Stamping

About: Stamping is a research topic. Over the lifetime, 22501 publications have been published within this topic receiving 83554 citations.

Photovoltaic devices with an active layer from a stamping transfer technique: single layer versus double layer.

Abstract: In this study, organic photovoltaic devices with single or double-layered active film were prepared from a stamping transfer technique A P3HT/PCBM single-layered active layer and a ratio-controlled P3HT/PCBM double-layered active can be successfully fabricated with the help of ultraviolet curable polycarbonate films via a stamping transfer technique The maximum conversion efficiency values 285 for a single active layer transferred device and 324% for an optimized double active layer transferred device Even though transferred double layers should have a sharp interface boundary, an intermixed zone with a concentration gradient was generated by the interpenetration of a donor-rich layer and an acceptor-rich layer in a thermal annealing process The generation of the intermixed zone is confirmed by Auger electron spectroscopy The enhanced conversion efficiency levels are attributed to the increased efficiency of the carrier transporting process, which is due to the fact that the concentration gradient is combined with the efficient charge generation from the bulk heterojunction layers

Analysis of the thickness distribution varying tool trajectory in single-point incremental forming:

Abstract: Single-point incremental forming (SPIF) presents a great competitive advantage with respect to the conventional stamping processes, in particular when small batches have to be produced. The competi...

2D material printer: a deterministic cross contamination-free transfer method for atomically layered materials

Abstract: Precision and chip contamination-free placement of two-dimensional (2D) materials is expected to accelerate both the study of fundamental properties and novel device functionality. Current deterministic transfer methods of 2D materials onto an arbitrary substrate deploy viscoelastic stamping. However, these methods produce (a) significant cross-contamination of the substrate inherent from typical dense sources of 2D material flakes and (b) are challenged with respect to spatial alignment, and (c) multi-transfer at a single step. Here, we demonstrate a novel method of transferring 2D materials resembling the functionality known from printing; utilizing a combination of a sharp micro-stamper and viscoelastic polymer, we show precise placement of individual 2D materials resulting in vanishing cross-contamination to the substrate. Our 2D printer-method results in an aerial cross-contamination improvement of two to three orders of magnitude relative to state-of-the-art transfer methods from a source of average area for single flake (~50 µm2). Moreover, we find that the 2D material quality is preserved in this transfer method. Testing this 2D material printer on taped-out integrated Silicon photonic chips, we find that the micro-stamper stamping transfer does not physically harm the underneath Silicon nanophotonic structures such as waveguides or micro-ring resonators receiving the 2D material. We further demonstrate functional devices such as Graphene tunnel junctions and transistors, and TMD-based material tunable microring resonators. Such accurate and substrate-benign transfer method for 2D materials could be industrialized for rapid device prototyping due to its high time-reduction, accuracy, and contamination-free process.