Topic
Stress field
About: Stress field is a research topic. Over the lifetime, 11926 publications have been published within this topic receiving 226417 citations.
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TL;DR: In this paper, the influence of the plastic size effect on the fracture process of metallic materials is numerically analyzed using the strain-gradient plasticity (SGP) theory established from the Taylor dislocation model.
79 citations
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TL;DR: In this article, the authors developed a method which allows one to calculate the complete elastic field (stress field unit displacements) of layered materials of transverse and complete isotropy under given load conditions.
Abstract: This paper develops a method which allows one to calculate the complete elastic field (stress field unit displacements) of layered materials of transverse and complete isotropy under given load conditions. It is assumed that the layered body consists of at infinite half-space and various infinite planes which are all ideally bonded to each other. Thus, the interfaces are parallel to the surface of the resulting coated half space. The approach is based on the method of images in classical electrostatics. The final solution for an arbitrary load problem can be presented as a series of potential functions, where corresponding functions may be interpreted as image loads the analogous to image charges. The solution for the elastic field for any arbitrary stress distribution on the surface of the coated half space can be obtained in a relatively straightforward manner by using the method described here as long as the corresponding solution for the homogeneous half space is known. Further, if this solution of the homogeneous case may be expressed in terms of elementary functions, then the solution for the coated half space is elementary, too, Explicit formulas for the stress fields for some particular examples are given.
79 citations
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TL;DR: In this paper, electron backscattered diffraction and Schmid's law numerical analysis were combined to study the micro-mechanisms responsible for transgranular fracture in magnesium AZ61 subjected to a triaxial stress field operating at the vicinity of a notch.
79 citations
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TL;DR: In this paper, a model for grain boundary stress evolution during thin film growth is presented, which is based on Chason et al.'s hypothesis that the evolution of compressive stress during thin-film growth by vapor deposition is due to an increase in surface chemical potential in the presence of growth flux.
Abstract: Based on recent in situ measurements, Chason et al. (2002) proposed that the evolution of compressive stress during thin film growth by vapor deposition is due to an increase in surface chemical potential in the presence of growth flux and the consequent exchange of adatoms between the free surface and the grain boundaries. Based on this hypothesis, we present a model for grain boundary stress evolution during thin film growth. To illustrate the mechanics of the problem, first it is assumed that the local normal stress on the grain boundary is proportional to the local grain boundary opening only. The resulting “linear spring” model captures all essential features of the experimental observations. A more accurate description of the grain boundary stress evolution is presented by modeling the stress field due to the material inserted into the grain boundary as that resulting from a continuous distribution of dislocations along the grain boundary. The adatom flux between the grain boundary and the free surface is assumed to be proportional to the difference in chemical potential between the two. This model successfully explains a wide range of experimental observations, including the development of compressive stress during room temperature growth, effect of growth rate on the kinetics of compressive stress evolution and the continued tensile stress generation during low-temperature growth.
79 citations
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TL;DR: In this article, the authors investigated the effects of triaxial stress on mixed-mode fracture and determined the direction of the crack initiation in dependence on the inclination crack angle with mixedmode loading.
79 citations