Sodium hypophosphite

About: Sodium hypophosphite is a research topic. Over the lifetime, 1695 publications have been published within this topic receiving 15932 citations.

Nickel phosphorus chemical plating method and chemical plating solution thereof

Abstract: The chemical plating Ni-P solution for the surface treatment of micro mechanical material includes soluble Ni salt, sodium hypophosphite, sodium acetate and water, the molar ratio between soluble Ni salt and sodium hypophosphite is 0.25-1.20, that between sodium acetate and soluble Ni salt is 0.20-1.50, and that between water soluble Ni salt is 300-600. The chemical plating process of utilizing the chemical plating Ni-P solution in the surface treatment of micro mechanical material includes cleaning the surface, sputtering one Ni lining layer, painting photoresist and photoetching, setting inside the chemical plating Ni-P solution to produce oxidation-reduction reaction while maintaining in certain temperature, taking out the substrate, cleaning and drying, degluing inside degluing liquid and maintaining the temperature in protective atmosphere to obtain homogeneous Ni-P coating of submicron to submillimeter level thickness and controllable shape.

Technique for producing high-purity antimonous oxide by processing stibnite concentrate through wet method

Abstract: The invention discloses a technique for producing high-purity antimonous oxide by processing stibnite concentrate through the wet method. According to the technique, the stibnite concentrate is chloridized, a leaching agent is reduced by means of fine stibium powder, reduction liquid is selectively reduced through sodium hypophosphite under the proper temperature and proper acid concentration conditions so that arsenic is removed, iron in a solution subjected to arsenic removal is removed through hydrolysis, and lead in the solution subjected to arsenic removal is removed through ethylene diamine tetraacetic acid; meanwhile, growth of crystals is controlled by adding dihydroxysuccinic acid and controlling the neutral reaction condition, and in this way, a high-purity antimonous oxide product containing main impurities such as lead, arsenic and iron all being within 10 ppm and the average particle sizes being 2-3 microns can be produced. According to the technique, the stibium loss is small, operation is easy, production cost is low, and industrial production requirements are met.

Additive for soil improvement

Abstract: PROBLEM TO BE SOLVED: To provide an additive for soil improvement capable of improving the flowability of a soil cement and improving excavational properties and workability due to the retention of flowability and further reducing the amount of surplus soil to be discharged by incorporating a carboxylic acid based polymer to be obtained by allowing a predetermined amount of a hypophosphorous acid (salt) to be present in polymerizing an acrylic acid based monomer as an additive for soil improvement. SOLUTION: In an apparatus equipped with a stirrer, a thermometer, a reflux condenser, a dropping funnel and a nitrogen inlet tube are charged 150 pts.wt. water and heated to 100 deg.C in a nitrogen stream. Then, while maintaining the water at 100 deg.C under stirring, 460 pts.wt. monomer aqueous solution obtained by dissolving 353.5 pts.wt. acrylic acid and 17.3 pts.wt. sodium hypophosphite in water and 90 pts.wt. initiator aqueous solution obtained by dissolving 5.6 pts.wt. ammonium persulfate in water are continuously added dropwise over three hours, respectively. Further, the reaction solution is maintained at the same temperature for one hour to complete the polymerization. After cooling, the reaction solution is neutralized by the addition of 471 pts.wt. 40% sodium hydroxide and diluted with water to obtain an acrylic acid polymer.

Process for preparing high-performance Ni-P alloy solution for chemical plating

Abstract: A high-performance soloution for chemical plating of Ni-P alloy contains primary salt (nickel sulfate and sodium hypophosphite), composite complexing agent (complexon, citric acid, lactic acid, sterculic acid and butanedioic acid), composite buffer (boric acid and sodium acetate), and composite stabilizer (sodium thiocyanate, ammonium mobybdenate and lead nitrate). Its advantages are high stability and high anticorrosion performance of its plated layer; and the plated layer can be applied with secondary plating.

Research on Surface Metallization of Carbon Fiber Based on Electroless Plating

Abstract: In this paper, the method of electroless nickel-plating on carbon fiber surface is introduced, and surface metallization of carbon fiber is researched. The study includes pretreatments before plating, design of the plating solution composition, microscopic analysis of coating materials, and bonding strength testing between the coating and the substrate. The study show that pretreatments on carbon fiber surface have an important impact on metallization. In pretreatments, coarsening treatment changes the surface state of carbon fiber, increases surface area; while dispersing eliminates the reunion phenomenon of the fiber. Plating solution composition is the key factor of nickel-plating on carbon fiber surface, the best components of solution are 30g/L nickel sulfate, 20g/L lactic acid, 30g/L sodium hypophosphite. The surface metallization of carbon fiber is realized by chemical nickel plating, and the coating combined well with fiber, uniformity, complete and bright. The coating gained in the experiment is Ni-P amorphous alloy.