Sodium hypophosphite

About: Sodium hypophosphite is a research topic. Over the lifetime, 1695 publications have been published within this topic receiving 15932 citations.

High-effective sewage purifying agent

Abstract: A high-effective sewage decontaminant uses several chemical raw materials, such as sodium hypophosphite, sodium phosphate, trisodium phosphate, iron trichloride, calcium oxide emulsion, aluminium potassium sulphate, hydrochloric acid and sulphuric acid, through crushing, dissolving, mixing, stirring, settling, filtering and packaging to obtain the product. Four kinds of different components are developed to suit different waste waters and may be separately used for such cases as paper mill waste water, radioactire element chemical works waste water, general plant waste water and different raw-waters, and the water quality after treatment can reach the discharging stardard stipulated by the state environmental protection sector. Its advantages are high-effect, quickness, cheapness and easyapplication.

New method for directly preparing aryl aldehyde from aryl nitrile

Abstract: The invention provides a method for directly preparing aryl aldehyde from aryl nitrile. The method is characterized in that the aryl nitrile is further reduced by pyridine and sodium hypophosphite in an acetic acid-water solution in nitrogen atmosphere under the catalysis of Rainie nickel in order to form aryl aldehyde. The acetic acid-water solution is used as a reaction solvent, hypophosphorous acid generated through a reaction of sodium hypophosphite and acetic acid reacts with pyridine to form a salt, and the aryl nitrile is directly reduced by in situ hydrogen released by the salt under the catalysis of the Rainie nickel to form the aryl aldehyde. The method has the advantages of fast reaction, easy operation, easily available raw materials, mild conditions, high yield, and suitableness for industrial preparation.

Derivation and rapid spectrophotometric determination of iron in electroless nickel plating solution

Abstract: Experiment has proved that iron can be dissolved in an acidic electroless nickel (EN) plating solution during the plating process when plating iron sheet. The influence of nickel sulfate, organic acids, sodium hypophosphite, pH and temperature on the absorption of Fe(III) was investigated. A new method, using mono-wavelength, to determine the concentration of Fe(III) was developed. Fe(II) was oxidized to Fe(III) to determine the total iron in the range 0.02 to 19.42 mg/L with recovery of more than 96.6 percent. Results confirmed that this method is easy, uses simple instruments, is quick and offers high accuracy in the process of measurement. This method can be applied to rapid determination of total iron in EN solutions, as well as determining whether the substrate is completely covered by Ni-P alloy if iron sheets are used.

Thermally induced bond failure of electroless nickel/IVD aluminum coatings deposited on steel

Abstract: Experiments were conducted to investigate methods to improve the bond of an electroless nickel/ion vapor deposited (IVD) aluminum coating applied to a steel substrate for use at an elevated temperature of 482°C. Samples were prepared by coating steel panels with columnar IVD aluminum followed by the application of electroless nickel from a sodium hypophosphite plating solution. Surface treatment of the underlying aluminum was varied by physically compacting the columnar structure of the aluminum by glass-bead peening and/or grit blasting. The cooling atmosphere after application of the aluminum was also investigated by using nitrogen to reduce the potential of aluminum oxidation prior to application of the electroless nickel coating. Results show that at elevated temperatures atomic diffusion takes place creating voids that eventually lead to failure of the electroless nickel coating. Bond failure can be retarded, but not eliminated, by using a nitrogen atmosphere to prevent oxidation of the IVD aluminum and by retention of the aluminum columnar structure before overcoating with electroless nickel.

Growth Behavior of Ni–P Film on Fe/Si Substrate in an Acid Electroless Plating Bath

Abstract: Ni-P film was electrolessly deposited on Fe/Si substrate in an acid plating bath containing nickel sulfate as the nickel source and sodium hypophosphite as a reducing agent. The Fe film in Fe/Si substrate was formed by electron-beam evaporation deposition. The Ni-P film was characterized by transmission electron microscopy. The results showed that the Ni-P film on Fe/Si substrate has a homogeneous and nanocrystalline structure in comparison with that on Si substrate, which has a columnar structure, and there are straight cracks in the Ni-P film when the pH value of the plating bath is relatively high due to the higher internal tensile stress. The plating rates of Ni-P film on Fe/Si substrate increase with increase in plating temperature and pH value, ranging from 0.22 to 5.27 nm/s for plating temperatures of 65-90°C and pH values of 4.2-5.0. The activation energies of Ni-P films on Fe/Si substrate were 99.58, 87.4, and 41.55 kJ/mol for pH values of 4.2, 4.6, and 5.0, respectively.