Topic
Stamping
About: Stamping is a research topic. Over the lifetime, 22501 publications have been published within this topic receiving 83554 citations.
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Papers
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Book•
01 May 1997
TL;DR: In this paper, the basic die design and die-work influencing factors are discussed, and a new die design is proposed based on the Progressive Die-Strip Layout (DDSL).
Abstract: Basic Die Design and Die-Work Influencing Factors. Theory of Sheet-Metal Behavior. Metal Stamping Dies and Their Function. Metal Stamping Dies and Their Construction. Metalworking Machinery. Blanking and Piercing Operations. Blank Calculation or Flay Layout. Bending and Forming Operations. Drawn Parts. Evaluation of a New Die Design. Progressive Die--Strip Layout. Springs, Their Design and Calculations. Spring Washers. Materials and Surface Finish. Die Cost Estimating. Appendix. References. Index.
101 citations
TL;DR: In this paper, the effect of process parameters on the characteristics of incrementally formed parts is analyzed using experimental tests and a simple FEM model, which gives accurate prediction of some characteristics of the formed parts.
101 citations
TL;DR: A review of current industrial research and development in blank-holding technology, and its effect on the formability of sheet metals is presented in this article, where it is shown how the blank-holder force and the way it is applied on the blank affects the state of stress and strain within the part, and also influences the strain path.
100 citations
Patent•
26 Sep 2002
TL;DR: In this article, a dielectric film is imprinted with a stamp pattern at high vacuum and with precise temperature and stamping pressure control, and the stamp pattern may be formed on a substrate using semiconductor fabrication techniques.
Abstract: A method for fabricating high performance vertical and horizontal electrical connections in a three dimensional semiconductor structure. A dielectric film is imprinted with a stamp pattern at high vacuum and with precise temperature and stamping pressure control. The stamp pattern may be formed on a substrate using semiconductor fabrication techniques. After the dielectric film is stamped, residual dielectric film is removed to allow access to an underlying layer. Via and trench regions formed within the dielectric film by stamping are then metalized to provide the high performance interconnections. Multiple layers of interconnections in the three dimensional structure are provided by stacking layers of stamped and metalized dielectric films on top of each other.
100 citations
TL;DR: In this article, major, recent developmental trends in the field of metal forming are presented both from an experimental and numerical point of view, including rolling of long flat products, cross wedge rolling, open die forging, die forging and stamping.
99 citations