Soldering

About: Soldering is a research topic. Over the lifetime, 39167 publications have been published within this topic receiving 268878 citations. The topic is also known as: soldering and brazing & brazing and soldering.

Smithells metals reference book

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Six cases of reliability study of Pb-free solder joints in electronic packaging technology

Abstract: Solder is widely used to connect chips to their packaging substrates in flip chip technology as well as in surface mount technology. At present, the electronic packaging industry is actively searching for Pb-free solders due to environmental concern of Pb-based solders. Concerning the reliability of Pb-free solders, some electronic companies are reluctant to adopt them into their high-end products. Hence, a review of the reliability behavior of Pb-free solders is timely. We use the format of “case study” to review six reliability problems of Pb-free solders in electronic packaging technology. We conducted analysis of these cases on the basis of thermodynamic driving force, time-dependent kinetic processes, and morphology and microstructure changes. We made a direct comparison to the similar problem in SnPb solder whenever it is available. Specifically, we reviewed: (1) interfacial reactions between Pb-free solder and thick metalliztion of bond-pad on the substrate-side, (2) interfacial reactions between Pb-free solder and thin-film under-bump metallization on the chip-side, (3) the growth of a layered intermetallic compound (IMC) by ripening in solid state aging of solder joints, (4) a long range interaction between chip-side and substrate-side metallizations across a solder joint, (5) electromigration in flip chip solder joints, and finally (6) Sn whisker growth on Pb-free finish on Cu leadframe. Perhaps, these cases may serve as helpful references to the understanding of other reliability behaviors of Pb-free solders.

Advances in lead-free electronics soldering

Abstract: Lead-free soldering has emerged as one of the key technologies for assembling in environmental-conscious electronics. Among several candidate alloys, the Sn–Ag–Cu alloy family is believed to be the first choice with the combination of other alloys such as Sn–Zn–Bi, Sn–Cu and Sn–Bi–Ag. Phase diagrams of lead-free alloy systems have been intensively examined by using careful thermal and microstructural analysis combined with the thermodynamic calculation such as the CLAPHAD method. The Cu6Sn5/Cu3Sn layers are formed at most lead-free solder alloy/Cu interfaces, while Cu–Zn compound layers are formed in the Sn–Zn/Cu system. Growth kinetics of intermetallic layers both in solid-state and in soldering are also discussed. Creep and fatigue phenomena are also reviewed. In many aspects of lead-free soldering, much more work is required to establish a sound scientific basis to promote their applications.

Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications

Abstract: Tin–lead solder alloys are widely used in the electronic industry. They serve as interconnects that provide the conductive path required to achieve connection from one circuit element to another. There are increasing concerns with the use of tin–lead alloy solders in recognition of hazards of using lead. Lead-free solders and electrically conductive adhesives (ECAs) have been considered as the most promising alternatives of tin-lead solder. ECAs consist of a polymeric resin (such as, an epoxy, a silicone, or a polyimide) that provides physical and mechanical properties such as adhesion, mechanical strength, impact strength, and a metal filler (such as, silver, gold, nickel or copper) that conducts electricity. ECAs offer numerous advantages over conventional solder technology, such as environmental friendliness, mild processing conditions (enabling the use of heat-sensitive and low-cost components and substrates), fewer processing steps (reducing processing cost), low stress on the substrates, and fine pitch interconnect capability (enabling the miniaturization of electronic devices). Therefore, conductive adhesives have been used in liquid crystal display (LCD) and smart card applications as an interconnect material and in flip–chip assembly, chip scale package (CSP) and ball grid array (BGA) applications in replacement of solder. However, no currently commercialized ECAs can replace tin–lead metal solders in all applications due to some challenging issues such as lower electrical conductivity, conductivity fatigue (decreased conductivity at elevated temperature and humidity aging or normal use condition) in reliability testing, limited current-carrying capability, and poor impact strength. Considerable research has been conducted recently to study and optimize the performance of ECAs, such as electrical, mechanical and thermal behaviors improvement as well as reliability enhancement under various conditions. This review article will discuss the materials, applications and recent advances of electrically conductive adhesives as an environmental friendly solder replacement in the electronic packaging industry.

Properties of lead-free solder alloys with rare earth element additions

Abstract: Due to the inherent toxicity of lead (Pb), environmental regulations around the world have been targeted to eliminate the usage of Pb-bearing solders in electronic assemblies. This has prompted the development of “Pb-free” solders, and has enhanced the research activities in this field. In order to become a successful solder material, Pb-free alloys need to be reliable over long term use. Although many of these alloys possess higher strength than the traditional Sn–Pb ones, there still exist reliability problems such as electromigration and creep. Also, the solderability of many Pb-free alloys is inferior to that of Sn–Pb and any improvement or replacement will be welcomed by industry. In order to develop new Pb-free solders with better properties, trace amounts of rare earth (RE) elements were selected by some researchers as alloying additions into Sn-based solders. These solder alloys are mainly Sn–Ag, Sn–Cu, Sn–Zn and Sn–Ag–Cu. In general, the resulting RE-doped solders are found to have better performances than their original ones. The improvements include better wettability, creep strength and tensile strength. In particular, the increase in creep resistance in some RE-doped alloys gives creep rupture time increases by over four times for Sn–Ag and seven times for Sn–Cu and Sn–Ag–Cu. Like other Sn-based alloys, their creep rates are controlled by dislocation pipe diffusion in the Sn matrix. Also, it was found that the creep rate of these Sn-based alloys can be represented by a single empirical equation. With the addition of RE elements, solders for bonding on difficult substrates such as on semiconductors, diamond, and optical materials have also been developed. This report summarizes the effect of RE elements on the microstructure, mechanical properties, wetting behavior of certain Pb-free solder alloys. As an illustration of the advantage of RE doping, interfacial studies were carried out for electronic interconnections with RE-doped Pb-free alloys. It was found that the intermetallic compound (IMC) layer thickness and the amount of interfacial reaction were reduced in a Ball Grid Array (BGA) package. These results indicate that RE elements would play an important role in providing better electronic interconnections.