Topic
Stamping
About: Stamping is a research topic. Over the lifetime, 22501 publications have been published within this topic receiving 83554 citations.
Papers published on a yearly basis
Papers
More filters
Patent•
02 Sep 1981
TL;DR: In this paper, a method of producing electrical contacts on a Silicon Solar Cell comprises stamping contact shapes from a carrier with a metallic film or foil adhered thereto and applying the stamped out film to the silicon surface to adhere thereto while removing the carrier therefrom.
Abstract: A method of producing electrical contacts on a Silicon Solar Cell comprises stamping contact shapes from a carrier with a metallic film or foil adhered thereto and applying the stamped out film or foil to the silicon surface to adhere thereto while removing the carrier therefrom.
58 citations
TL;DR: In this paper, the formability of bipolar plates for polymer electrolyte membrane fuel cells (PEMFCs) fabricated by vacuum HPDC of an Al-Mg alloy (ALDC6) was investigated.
57 citations
Patent•
IBM1
TL;DR: In this article, a flexible stamp stencil is used to achieve uniform guide tracks over the entire surface of an optical storage disk, whose curvature can be changed by applying hydrostatic pressure.
Abstract: An optical storage disk consists of a glass substrate (1) into which guide tracks (3) for servo-controlling the focussed light beams are directly stamped by a hot stamp process. After stamping, the glass substrate is thermally quenched in the stamping device to increase its breaking resistance through thermal curing. In order to achieve uniform guide tracks over the entire surface of an optical storage disk, flexible stamp stencils (35) in a flexible holder (34) are used whose curvature can be changed by applying hydro-static pressure. Suitable stamp stencils consist of monocristalline silicon disks with surface hardening, or of metal disks, structured in photolithographic processes. The stamp lands are made with bevelled edges to facilitate the separating of stamp and glass substrate after cooling.
57 citations
TL;DR: In this paper, a smart hot stamping process of ultra-high strength steel parts has been developed to overcome difficulties in the present hot-stamping process using rapid resistance heating, the stamping equipment became considerably simpler than that using furnace heating.
57 citations
TL;DR: In this paper, the in-plane and through-thickness behavior of the 3D warp interlock fibrous reinforcements during forming with a hemispherical punch was investigated.
Abstract: Forming of continuous fibre reinforcements and thermoplastic resin commingled prepregs can be performed at room temperature due to its similar textile structure. The “cool” forming stage is better controlled and more economical. The increase of temperature and the resin consolidation phases after the forming can be carried out under the isothermal condition thanks to a closed system. It can avoid the manufacturing defects easily experienced in the non-isothermal thermoforming, in particular the wrinkling [1]. Glass/Polypropylene commingled yarns have been woven inside different three-dimensional (3D) warp interlock fabrics and then formed using a double-curved shape stamping tool. The present study investigates the in-plane and through-thickness behaviour of the 3D warp interlock fibrous reinforcements during forming with a hemispherical punch. Experimental data allow analysing the forming behaviour in the warp and weft directions and on the influence of warp interlock architectures. The results point out that the layer to layer warp interlock preform has a better stamping behaviour, in particular no forming defects and good homogeneity in thickness.
56 citations