Sodium hypophosphite

About: Sodium hypophosphite is a research topic. Over the lifetime, 1695 publications have been published within this topic receiving 15932 citations.

Reduction treatment of hydrogen-storing alloy

Abstract: The reduction treatment is suitable for preparation of hydrogen storing alloy through fast solidification or other process It features that the alloy powder to be treated is placed into water in 1-10 times, where sodium hypophosphite solution is added while stirring The weight ratio between alloy powder and sodium hypophosphite solution is 1 to 05-15, the treatment temperature is 20-60 degC and the treatment period is 3-48 hr The present invention can raise the initial electrochemical activity of hydrogen storing alloy

Effect of sodium hypophosphite content to the deposition rate, structure and magnetic properties of electroless deposited Ni-P alloy

Abstract: The deposition kinetics, structure and magnetic properties of electroless deposited films Ni-P were investigated depending on the amount of sodium hypophosphite in the electroless bath. It was found that the film deposition rate is linear and unambiguously varies with the hypophosphite content from 2 to 13 g/l and from 23 to 25 g/l. The deposition rate varies widely in the hypophosphite concentration range from 13 to 23 g/l. The films are composed of amorphous Ni-P phase and fcc Ni-P solid solution with phosphorus content from 1 to 4 at.% P according to X-ray diffraction. The partial amount of amorphous phase is increased with concentration of sodium hypophosphite. The ferromagnetic resonance field is independent on the concentration of sodium hypophosphite, which assumes to be result from the laminated allocation of the amorphous and fcc phases in the film.

Electrolytic water bath and process for depositing a nickel-phosphorus alloy

Abstract: This bath comprises nickel fluoborate in a concentration of from 100 to 600 g per 1000 ml of water, boric acid in a concentration of from 10 to 50 g per 1000 ml of water, and nickel hypophosphite, sodium hypophosphite or ammonium hypophosphite, optionally phosphorous acid, in a concentration of from 1 to 50 g per 1000 ml of water. To eliminate hydrogen-pitting, a wetting agent is added in a concentration of from 0.01 to 1 g per 1000 ml of water.

Nd-added nd-fe-b permanent-magnetic material chemical plating fluid and method of use thereof

Abstract: The invention discloses a neodymium-added Nd-Fe-B permanent-magnet material chemical plating solution and a use method. In the plating solution, nickel vitriol is used as the main salt, sodium hypophosphite is used as the reducer, sodium citrate or malic acid is used as the complexing agent, sodium acetate is used as the buffering agent, potash iodate is used as the stabilizing agent, and a small amount of neodymium is added. The use method comprises the following steps: the pH value of the chemical plating solution is adjusted by 5% to 10% of sodium hydroxide solution or ammonia to 9 to 10, the optimal pH value is 9 to 9.5, the plating solution is heated to 70 DEG C to 85 DEG C, the optimal constant temperature is 80 DEG C to 85 DEG C, oil-removed and activated Nd-Fe-B magnet is dipped into the plating solution, then a plating layer is acquired. According to the invention, because of the strong adsorption capacity, neodymium is aggregated on the surface of the magnet, the corrosion of neodymium-rich phase is inhabited, and the deposition speed is improved, the bonding force of the surface coating of the Nd-Fe-B magnet is obviously increased. In addition, coating got by the method has superior corrosion resistance, and the technical difficulty of poor bonding force of the surface coating of the Nd-Fe-B magnet is solved.

Electroless nickel plating solution

Abstract: PURPOSE:To obtain the titled plating soln having superior stability and a high rate of deposition by adding specified amount of copper ions to an electroless nickel plating soln contg a soluble nickel salt, a hypophosphite and a pH buffer as essential components CONSTITUTION:This plating soln having superior stability is obtd by adding 01-4ppm copper ions to an electroless nickel plating soln contg about 10-60g/l soluble nickel salt such as nickel sulfate, about 10-30g/l hypophosphite such as sodium hypophosphite and about 1-50g/l pH buffer such as acetic acid as essential components When plating is carried out with the resulting plating soln while the soln is kept at about 6-4 pH and about 50-30 degC, a thin nickel film can be uniformly formed on the surface of plastics or glass without requiring surface roughening