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Stress relaxation

About: Stress relaxation is a research topic. Over the lifetime, 12959 publications have been published within this topic receiving 270815 citations.


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Journal ArticleDOI
TL;DR: In this paper, a viscoelastic rod of finite length is described by a constitutive equation of fractional distributed-order type with the special choice of weight functions, and boundary conditions on displacement and stress are given.

66 citations

Journal ArticleDOI
TL;DR: In this paper, the properties of three magnesium alloys Mg4Li, LA43 and LA45 have been investigated in compression tests at temperatures between 25 and 200 ˚ c. The deformation behavior of the specimens can be attributed to the occurrence of hardening and softening during deformation.
Abstract: The mechanical properties of three magnesium alloys Mg4Li, LA43 and LA45 have been investigated in compression tests at temperatures between 25 and 200 °C. The yield stress and the maximum stress are sensitive to the testing temperature. The deformation behaviour of the specimens can be attributed to the occurrence of hardening and softening during deformation. Additions of aluminium to Mg4Li alloy increase the alloy strength. After stress relaxation of LA43 and LA45 alloy an increase in the flow stress is observed.

66 citations

Journal ArticleDOI
TL;DR: In this paper, the mechanisms of cyclic creep retardation and acceleration on copper polycrystals at ambient temperature have been investigated and an expression for the temperature dependence of the threshold stress for acceleration is offered.

66 citations

Journal ArticleDOI
TL;DR: The human facet joint capsule is one of the structures in the lumbar spine that constrains motions of vertebrae during global spine loading (e.g., physiological flexion) and nonlinear and anisotropic material properties were determined.
Abstract: The human facet joint capsule is one of the structures in the lumbar spine that constrains motions of vertebrae during global spine loading (e.g., physiological flexion). Computational models of the spine have not been able to include accurate nonlinear and viscoelastic material properties, as they have not previously been measured. Capsules were tested using a uniaxial ramp-hold protocol or a haversine displacement protocol using a commercially available materials testing device. Plane strain was measured optically. Capsules were tested both parallel and perpendicular to the dominant orientation of the collagen fibers in the capsules. Viscoelastic material properties were determined. Parallel to the dominant orientation of the collagen fibers, the complex modulus of elasticity was E* = 1.63MPa, with a storage modulus of E′ = 1.25MPa and a loss modulus of: E″ = 0.39MPa. The mean stress relaxation rates for static and dynamic loading were best fit with first-order polynomials: B (ɛ) = 0.1110 ɛ − 0.0733 and B (ɛ) = −0.1249ɛ 11794-8181 +0.0190, respectively. Perpendicular to the collagen fiber orientation, the viscous and elastic secant moduli were 1.81 and 1.00 MPa, respectively. The mean stress relaxation rate for static loading was best fit with a first-order polynomial: B (ɛ) = − 0.04ɛ − 0.06. Capsule strength parallel and perpendicular to collagen fiber orientation was 1.90 and 0.95 MPa, respectively, and extensibility was 0.65 and 0.60, respectively. Poisson’s ratio parallel and perpendicular to fiber orientation was 0.299 and 0.488, respectively. The elasticity moduli were nonlinear and anisotropic, and capsule strength was larger aligned parallel to the collagen fibers. The phase lag between stress and strain increased with haversine frequency, but the storage modulus remained large relative to the complex modulus. The stress relaxation rate was strain dependent parallel to the collagen fibers, but was strain independent perpendicularly.

66 citations

Journal ArticleDOI
TL;DR: In this article, the authors measured the interface and grain-boundary mass transport measured from isothermal stress relaxation in electroplated Cu thin films with and without a passivation layer and developed a kinetic model developed to analyze the stress relaxation based on the coupling of grain boundary and interface diffusion.
Abstract: Recent studies on Cu interconnects have shown that interface diffusion between Cu and the cap layer dominates mass transport for electromigration. The kinetics of mass transport by interface diffusion strongly depends on the material and processing of the cap layer. In this series of two papers, we report in Part I the interface and grain-boundary mass transport measured from isothermal stress relaxation in electroplated Cu thin films with and without a passivation layer and in Part II a kinetic model developed to analyze the stress relaxation based on the coupling of grain boundary and interface diffusion. We show that a set of isothermal stress relaxation experiments together with appropriate modeling analysis can be used to evaluate the kinetics of interface and grain-boundary diffusion that correlate to electromigration reliability of Cu interconnects. Thermal stresses in electroplated Cu films with and without passivation, subjected to thermal cycling and isothermal annealing at selected temperatures...

66 citations


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Performance
Metrics
No. of papers in the topic in previous years
YearPapers
2023145
2022390
2021266
2020276
2019270
2018281