Stress relaxation

About: Stress relaxation is a research topic. Over the lifetime, 12959 publications have been published within this topic receiving 270815 citations.

Molecular beam epitaxy of SrTiO3 on Si (001): Early stages of the growth and strain relaxation

Abstract: The molecular beam epitaxy of SrTiO3 (STO) layers on Si (001) is studied, focusing on the early stages of the growth and on the strain relaxation process. Evidence is given that even for optimized growth conditions, STO grows initially amorphous on silicon and recrystallizes, leading to the formation of an atomically abrupt heterointerface with silicon. Just after recrystallization, STO is partially strained. Further increase in its thickness leads to the onset of a progressive plastic relaxation mechanism. STO recovers its bulk lattice parameter for thicknesses of the order of 30 ML.

Three-dimensional numerical simulations of dynamic faulting in a half-space

Abstract: A method is presented for the computation of near-field particle displacements and particle velocities resulting from a dynamic propagating, stress relaxation occurring on a finite fault plane embedded within a three-dimensional semiinfinite medium To check our numerical procedure we compare our results for a circular fault in a full space with Kostrov's (1964) analytic solution for a self-similar propagating stress relaxation We have simulated two bilateral strike-slip earthquakes differing only in hypocentral location and examined the particle motion on the traction-free surface and on the rupture surface Focusing of energy is evident in both ruptures The static displacement on the rupture surface overshoots the theoretical static value by approximately 25 per cent For the rupture that nucleated at depth the free surface almost doubled the particle velocities along the fault trace as compared with the rupture that nucleated at the free surface Our numerical results indicate that for an earthquake occurring on a semi-circular fault with radius of 10 km, an effective stress of 100 bars and a rupture velocity of 09 β in a medium characterized by β = 3 km/sec, α = α = 3 β and a density of 27 gm/cm3 particle velocities can reach 400 cm/sec and displacements 250 cm We also compare our numerical results with the observations made by Archuleta and Brune (1975) for a spontaneous stress relaxation on a semi-circular crack in a prestressed foam rubber block

Electromigration-induced plastic deformation in passivated metal lines

Abstract: We have used scanning white beam x-ray microdiffraction to study microstructural evolution during an in situ electromigration experiment on a passivated Al(Cu) test line. The data show plastic deformation and grain rotations occurring under the influence of electromigration, seen as broadening, movement, and splitting of reflections diffracted from individual metal grains. We believe this deformation is due to localized shear stresses that arise due to the inhomogeneous transfer of metal along the line. Deviatoric stress measurements show changes in the components of stress within the line, including relaxation of stress when current is removed.