Topic
Sodium hypophosphite
About: Sodium hypophosphite is a research topic. Over the lifetime, 1695 publications have been published within this topic receiving 15932 citations.
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Patent•
21 Nov 2012
TL;DR: In this paper, a method for preparing aluminum hypophosphite was proposed, which includes the following steps of firstly, preparing sodium hypoph phosphite solution with concentration of 2-6mol/L, adjusting pH (potential of hydrogen) to be 3-5 preferentially within 3-6.5.
Abstract: The invention relates to a method for preparing aluminum hypophosphite. The method includes the following steps of firstly, preparing sodium hypophosphite solution with concentration of 2-6mol/L, adjusting pH (potential of hydrogen) to be 3-5 preferentially within 3-6.5; secondly, preparing aluminum sulfate solution; and thirdly, subjecting the sodium hypophosphite solution and the aluminum sulfate solution to reaction by heating on the acid condition to generate aluminum hypophosphite. The aluminum sulfate is added into the sodium hypophosphite solution for reaction within a certain temperature range, so that harms caused by volatilization of hypophosphorous acid during preparing of the aluminum hypophosphite are avoided, operation is simplified, yield of products is high, cost is low and industrialization is easy to realize.
12 citations
Patent•
17 Sep 2004
TL;DR: In this article, an electroless copper plating solution that realizes uniform plating at lower temperatures is proposed. But the method is not suitable for semiconductor wafer or other such mirror surface on which a plating reaction hardly occurs.
Abstract: An object is to provide an electroless copper plating solution that realizes uniform plating at lower temperatures, when the electroless copper plating is performed on a semiconductor wafer or other such mirror surface on which a plating reaction hardly occurs. An electroless copper plating solution, wherein, along with a first reducing agent, hypophosphorous acid or a hypophosphite is used as a second reducing agent, and a stabilizer to inhibit copper deposition is further used at the same time. Examples of the first reducing agent include formalin and glyoxylic acid, while examples of the hypophosphite include sodium hypophosphite, potassium hypophosphite, and ammonium hypophosphite. Examples of the stabilizer to inhibit copper deposition include 2,2′-bipyridyl, imidazole, nicotinic acid, thiourea, 2-mercaptobenzothiazole, sodium cyanide, and thioglycolic acid.
12 citations
Patent•
21 Sep 1998TL;DR: In this paper, a self-catalytic bath and a method for the deposition of Ni-P alloy on a substrate are described. But they do not specify a specific application.
Abstract: Disclosed are a self-catalytic bath and a method for the deposition of Ni-P alloy on a substrate. The bath comprises nickel sulfate, sodium hypophosphite as a reducing agent, acetic acid as a buffer and traces of lead as a stabilizer. It also includes a citrate used as a complexing agent associated with a gluconate used both as a catalyst and a stabilizer. The disclosed bath makes it possible to tolerate large quantities of hypophosphite and is relatively long-lived. Furthermore, it can be used to prepare large quantities of Ni-P alloy per liter of solution.
11 citations
TL;DR: Palladium-catalyzed transfer hydrogenation of some organic substrates in water containing a nonionic surfactant was examined using sodium hypophosphite as a hydrogen source as discussed by the authors.
Abstract: Palladium-catalyzed transfer hydrogenation of some organic substrates in water containing a nonionic surfactant was examined using sodium hypophosphite as a hydrogen source. Hydrogenation of organohalides such as polychloroarenes, alkenes, alkynes, nitro compounds, aromatic aldehydes, and O-benzyl and N-benzyl derivatives efficiently proceeded to give the corresponding reduction products. The addition of a nonionic surfactant, such as Tween 20, proved to be effective in obtaining satisfactory results in most cases.
11 citations
Patent•
04 Jul 2001
TL;DR: In this article, a chemical nickel plating solution is prepared through the processing of preparing nickel sulfate solution A; preparing sodium hypophosphite solution B; preparing buffering agent and complexing agent solution C; pouring C into A and stirring to compound thesolution D; and pouring D into B to form the chemical nickel-plating solution.
Abstract: Chemical nickel-plating solution in each liter contains nickel sulfate 15-25 g, sodium hypophosphite 10-40 g, buffering agent 20-30 g and complexing agent 10-30 g. The solution is prepared through the processing of preparing nickel sulfate solution A; preparing sodium hypophosphite solution B; preparing buffering agent and complexing agent solution C; pouring C into A and stirring to compound thesolution D; and pouring D into B to form the chemical nickel plating solution. The application method of the solution includes solution pH value regulation, heating, and soaking metal material in thesolution for 20-60 min to form Ni-P alloy coating on the surface of the metal material.
11 citations