selected from catalysts of the type used in the polymerization of polyamides and epoxide ring-opening compounds is admixed in a manner that provides an effectively uniform admixture and extruded.
Abstract: A process for the fabrication of a polyamide article is disclosed, in which a composition of a linear aliphatic polyamide, 0.01-5% by weight of an epoxide and 0.005-1.0% by weight of a catalyst selected from catalysts of the type used in the polymerization of polyamides and epoxide ring-opening compounds is admixed in a manner that provides an effectively uniform admixture and extruded. The epoxide compounds have at least two terminal epoxy groups and a molecular weight of less than 1000. A preferred catalyst is sodium hypophosphite. Increases in melt viscosity of the polyamide in excess of four-fold may be obtained. The compositions may be used in the formation of film by a blown film process, the blow moulding of bottles, thermoforming processes or the like.
5 citations
Patent•
22 Jan 1988
TL;DR: In this article, a gray plated film having superior corrosion and wear resistances was obtained by adding a specified amount of one or more kinds of amines to an Sn-Ni alloy plating bath having a specified composition.
Abstract: PURPOSE:To obtain a gray plated film having superior corrosion and wear resistances by adding a specified amount of one or more kinds of org. amines to an Sn-Ni alloy plating bath having a specified composition and by carrying out plating with the resulting plating bath. CONSTITUTION:A basic plating soln. contg. 100-500g/l (expressed in terms of metal Ni) nickel chloride, 5-120g/l (expressed in terms of metal Sn) tin chloride, 20-120g/l acidic ammonium fluoride, 2-50g/l sodium phosphite or sodium hypophosphite and 9-75g/l sulfuric acid is prepd. and 10-120ml/l or 2-30g/l one or more kinds of org. amines such as ethylenediamine are added to the plating soln. Plating is carried out with the resulting plating soln. of 3.0-6.5 pH at 30-80 deg.C and 0.04-2.0A/dm current density. A plated Sn-Ni alloy film having a noble gray color, superior corrosion and wear resistances can be formed.
3 citations
TL;DR: Sodium hypophosphite can be added to terminal hydrocarbon double bonds under specific conditions, according to a Free radical mechanism as discussed by the authors, which produces sodium monocctylphosphinate as the main reaction product, and the amount of dimer compound obtained is almost unsignificant.
Abstract: Sodium hypophosphite can be added to terminal hydrocarbon double bonds under specific conditions, according to a Free radical mechanism. The direct reaction using sodium hypophosphite produces sodium monaoctylphosphinate as the main reaction product, and the amount of dimer compound obtained is almost unsignificant. The reaction has been applied using 1-octene and, after purification of the monomer and dimer as acid compounds, the reaction yields have been determined. Surfactant properties, such as surface tension, wetting power and foaming power of the pure sodium monocctylphosphinate have bean measured.
Patent•
10 Aug 1988
TL;DR: In this paper, an aq. ammonia soln. is used as an electroplating soln for forming an Ni-P plating film having superior corrosion resistance, hardness, contact resistance, fine appearance and luster.
Abstract: PURPOSE:To obtain an electroplating soln. for forming an Ni-P alloy film having superior corrosion resistance, hardness, contact resistance, fine appearance and luster by adding sodium citrate, sodium hydroxide, nickel hydroxide and an aq. ammonia soln. to nickel sulfate, sodium hypophosphite and phosphoric acid as principal components. CONSTITUTION:An aq. soln. contg. 10-450g/l nickel sulfate, 1-25g/l sodium hypophosphite, 10-100g/l phosphoric acid, 20g/l - saturation amt. of sodium citrate, sodium hydroxide by an amt. required to neutralize excess phosphoric acid, 1-25g/l nickel hydroxide and 2-20ml/l aq. ammonia soln. is used as an electroplating soln. for forming an Ni-P plating film having superior corrosion resistance, hardness, contact resistance, fine appearance and luster as the electrical contact of a connector, a reed switch or the like.
Patent•
05 Dec 1988
TL;DR: In this article, a metal colloid such as Pd colloid is added to a bath contg an inorg metal salt such as chloride or sulfate of Ni or Co or a complexing agent forming a complex salt, such as ammonia, ethylene-diamine, pyrophosphate or citric acid.
Abstract: PURPOSE:To produce fine metal powder having unique electrical and magnetic characteristics by adding metal colloid to a bath contg an inorg metal salt or a complex salt and a reducing agent for the salt with stirring and by mixing them CONSTITUTION:Metal colloid such as Pd colloid is added to a bath contg an inorg metal salt such as chloride or sulfate of Ni or Co or a complexing agent forming a complex salt such as ammonia, ethylene-diamine, pyrophosphate or citric acid and further contg a reducing agent such as sodium hypophosphite, potassium hypophosphite or form-aldehyde and they are mixed The Pd colloid acts as the nuclei of a catalyst and reduction reaction proceeds rapidly and uniformly around the nuclei, so useful metal powder having superior electrical and magnetic characteristics can stably be produced
Patent•
16 Apr 1988
TL;DR: In this article, the authors describe a process for electroless chemically reductive deposition of ternary, nickel and phosphorus-containing alloys from aqueous, nickel ions and containing sodium hypophosphite or other reducing agent in the presence of organic compounds.
Abstract: The invention relates to a process for electroless chemically reductive deposition of ternary, nickel and phosphorus-containing alloys from aqueous, nickel ions and containing sodium hypophosphite or other reducing agent aqueous solutions in the presence of organic compounds, which is characterized ge that one metallic or nichtme-metallic materials after appropriate pretreatment ternary for depositing Ni-WP alloys lung at a pH value in the range from 4.5 to 9.5 immersed in an aq membered solution containing nickel ions, tungstate ions and sodium hypophosphite or other reducing agent and optionally buffer substances, or deposition of ternary Ni-Co-P alloys appeared at a pH in the range of 4.5 to 9.5 into an aqueous solution containing nickel ions, cobalt ions and sodium hypochlorite phosphite or other reducing agent and, where appropriate, buffer substances containing membered the respective aq solutions in addition organ to sets ic carboxylic acids as complexing agents, stabilizers and accelerators and, optionally, organic carboxylic acids or 8-hydroxyquinoline as a wetting agent and a brightener, and the materials then optionally heat treated.
Patent•
08 Dec 1988TL;DR: In this article, a semi-refined mixture of adipic, glutaric and succinic acids is recovered from an aqueous mixture comprising the acids together with catalyst residues and impurities.
Abstract: of EP0128709A process is disclosed for recovering a semi-refined mixture of adipic, glutaric and succinic acids from an aqueous mixture comprising the acids together with catalyst residues and impurities. The process comprises the steps of: (a) adding to the aqueous mixture a reducing agent consisting essentially of hypophosphorous acid or sodium hypophosphite; (b) concentrating the resulting aqueous mixture to remove water to produce a substantially dehydrated mixture; and (c) feeding the substantially dehydrated mixture to an evaporator and evaporating therefrom a mixture of adipic, glutaric and succinic acids. The mixture of adipic, glutaric and succinic acids may then be condensed as a molten material and fed to a flaker to produce a product in flake form.
Patent•
28 Nov 1988
TL;DR: In this article, a plating process of a vertically magnetized film with excellent coersive characteristics and appearance applicable to a magnetic drum, etc., of a magnetic encoder by a method wherein the magnetized films is electrolyzed in specific current density (e) in an electrolyte containing respective specific quantities of cobalt chloride, sodium hypophosphite, ammonium chloride and specific non-ionic interfacial active agent.
Abstract: PURPOSE:To invent a plating process of a vertically magnetized film with excellent coersive characteristics and appearance applicable to a magnetic drum, etc., of a magnetic encoder by a method wherein the magnetized film is electrolyzed in specific current density (e) in an electrolyte containing respective specific quantities of cobalt chloride, sodium hypophosphite, ammonium chloride and specific non-ionic interfacial active agent. CONSTITUTION:In an electrolyte containing 80g/l-200g/l of cobalt hexa hydrochloride, 40g/l-90g/l of sodium hypophosphite, 80g/l-150g/l of ammonium chloride and 0.04g/l-2g/l of non-ionic interfacial active agent containing both of ether coupled group and hydroxyl group, a magnetic film is electrolyzed in mean current density of 2A/dm -8A/dm . Through these procedures, the magnetic film even if it is thick in notable magnetic anisotropy in the vertical direction from the film surface with powerful coersive force (a) and in excellent square ratio and appearance can be formed and when it is applied to a magnetic drum, etc., of a magnetic encoder, an encoder with high resolving power can be manufactured. Furthermore, powerful coersive force is given to the plated film to be hardly demagnetized so that the highly reliable magnetic encoder hardly affected by any outer magnetic noise subjected to less time- elapsing deterioration may be manufactured.
Patent•
28 Sep 1988
TL;DR: In this paper, the authors proposed a method to increase adhesion of the plating and reduce additional losses incurred in chemical plating process by special treatment such as pretreatment using acid pickling agent contg hydrofluoric acid and chromic anhydride, thorough washing of porcelain after pickling, wash after sensitization and activation, and pre-plating in soln contg nickel sulphate, sodium hypophosphite, and sodium pyrophosphate etc.
Abstract: This invention is to increase adhesion of the plating and reduce additional losses incurred in chemical plating process by special treatment such as pretreatment using acid pickling agent contg hydrofluoric acid and chromic anhydride, thorough washing of porcelain after pickling, wash after sensitization and activation, and pre-plating in soln contg nickel sulphate, sodium hypophosphite, and sodium pyrophosphate etc so that the performance of condenser produced by the present invention reaches the product standards
TL;DR: Does sodium cromoglycate have an mhibitory effect on contact dermatitis?
Abstract: I. Hazder S A. Treatment of atopzc eczema m children: climcal tnal of 10% sodium cromoglycate omtment. Br Med J 1977\" 1. 1570-1572. 2. Anyanayagam M, Barlow T J G, Graham P et al. Topzcal sodium cromoglycate m the management of atopic eczemea controlled tnal. Br J Dermato/!985: 112: 343-348. 3. Settipane G A, ~!em D E, Boyd G K et al. Adverse reactiOns to cromolyn. JAMA 1979: 241. 811-813. 4. Easty D L, Rzce N S C, Jones B R. Climcal tnal of topzcal disodium cromoglycate m vernal kerato-conJunctivitis. C/in Allergy 1972: 2: 99-107 5. Greenbaum J, Cockcroft D, Hargreave FE, Dolonch J. Sodium cromoglycate m ragweed-a!lergzc conJunctivitis. J Allergy C/in lmmunol 1977\" 59· 437-439. 6. Fisher A A, Stillman M A. Allergic contact sensztlVIty to benzalkoniUm chlonde. Arch Dermatol 1972: 106: 169-171. 7 Afzeliush H, Thulin H. Allergzc reactions to benzalkomum chlonde. Contact Dermatitis 1979: 5: 60. 8. Meffert H, Wischenwskz G G, Gunther W. Disodium cromoglycate mhibzts allergic patch test reactions. Contact Dermatitis 1985: 12: 18-20. 9. Chnstensen D B, Chnstensen M B, Wall L M. Does sodium cromoglycate have an mhibitory effect on contact dermatitis? Contact Dermatllis 1986: 15: 183-185. 10. Blanken R, Nater J P, Veenhof E. Sodium cromoglycate: effects on allergic patch test reactions. Contact Dermatitzs 1986: 15: 192-193.
Patent•
24 Feb 1988TL;DR: In this paper, a corrosion resistant electrodeposited coating comprising a solid solution of phosphorus and nickel supersaturated with zinc, deposited on a substrate, is described, which is formed from an electrolyte containing nickel chloride, zinc chloride, and sodium hypophosphite having a nickel ion to zinc ion molar ratio between about 7:1 and about 12:1, and is deposited on said substrate at current densities of at least 0.6 A/cm².
Abstract: Corrosion-resistant electrodeposited coating comprising a solid solution of phosphorus and nickel supersaturated with zinc, deposited on a substrate. The electrodeposited coating is formed from an electrolyte containing nickel chloride, zinc chloride and sodium hypophosphite having a nickel ion to zinc ion molar ratio between about 7:1 and about 12:1, and is deposited on said substrate at current densities of at least 0.6 A/cm².