Sodium hypophosphite

About: Sodium hypophosphite is a research topic. Over the lifetime, 1695 publications have been published within this topic receiving 15932 citations.

Preparation of anti-bacterial cellulose fiber via electrospinning and crosslinking with β-cyclodextrin

Abstract: In the study, we successfully produced electrospun cellulose fibers crosslinked with β-CD. For electrospinning, cellulose was dissolve in 1-ethyl-3-methylimidazolium acetate and DMF was added to the prepared solution for better spinnability. The prepared cellulose fiber was immersed in the solution containing β-CD, crosslinking agent and sodium hypophosphite. In order to understand the effect of a crosslinking agent, two different types of the agents, BTCA (1,2,3,4-butanetetracarboxylic acid) and citric acid with various concentrations were used for cross-linking. The crosslinking degree was increased with the concentration of the crosslinking agents, for the both agents. The cross-linked web changed into membrane like morphology when the concentration of the cross-linking agent was higher than 5 wt%. The concentration of crosslinking agent also gave influence on the crystallinity, the thermal property and the antibacterial activity of fibers. Due to the cross-linking the crystallinity was decreased. The cross-linked fiber showed selective bacterial behavior according to the bacterial strain and the cross-linking agent.

Method for producing metal film resistor by electroless plating

Abstract: Method for producing a metal film resistor by (1) treating a base material with a stannous chloride solution, silver salt solution and palladium chloride solution, respectively, (2) subjecting the thus treated base material to electroless plating in a bath having a pH of 95-105 containing specified amounts of cobalt salts, nickel salts, sodium hypophosphite and specific acetifying agents, at a temperature of 20°-50°C, (3) heat treating the resultant metal film under specified conditions, which are also effective to prevent oxidation of the film and (4) subjecting the heattreated metal film to a surface treatment under specified conditions, which are also effective to cause oxidation of the film

High-phosphorus chemical nickel-plating concentrated solution and plating process

Abstract: The invention discloses a high-phosphorus chemical nickel-plating concentrated solution and a plating process The concentrated solution comprises three parts, namely, a solution A, a solution B and a solution C, wherein the solution A is a nickel sulfate solution; the solution B is obtained by mixing a first buffer agent, a first complexing agent, sodium hypophosphite, a stabilizer, polyethylene glycol 6000, a brightener and deionized water at room temperature; the solution C is obtained by mixing a second buffer agent, a second complexing agent, a reducing agent, a stabilizer, polyethylene glycol 6000, an accelerator, a brightener, a pH adjusting agent, and deionized water at room temperature; the solution A and the solution B are used for grooving and the solution A and the solution C are used for replenishing The solution A, the solution B and dilution water are mixed in percentage by volume so as to form the chemical nickel-plating solution of which the pH value is 47-52 During the plating, when the content of nickel in the nickel-plating solution is less than 40g/L, the solution A and the solution C are replenished When nickel is plated by virtue of the nickel-plating concentrated solution, the deposition rate of a plated workpiece is high, the stability is good, the hardness and the wear resistance of the coating are relatively high and the high-phosphorus chemical nickel-plating concentrated solution is suitable for application in brazing, spot welding and depositing a thick coating

Multilayer printed wiring board, and its manufacture

Abstract: PROBLEM TO BE SOLVED: To prevent the cracks of an interlayer insulating film which occur at heat cycle, by constituting a conductor circuit of an electroless plated film and an electrolytic plated film, and providing a roughened layer at one part of the surface. SOLUTION: An inner-layer copper pattern 4, is made on a substrate consisting of glass epoxy resin, and an adhesive layer 2 is made on the inner- layer copper pattern 4. An opening for a via hole is made in the adhesive layer 2, and a catalyst nucleus is given to the surface, and then it is soaked in electroless copper plating bath so as to form an electroless plated copper film 12 all over the rough face. The electroless copper plated film 12 is etched to form a conductor circuit consisting of an electroless plated film 12 and an electrolytic copper plated film 13. The substrate of the conductor circuit is soaked in the electroless plating liquid of pH=9 consisting of copper sulfate, nickel sulfate, citric acid, sodium hypophosphite, boric acid, and an interface activator so as to form a roughened layer 11.

Process for producing hypophosphorous acid (H3 PO2) and non-transition metal hypophosphites

Abstract: A process for producing hypophosphorous acid (H3 PO2) by reacting, in the absence of a catalyst and under an acidic condition, phosphine with an aqueous solution of hydrogen peroxide to produce an acid solution. The acid solution is then contacted with an non-transition metal hydroxide, oxide or carbonate, e.g. sodium hydroxide, to produce a product composition containing a hypophosphite, e.g. sodium hypophosphite (NaH2 PO2.H2 O). The process of this invention finds particular utility in processes of the type wherein phosphorus is reacted with an aqueous non-transition metal hydroxide composition, e.g. an aqueous suspension of a sodium hydroxide and calcium hydroxide, to produce a hypophosphite and byproduct phosphine. The process of this invention converts a substantial portion of the byproduct phosphine to hypophosphite.