Topic
Sodium hypophosphite
About: Sodium hypophosphite is a research topic. Over the lifetime, 1695 publications have been published within this topic receiving 15932 citations.
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Patent•
20 Dec 1980
TL;DR: In this article, a Co-P non-crystalline alloy plated layer, containing 60-92atom% Co and 8-26atom% P as the main components, is obtained by an electric plating method using an acid plating bath consisting primarily of approx. 1/6-3mol/l of a divalent Co ion (e.g., cobalt sulfate, etc.).
Abstract: PURPOSE:To raise the magnetic characteristics by forming the noncrystalline alloy- plated layer containing a given ratio of Co and P as the main components. CONSTITUTION:In the place of Fe-P noncrystalline alloy previously applied, a Co- P noncrystalline alloy-plated layer, containing 60-92atom% Co and 8-26atom% P as the main components, is obtained by an electric plating method using an acid plating bath consisting primarily of approx. 1/6-3mol/l of a divalent Co ion (e.g., cobalt sulfate, etc.) and approx. 0.03-0.3mol/l of hypophosphic acid and/or a hypophosphite (e.g., sodium hypophosphite, etc.). The conditions for plating includes pH1.2-2.2, a current density of 5-20A/dm , and a bath temperature of 30-60 deg.C, and also a stabilizer, e.g., L-ascorbic acid, etc., and a brightener, e.g., hydroquinolic acid, etc., are added to the plating system. Thus, a magnetostriction constant is made smaller and also magnetic permeability and coercive force are raised.
5 citations
TL;DR: The determination of sulphur by the hypophosphite-tin metal-CPA and tin(II)-CPA methods is interfered with by copper on account of the stabilization of copper(I) sulphide, but this interference can be eliminated by adding iodide.
5 citations
Patent•
09 Nov 2016
TL;DR: In this article, a preparing method of antioxidant silvering copper powder was proposed, in which salt hypophosphite is used to serve as reducing agent, deionized water is used as a solvent, copper powder is adopted as a base material to add into the reduction liquid, PVP is added, ammonium hydroxide is added to adjust the pH value, and pH value is stabilized to 11.
Abstract: The invention relates to a preparing method of antioxidant silvering copper powder. Sodium hypophosphite is adopted to serve as a reducing agent, deionized water is adopted to serve as a solvent, sodium hypophosphite reduction liquid is prepared, copper powder is adopted to serve as a base material to be added into the reduction liquid, PVP is added, ammonium hydroxide is added to adjust the pH value, and the pH value is stabilized to 11; silver nitrate serves as a silver source, the deionized water serve as a solvent to prepare oxidation liquid, an EDTA-2Na complexing agent is added, stability of plating liquid is improved, and the problem that in the silvering process, silver ions are released too fast is obviously solved; solutions are mixed, meanwhile, magnetic stirring is carried out, the adding temperature is kept to range from 30 DEG C to 80 DEG C, reaction is carried out for 20 min, centrifuging is carried out, and one-time-silvering copper powder is obtained; the one-time-silvering copper powder serves as the base material, the above steps are repeated twice, and third-time-silvering copper powder is obtained. High-temperature oxidation resistance of silver plated copper powder prepared through the method is excellent, and the method is suitable for replacing conductive phase silver powder of electronic paste.
5 citations
Patent•
24 Apr 1995
TL;DR: In this paper, a specified monoamine-type biodegradable chelating agent is incorporated into an electroless Ni plating bath as an effective component, and a Ni coating film is obtained at a high rate.
Abstract: PURPOSE: To obtain a plating bath excellent in stability and capable of realizing an Ni plating having a high content of P at a high rate by incorporating a specified monoamine-type biodegradable chelating agent into an electroless Ni plating bath as an effective component. CONSTITUTION: At least one kind of the monoamine-type biodegradable chelating agent shown by the formula (where R is hydrogen or an unsubstituted or substituted hydrocarbonic group, R and R are hydrogen or an unsubstituted or substituted hydrocarbon group, R is hydrogen, -COOM-, -SO3 M or -PO3 M, and M is hydrogen, alkali metal or ammonium group) as a complexing agent is incorporated into an electroless Ni plating bath as the effective component. In this case, 0.2-30mols of the chelating agent is preferably used for 5-500mM of Ni ion, and the plating bath is preferably alkalized by NaOH, KOH or NH4 OH. Further, sodium hypophosphite is used as the reducing agent of the bath, and an Ni coating film having a high content of P is obtained at a high rate.
5 citations
Patent•
11 Apr 1995
TL;DR: In this paper, an anti-corrosive for copper based metal hardly crystallized even at a low or high temp was obtained by adding acrylic acid, 2-acryloyl amino-2-methylpropane sodium sulfonate or sodium hypophosphite addition polymer.
Abstract: PURPOSE: To obtain an anti-corrosive for copper based metal hardly crystallized even at a low or high temp., capable of preserving for a long time and jointly using with an anti-corrosive for iron based metal by adding a specific dissolution accelerating agent into a sparingly water-soluble triazol based compound. CONSTITUTION: The water soluble preparation is prepared by adding an addition polymer expressed by formula III or formula IV, formula V or the salt as the dissolution accelerating agent in the benzotriazol based compound expressed by formula I in the weight ratio of 2-50 to the bezotriazol based compound. In formula I, R 2 is a group expressed by formula II. The addition polymer to be added is acrylic acid, 2-acryloyl amino-2-methyl-propane sodium sulfonate or sodium hypophosphite addition polymer, the weight average molecular weight is preferably 1500-1800 and the molar ratio of sodium hypophosphite to the monomer is preferably 16:1. And an inorganic phosphate and the water soluble anti-corrosive for iron based metal, which is a compound easily releasing Zn ion in water, can be added to the anti-corrosive and used. COPYRIGHT: (C)1996,JPO
5 citations