Sodium hypophosphite

About: Sodium hypophosphite is a research topic. Over the lifetime, 1695 publications have been published within this topic receiving 15932 citations.

Chemical plating solution and its use in low concentration standard gas packaging container

Abstract: The invention relates to a chemical plating solution and its use in low concentration standard gas packaging container which comprises, by using sodium hypophosphite as reducing agent, using nickel sulfate as the main salt as well as addition complexing agent, accelerating agent, stabilizing agent, wherein the inner surface of the container employs 5-15% H2SO4 as activating liquid, coating inert layer inside the container, conducting chemical plating and proceeding hole sealing treatment with CrO3.

Chemical nickel-plating solution for magnesium alloy and nickeling technique thereof

Abstract: The invention discloses a magnesium alloy chemical nickel plating solution and the nickel plating process thereof, wherein, the solution comprises basic chemical nickel plating solution and acidic nickel plating solution; the pH value of the basic chemical nickel plating solution is maintained between 7.5 and 9.5 and the solution contains 5g to 40g nickel sulfate, 5g to 30g sodium citrate, 5g to 25g ammonium bifluoride and 10g to 30g sodium hypophosphite per liter; the pH value of the acidic nickel plating solution is maintained between 5.0 to 7.0 and the solution contains 5g to 35g nickel sulfate, 8g to 20g sodium citrate, 8g to 20g sodium acetate, 6g to 30g sodium hypophosphite and 5g to 25g ammonium bifluoride per liter. With the composition, chemical plating is completed through adopting the treatment steps including (a) pretreatment, (b) activating treatment, (c) basic chemical nickel plating, (d) acidic chemical nickel plating and (e) roasting. Due to adopting fluoride-free chromium-free chemical plating process, the invention effectively solves the problems of high cost and severe pollution of magnesium alloy chemical nickel plating.

Electrosensitive recording thermal development processes for sheets

Abstract: 1275929 Electrosensitive compositions SONY CORP 17 July 1969 [20 July 1968] 36084/69 Heading C3P [Also in Divisions B6 C4 and D2] Compositions used in making sheets for use in a recording process (see Division D2) comprise in the Examples: (1) a solution in toluene of a styrene-butadiene copolymer, nickel acetate, sodium hypophosphite, conductive tin oxide, and titanium oxide milled in a ball mill; a mixture of the same copolymer solution, metallic zinc powder and zinc oxide; (2) a solution in dioxan of polyvinyl butyral and polyvinyl chloride, nickel formate, sodium hypophosphite, aluminium powder, conductive tin oxide and titanium oxide; (3) a solution in dioxan and methyl ethyl ketone of polyvinyl formal, nickel acetate, sodium hypophosphite, conductive tin oxide powder, titanium oxide and sodium acetate; (4) a solution in dioxan and methyl ethyl ketone of polyvinyl formal, nickel acetate, aluminium powder, titanium dioxide and potassium fluoride; a solution in dioxan and methyl ethyl ketone of polyvinyl formal, sodium hypophosphite and titanium oxide; (5) a solution in dioxan of polyvinyl formal, sodium hypophosphite, aluminium powder and titanium oxide; a solution in dioxan and methyl ethyl ketone of polyvinyl formal and nickel acetate; (6) polyvinyl formal, nickel hypophosphite, sodium succinate, titanium oxide and dioxan mixed in a ball mill; styrene-butadiene copolymer, conductive tin oxide powder, nickel hypophosphite, sodium succinate and toluene; (7) polyvinyl formal, copper formate, sodium citrate, titanium oxide and dioxan mixed in a ball mill; styrene-butadiene copolymer, conductive tin oxide powder, copper formate sodium citrate and toluene mixed in a ball mill. The conductive tin oxide of the examples is made by coprecipitating hydroxides of tin and antimony with ammonia in a solution of tin chloride mixed with a small proportion of antimony chloride, heating and pulverizing.

Chemical plating solution for quick chemical plating of ternary alloy nickel-molybdenum-phosphorus at low temperature

Abstract: The invention discloses a formula of a plating solution for chemical plating of a ternary alloy nickel-molybdenum-phosphorus and aims at solving the problems of high temperature of the plating solution, low deposition speed, coarse crystals, poor stability of the plating solution and the like of an existing technology for chemical plating of the ternary alloy nickel-molybdenum-phosphorus. The chemical plating solution disclosed by the invention comprises nickel sulfate, sodium hypophosphite, sodium molybdate, sodium pyrophosphate, triethanolamine and ammonium sulfate, wherein the pH is 8.0-9.5, the temperature of the plating solution is 55-75 DEG C, the temperature of the plating solution disclosed by the invention is obviously reduced, and the deposition speed is significantly improved. Scanning electron microscopy results indicate that the crystals of a plated layer are small and dense. The plating solution has good stability and can still be used after being stored at room temperature for 30 days, and the quality of the plated layer is good. The chemical plating solution disclosed by the invention can be widely used in chemical plating processes.