Topic
Stub (electronics)
About: Stub (electronics) is a research topic. Over the lifetime, 8172 publications have been published within this topic receiving 75018 citations.
Papers published on a yearly basis
Papers
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19 Dec 2008TL;DR: In this article, a photovoltaic structure is constructed by forming a stub, growing a nanowire from the stub, and conformally coating the nanowires with a semiconductor mask.
Abstract: A photovoltaic structure (105) of a photovoltaic cell (100), (200) and a method (300) of fabricating a photovoltaic structure (105), (100), (200) employ a nanowire (140) having a base connected to a stub (120) and an electrical isolation layer (130) surrounding the stub. The stub is a constituent of a substrate surface (112). The nanowire extends away from the substrate surface and is wider than the stub. The nanowire base overlies a part of the isolation layer that is adjacent to the stub. A semiconductor junction comprises the nanowire. The method (300) includes forming (320) the stub; growing (340) the nanowire from the stub; and conformally coating (360) the nanowire. A nanoparticle (150) is applied (322) to the substrate surface. The isolation layer is created (324) on and embedded in the substrate surface using the nanoparticle as a mask. A portion of the substrate surface underlying the nanoparticle forms the stub. The nanoparticle (150) catalyzes nanowire growth (340) on the stub. The stub is narrower than the nanoparticle.
35 citations
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TL;DR: In this paper, a wideband printed slot antenna fed by a radial stub operating over the mobile communication bands PCN (1.716-1.880 GHz) and UMTS (19-2.2 GHz) is presented.
Abstract: A wideband printed slot antenna fed by a radial stub operating over the mobile communication bands PCN (1.716-1.880 GHz) and UMTS (1.9-2.0 GHz and 2.1-2.2 GHz) is presented. The impedance bandwidth of the antenna achieved for a VSMR/spl les/2 is 34% and the radiation patterns remain stable over the entire frequency band of operation (1.7-2.4 GHz) with cross-polarisation levels of less than -20 dB. Simulated and measured radiation pattern and return loss results are presented.
34 citations
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03 Jul 2001TL;DR: In this paper, the authors proposed a directional coupler and directional coupling method enabling the miniaturization and harmonic spurious suppression effect with a low loss and with excellence even in microwave/millimeter wave band.
Abstract: Input port 101 is connected to output port 102 via open-circuited stub 107 , first transmission line 105 and open-circuited stub 108 . Coupling port 103 is connected to isolation port 104 via second transmission line 106 in electromagnetic coupling with first transmission line 105 . Open-circuited stubs 107 and 108 have a stub length corresponding to ¼ wavelength in desired stop frequency. It is thereby possible to provide a directional coupler and directional coupling method enabling the miniaturization and harmonic spurious suppression effect with a low loss and with excellence even in microwave/millimeter wave band.
34 citations
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TL;DR: It is shown that optimum networks have nonzero reflection coefficient minima, as predicted by classical broad-band matching theory.
Abstract: Given a load network consisting of a conductance in parallel with a short-circuited stub, the admittance values of optimum one and two section commensurate transmission line matching networks are derived. These values are expressed in closed form as functions of the bandwidth and ripple level. It is shown that optimum networks have nonzero reflection coefficient minima, as predicted by classical broad-band matching theory.
34 citations
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TL;DR: In this article, physics-based models are used to develop insight into practical aspects of the electrical performance of via interconnects in the frequency range up to 20 GHz, and both via impedance matching and stub length reduction methods were applied to a generic link configuration in order to assess the impact on signal integrity.
Abstract: In this third paper of the series, physics-based models are used to develop insight into practical aspects of the electrical performance of via interconnects in the frequency range up to 20 GHz. It will be shown that with careful design of the via environment, the current return path can be controlled, which makes it possible to describe vias in terms of transmission line parameters in certain frequency ranges. This implies that via impedance can be controlled to match a specific target in order to minimize reflections. Furthermore, the via stub effect and alternatives to mitigate it by shifting unwanted resonances beyond the range of interest are addressed. Finally, both via impedance matching and stub length reduction methods were applied to a generic link configuration in order to assess the impact on signal integrity.
34 citations