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Sodium hypophosphite

About: Sodium hypophosphite is a research topic. Over the lifetime, 1695 publications have been published within this topic receiving 15932 citations.


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Journal ArticleDOI
TL;DR: In this paper, NiNP was synthesized by reduction of less toxic nickel acetate tetrahydrate (Ni(CH3CO2)2·4H2O) precursor, using sodium hypophosphite monohydrate (NaPH2O2·H 2O) under microwave irradiation.

53 citations

Journal ArticleDOI
TL;DR: In this paper, the cotton crosslinking with butane tetra carboxylic acid (BTCA) and citric acid (CA) in the presence of sodium hypophosphite (SHP) and nano TiO2 (NTO) under different curing conditions were optimized using a statistical model.
Abstract: The cotton crosslinking with butane tetra carboxylic acid (BTCA) and citric acid (CA) in the presence of sodium hypophosphite (SHP) and nano TiO2 (NTO) under different curing conditions were optimized using a statistical model. The central composite design (CCD) was used for variables based on Design of Expert software. The appropriate model to create optimum crease recovery angle was obtained for each condition. The X-ray diffraction (XRD) and scanning electron microscopy (SEM) were also employed to indicate the NTO particles on the fabric surface with the size of nano particles and their crystallinity. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2010

52 citations

Journal ArticleDOI
Boquan Jiang1, Lin Xiao1, Shu Fen Hu1, Jian Peng1, Hua Zhang1, Minwei Wang1 
TL;DR: In this paper, the preparation of Ni-P-B coatings on surface of quartz optical fibers was carried out using electroless plating method and their optimal values were determined by orthogonal experiment.

52 citations

Journal ArticleDOI
Jianfeng Pang1, Qin Li1, Wei Wang1, Xiaotian Xu1, Jianping Zhai1 
TL;DR: In this paper, the process of ternary Ni-Co-P alloy films deposited on fly ash cenospheres (FACs) through a modified electroless plating way is documented.
Abstract: The process of ternary Ni–Co–P alloy films deposited on fly ash cenospheres (FACs) through a modified electroless plating way is documented. A pretreatment of FACs by γ-aminopropyltriethoxy silane (APTES) was introduced prior to electroless plating, which improved the continuity and uniformity of the alloy films remarkably. During the plating process, three factors were taken into consideration to investigate the composition and the plating rate of the deposits: mole ratios of NiSO4/CoSO4, the sodium hypophosphite concentration and pH of the plating bath. The obtained Ni–Co–P alloy deposits were characterized by scanning electron microscope (SEM), energy dispersive X-ray spectroscopy (EDX), X-ray diffraction (XRD) and vibrating sample magnetometer (VSM). The results suggest that the as-plated deposits were Ni–Co–P alloy microparticles, which transformed from amorphous state to crystal phases with the increase of calcining temperature. In addition, the electroless Ni–Co–P deposits exhibit soft magnetic properties at room temperature. The magnetic performances of the deposits would be ameliorated with the increase of the cobalt content of the coating and calcining temperature.

52 citations

Journal ArticleDOI
TL;DR: In this article, an optimized electroless copper plating process with sustained deposition rate with time and high metal conductivity was developed, which was used in a fully additive high density wiring process.
Abstract: The deposition process of an electroless copper plating solution using sodium citrate as the main complexing agent and sodium hypophosphite as the reducing agent has been investigated. The deposit composition, structure, and catalytic activity for the oxidation of hypophosphite during the process have been investigated. Formamidine disulfide (fd) has been shown to accelerate the deposition rate of the electroless plating just as it does with electroless plating solutions using N-(2-hydroxyethyl)ethylenediaminetriacetic acid trisodium salt hydrate (HEDTA) as the complexing agent. For solutions with the mole ratio of 42, the deposition rate decreased with time and terminated after 90 min plating because the surface catalytic activity of the deposit had decreased with thickness. A copper deposit with total thickness of 6.48-6.59 μm was obtained after 90 min plating. The decrease in the deposition rate with time was mitigated by decreasing the mole ratio, holding the concentration of copper ions constant. An optimized electroless copper plating process with sustained deposition rate with time and high metal conductivity was developed. The bath was used in a fully additive high density wiring process. © 2003 The Electrochemical Society. All rights reserved.

51 citations


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Performance
Metrics
No. of papers in the topic in previous years
YearPapers
202315
202234
202125
202051
2019116
201890