Topic
Stress concentration
About: Stress concentration is a research topic. Over the lifetime, 23250 publications have been published within this topic receiving 422911 citations.
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TL;DR: In this paper, the fatigue behavior of the fine-grain 5056 Al-alloy processed by equal-channel angular pressing (ECAP) is explored, and it is shown that the fine structure achieved during processing is unstable and tends to relax with cycling.
138 citations
TL;DR: In this article, the effect of the back bars in connection failure is analyzed by fracture mechanics methods. And two remedy designs using a dog bone and reinforcing plates are presented at the end.
137 citations
TL;DR: In this paper, the authors present experimental evidence to show that commonly used methods for notch fatigue assessment result in conservative predictions when applied to certain 3D geometries, in both welded joints and features machined from solid steel.
137 citations
TL;DR: In this paper, a plane-strain solution for the problem of a finite crack in a transverse field of uniform uni-axial tension is presented, and the singularities arising at the ends of the crack are studied in detail.
137 citations
TL;DR: In this paper, a first-order perturbation analysis of the stress concentration effects caused by slightly undulating surfaces is presented, where the perturbations are treated as being perturbed from a reference state in which the surface is perfectly flat.
Abstract: T his paper presents a first-order perturbation analysis of the stress concentration effects caused by slightly undulating surfaces. The perturbation approach that we use treats the undulating surfaces as being perturbed from a reference state in which the surface is perfectly flat. The magnitude of the perturbation is assumed to be sufficiently small compared to other length scales of the bulk material so that a half-plane model can be used for simplification. First-order-accurate perturbation solutions have been derived for the stress distribution along a sinusoidally wavy surface and for the attenuation of the stress concentration away from the undulating surface. The interactions among different surface perturbation waves are investigated by comparing the result of stress concentration factor at the trough of a single wave perturbation along an otherwise flat surface to that for periodically wavy surface. We also examine some of the 3-D effects by using the perturbation algorithm to calculate the stress concentration at undulating surfaces of elastic half-spaces. In all cases, it is found that wavy surfaces can magnify the bulk stress easily by a factor of 2 or 3 when the surface profile does not deviate substantially from flatness. This stress concentration effect is significant especially for already highly stressed heteroepitaxial semiconductor thin films, suggesting that the surface morphology of the film surfaces can play an important role in nucleating dislocations and crack-like surface flaws before the bulk stress reaches a critical level.
137 citations