Topic
Sodium hypophosphite
About: Sodium hypophosphite is a research topic. Over the lifetime, 1695 publications have been published within this topic receiving 15932 citations.
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TL;DR: In this article, sulfides and sulfoxides bearing an optically active secondary alcohol were desulfurized with a Raney nickel (W-2)-sodium hypophosphite combination system.
41 citations
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TL;DR: In this article, the structure and composition of as-deposited and heat-treated electroless nickel coatings, plated from an alkaline hypophosphite bath, were studied.
41 citations
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TL;DR: In this article, poplar wood (Populus adenopoda Maxim) was treated with citric acid to various weight percent gains (WPGs) and the effect of SHP on the resulting properties of treated wood was investigated.
Abstract: Sodium hypophosphite (SHP) has been recog- nized as the most efficient catalyst in the esterification reaction of cellulosic fabrics with citric acid (CA), but both the high cost and the environmentally harmful property of SHP call for optimization of its application. In this study poplar wood (Populus adenopoda Maxim.) was treated with CA to various weight percent gains (WPGs) and the effect of SHP on the resulting properties of treated wood was inves- tigated. Esterification with CA can occur also in the absence of SHP, as evidenced by the resistance to water leaching of CA. Wood treated with CA alone to 36% WPG exhibited 7% bulking, 50% anti-swelling efficiency, 30% reductions of the modulus of rupture, and 50% lower impact strength. Treatments with CA in the presence of SHP provided wood properties comparable to wood treated with CA alone. Thus the application of SHP can be questioned from the point of view of an economic production and environmental protection.
40 citations
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13 May 2003TL;DR: In this paper, aqueous electroless nickel plating solution based on nickel salts of alkyl sulfonic acids as the source of nickel ions is described. But the plating solutions are free of added nickel hypophosphite, and free of alkali or alkaline earth metal ions capable of forming an insoluble orthophosphate.
Abstract: This invention relates to aqueous electroless nickel plating solutions, and more particularly, to nickel plating solutions based on nickel salts of alkyl sulfonic acids as the source of nickel ions. The plating solutions utilize, as a reducing agent, hypophosphorous acid or bath soluble salts thereof selected from sodium hypophosphite, potassium hypophosphite and ammonium hypophosphite. The electroless nickel plating solutions of the invention are free of added nickel hypophosphite, and free of alkali or alkaline earth metal ions capable of forming an insoluble orthophosphite.
40 citations
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TL;DR: In this paper, a new bath formulation was developed, which allowed deposition of copper-rich Cu-Ni-P alloys in electroless acidic solutions in the absence of formaldehyde.
Abstract: A new bath formulation was developed, which allowed deposition of copper-rich Cu–Ni–P alloys in electroless acidic solutions in the absence of formaldehyde. The reducing agent was sodium hypophosphite. Though cupric ions do not catalyse the oxidation of hypophosphite, we show that, in the presence of a low concentration of Ni(II) species, it is possible, even at low pHs, to induce the reduction of the cupric species. A very strong preferential deposition of copper was observed, which gives Cu–Ni–P layers with copper content up to 97 wt%. The phosphorus content decreased from 13% to 1% with increasing copper content. The plating rate decreased when the copper sulfate concentration in the solution increased. It increased with increasing pH or temperature, but the influence was less pronounced than in alkaline solutions. Compact layers were obtained with a nodular morphology which did not markedly changed with composition.
39 citations