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Sodium hypophosphite

About: Sodium hypophosphite is a research topic. Over the lifetime, 1695 publications have been published within this topic receiving 15932 citations.


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Patent
23 Jun 1971
TL;DR: In this paper, a photo-resist is used to burn the resist to leave the free metal and then immersing in an electroless plating solution, where the resist is subsequently burnt off with the photo resist.
Abstract: 1,236,250. Electroless plating. WELWYN ELECTRIC Ltd. Oct. 21, 1969 [Oct. 18, 1968], No. 49498/68. Heading C7F. A substrate of e.g. a ceramic is plated with a pattern of e.g. Fe, Co or Ni with or without P, B or S or Cu or Ag. by applying an organic photoresist containing dissolved therein a salt, resinate or other compound of Pd, Pt or Au, irradiating the resist through a mask, developing, burning of the resist to leave the free metal and then immersing in an electroless plating solution. A Pd pattern may be reduced prior to plating by exposing to hydrogen or heating in nitrogen or by immersing in sodium hypophosphite solution with certain substrates the Pd may be reactivated by immersion in palladium chloride. The substrate should have a black surface, and this may be achieved by coating with carbon which is subsequently burnt off with the photo-resist. A nickel plating solution contains (g./l.) NiSO 4 , 7H 2 O 29, NaH 2 PO 2 17, succinic acid 7A6 and NaOH to give pH of 4A9.

4 citations

Patent
11 Jul 2012
TL;DR: In this paper, a chemical nickel-phosphorus alloy plating solution capable of obtaining a high-solderability plating layer was proposed, in which the complexing agent containing the carboxylate radicals was selected from one or combination of a plurality of glycollic acid, lactic acid, malonic acid, succinic acid, etc.
Abstract: The invention relates to a chemical nickel-phosphorus alloy plating solution capable of obtaining a high-solderability plating layer. The solution comprises nickel sulfate, sodium hypophosphite, a complexing agent containing carboxylate radicals, bivalent tin ions and dimercaptosuccinic acid or dimercaptosuccinate, wherein, the complexing agent containing the carboxylate radicals is selected fromone or combination of a plurality of glycollic acid, lactic acid, malonic acid, succinic acid, malic acid, tartaric acid, citric acid, gluconic acid, acetic acid, propionic acid, aminoacetic acid or corresponding salts of various acids; and the pH value of the solution is adjusted to 4-7. By adopting the chemical nickel-phosphorus alloy plating solution capable of obtaining the high-solderabilityplating layer, the chemical nickel-phosphorus plating layer achieves better solderability and is not restricted by the phosphorus content in the plating layer, thus solving the solderability problem of the chemical nickel-phosphorus plating layer and lowering the cost.

4 citations

Proceedings ArticleDOI
01 Aug 2018
TL;DR: In this article, the submicron copper particles with a mean diameter of 197 nm were obtained using lactic acid as stabilizer and sodium hypophosphite as a mild reducing agent.
Abstract: The submicron copper particles with a mean diameter of 197 nm were obtained using lactic acid as stabilizer and sodium hypophosphite as a mild reducing agent. The obtained Cu particles show a good oxidation resistance owing to the weak reducibility of lactic acid. The screen printable copper ink with a metal loading of 50 wt.% was prepared using the obtained copper particles. The copper films after sintering at 150 °C for 1 h in nitrogen atmosphere exhibit a relatively low resistivity of 1.87 × 10−4 Ω•m. The conductive copper film circuits were successfully fabricated on flexible polyimide (PI) substrate, with which an LED can be lighted up easily.

4 citations

Patent
19 Dec 2012
TL;DR: In this paper, a microwave and supersonic wave technology is introduced on the basis of the adoption of the ammonium persulfate and the sodium hypophosphite as the initiators to rapidly synthesize polycarboxylic acid system water reducer products through utilizing the microwaves and the SUpersonic waves.
Abstract: A method for promoting the synthesis of polycarboxylic acid system cement water reducers through using microwaves and supersonic waves utilizes the microwaves to improve the temperature of reactants to make the interface temperature rapidly reach above 80DEG C. The reactants rapidly complete a reaction through stirring and vibrating reaction mediums by supersonic waves. The time for completing the reaction of the reactants is reduced to 10-30min under the radiation of the microwaves and the supersonic waves from original 5-10h. The method belongs to the organic synthesis field. In the invention, the relation between performance requirements of the cement water reducer and the monomer molecule structure activity is analyzed, and the monomer molecule structure selection and the monomer ration are optimized, so monosaccharide oligosaccharides comprising glucose and maltose, polyethylene glycol, hydroquinone, sodium methylbenzenesulfonate, methylpropylbenzene, sodium sulfonate, ammonium persulfate and sodium hypophosphite are selected. A microwave and supersonic wave technology is introduced on the basis of the adoption of the ammonium persulfate and the sodium hypophosphite as the initiators to rapidly synthesize polycarboxylic acid system water reducer products through utilizing the microwaves and the supersonic waves. The method provided by the invention has the advantages of substantial time shortening, energy consumption reduction, pollution reduction, and improvement of the paste fluidities of the products, is a new method having the characteristics of safety, high efficiency and energy saving, environmental protection and simple operation, and accords with the trend of times.

4 citations

Journal ArticleDOI
TL;DR: Pseudo-ordered macroporous iron-phosphorous (Fe-P) films have been electrodeposited potentiostatically from a citrate-sulfate bath onto Au surfaces pre-patterned with a colloidal crystal mask of polystyrene spheres of 350nm in diameter as mentioned in this paper.

4 citations


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Performance
Metrics
No. of papers in the topic in previous years
YearPapers
202315
202234
202125
202051
2019116
201890