Sodium hypophosphite

About: Sodium hypophosphite is a research topic. Over the lifetime, 1695 publications have been published within this topic receiving 15932 citations.

Alkali/surfactant/polymer (ASP) flooding calcium-silicon-barium scale inhibitor and preparation method thereof

Abstract: The invention relates to an alkali/surfactant/polymer (ASP) flooding calcium-silicon-barium scale inhibitor and a preparation method thereof. The ASP flooding calcium-silicon-barium scale inhibitor comprises the following raw materials in percentage by mass: 15 to 30 percent of acrylic acid, 5 to 9 percent of 2-acrylamide-2-methylpropanesulfonic acid, 5 to 10 percent of sodium hydroxide, 10 to 20percent of maleic anhydride, 3 to 10 percent of sodium hypophosphite, 8 to 20 percent of sodium allylsulfonate, 8 to 19 percent of 35 percent hydrogen peroxide (H2O2), 14 to 20 percent of softened water and 0.001 to 0.003 percent of ammonium ferrous sulfate. The preparation method for the inhibitor comprises the following steps of: uniformly mixing the raw materials in an elevated tank at room temperature, putting into a reaction kettle, controlling reaction time and temperature, cooling to the temperature of 50 DEG C after reaction is finished, and discharging from the tower bottom of the reaction kettle. The inhibitor can effectively solve the problems of frequent pump inspection and a short pump inspection cycle which are caused by calcium-silicon-barium deposition in an oil field ASP flooding oil well lifting system.

Cross-linking agent, cross-linking method and cross-linking composition

Abstract: PURPOSE: To obtain a cross-linking agent capable of improving moisture and water resistances and free from the generation of formaldehyde, coloring and yellow discoloration when added to a water-soluble polymer containing a hydroxyl group used as eg a binder by compounding a polycarboxylic acid with a salt of an oxyacid of phosphorus CONSTITUTION: A cross-linking agent is composed of a polycarboxylic acid and a salt of an oxyacid of phosphorus 1, 2, 3, 4-Butanetetracarboxylic acid or (meth)acrylic acid having a viscosity of ≥20cps at 25°C in a 25wt% aqueous solution is used as the polycarboxylic acid The salt of the oxyacid of phosphorus is compounded in the ratio of 5-100wt% to the polycarboxylic acid and especially in the case of the above-mentioned acrylic acid, 10-30wt% Sodium hypophosphite is used as the salt of the oxyacid of phosphorus These cross- linking agent components are compounded in the ratio of 3-20wt% (the polycarboxylic acid) and 5-100wt% (the salt of the oxyacid of phosphorus) to a water-soluble polymer containing a hydroxyl group respectively As the water-soluble polymer, polyvinyl alcohol, etc, are used COPYRIGHT: (C)1995,JPO

Anti-bacterial and anti-wrinkling finishing method for cotton fabric

Abstract: The invention provides an anti-bacterial and anti-wrinkling finishing method for cotton fabric, comprising the following steps of: dissolving catalyst, and equimolar 2, 2, 6, 6-tetramethyl-4-pipradrol and butanetetracarboxylic acid in water, so that finishing bath foam can be formed; and soaking the cotton fabric in the finishing bath foam, treating the cotton fabric by the working procedures such as rolling and baking, soaping, washing by water, drying, halogenating and drying, wherein the catalyst is one of the sodium dihydrogen phosphate, disodium hydrogen phosphate, sodium polyphosphate and sodium hypophosphite, the halogenating treatment comprises the step of soaking the dried cotton fabric in active halogen-containing solution, and the drying temperature is 150-200DEG C. The cotton fabric which is finished by the method in an anti-bacterial and anti-wrinkling finishing way has the dual performances such as bacterial resistance and wrinkling resistance, is high in anti-bacterial efficiency, good in anti-wrinkling performance, and free from formaldehyde release.

Softening and crease-shedding finishing agent for true silk and preparation method thereof

Abstract: The invention provides a softening and crease-shedding finishing agent for true silk and a preparation method thereof. The preparation method comprises the following steps: (1) stirring tartaric acid, citric acid, caprylamidopropyl betaine, sorbitan trioleate, sodium hypophosphite, polyethyleneglycol and water at normal temperature for 30-60 minutes; (2) adding sodium hydroxide into the above solution, regulating the pH value, and stirring for 10-20 minutes; and (3) adding cocoylamidopropyldimethyl tertiary amine, triethanolamine N-cocoyl-L-glutamate, amino-modified organic silicon softener and fatty alcohol-polyoxyethylene ether into the above solution, and performing ultrasonic oscillation at 20-60 DEG C for 20-40 minutes to obtain the finishing agent. The softening and crease-shedding agent provided by the invention is non-toxic and has high binding fastness for a fabric; and after being finished, the fabric has good strength, fastness and hand feeling.

Electroless Deposition of Nickel on the Surface of Silicon Carbide Crucible from Alkaline Bath

Abstract: This work aims to eliminate contamination of the surface of crucible with silicon carbide during fusion preparation sample of the X-ray fluorescence analysis used in relation to electroless Ni–P plating process on the surface of SiC crucible in the alkaline bath. The structure, morphology and component of the coated layers were clarified by means of XRD, SEM and EDAX. Also, the electrochemical measurements was carried out to characterize the reduction mechanism of Ni deposition. The bath compositions were nickel sulfate 20 g/L, sodium hypophosphite 30 g/L, sodium citrate 10 g/L，ammonium chloride 20 g/L, containing a mixed additives of thiourea, sodium lauryl sulfate and coumarin. The thickness of coating was 3.47 μm after plating for 15 min from this bath at 318 K. The coating is relatively dense and smooth and has a nodular surface morphology. The uniform Ni–P film is a mixture of microcrystalline of Ni5P4 and crystalline phases of Ni in the alkaline bath, with the components of 4.74%P and 95.26%Ni. The nickel deposition reaction occurs at -1.07 V appropriately with the peak current density of 32 mA/cm2 and the electrochemical deposition of nickel is mainly controlled by the electrochemical process.