Topic
Stub (electronics)
About: Stub (electronics) is a research topic. Over the lifetime, 8172 publications have been published within this topic receiving 75018 citations.
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Patent•
08 Mar 2011TL;DR: In this paper, a via stub is removed through a combination of backdrilling and chemical etching and the remaining portions of the underlying layer is removed in subsequent etching process to remove the via stub from the PCB.
Abstract: Methods of backdrilling printed circuit boards (PCBs) to remove via stubs and related apparatuses. The method may include removing a via stub through a combination of backdrilling and chemical etching. The backdrilling may remove a masking layer from the via stub. Portions of an underlying layer may remain in the region of the via stub after the backdrilling is completed. The remaining portions of the underlying layer may be removed in a subsequent etching process thereby removing the via stub from the PCB. As the backdrilling step may be used for the limited purpose of removing the outer layer and portions of the underlying layer remaining in the via can be tolerated, the diameter of the backdrilling need not be as large as traditional backdrilling where all layers within the via must be ensured of being completely removed.
42 citations
Patent•
10 Aug 1993
TL;DR: In this paper, a dielectric material is formed into a structure having two parallel broad surfaces with one or more raised integral portions extending transversely across at least one of the broad surfaces.
Abstract: A dielectric material is formed into a structure having two parallel broad surfaces with one or more raised integral portions extending transversely across at least one of the broad surfaces. The exterior is uniformly conductively coated resulting in a parallel plate waveguide having a continuous transverse stub element disposed adjacent one plate thereof. Purely reactive elements are formed by leaving the conductive coating on the terminus of the stub element, or by narrowing the terminus of the stub element. Radiating elements are formed when stub elements of moderate height are opened to free space. Radiating, coupling and/or reactive continuous transverse stub elements may be combined in a common parallel plate structure in order to form a variety of microwave, millimeter wave and quasi-optical components including integrated filters, couplers and antenna arrays. Fabrication of the dielectrically-loaded continuous transverse stub element can be efficiently accomplished by machining, extruding or molding the dielectric structure, followed by uniform conductive plating in order to form the parallel plate transmission line. In the case of antenna applications, machining or grinding is performed on the stub terminus to expose the dielectric material at the end of the stub element.
42 citations
TL;DR: In this article, a coplanar waveguide-based multi-dielectric layer design was proposed to reduce the insertion losses and produce good impedance matching for electronic beam steering capabilities.
Abstract: In this paper, a new integrated phased array antenna system employing the ferroelectric materials technology for electronic beam steering capabilities is described. The design integrates a ferroelectric coplanar waveguide phase shifter with the continuous transverse stub (CTS) array. The phase shifter employs a multi-dielectric substrate and includes a thin layer of silicon dioxide between the signal conductors and the ferroelectric material to reduce the insertion losses and produce good impedance matching. The coplanar waveguide-based multi-dielectric layer design demonstrated an effective ferroelectric biasing architecture and exhibited an increase in figure of merit by up to 8deg/dB from that of the direct metallization approach. An integrated two elements phased array antenna is developed and demonstrates linearly polarized radiation with +/-20deg of beam scanning between the unbiased and biased states of the ferroelectric phase shifter
42 citations
TL;DR: In this paper, a miniature harmonic-suppressed microstrip band pass filter (BPF) with a new triplemode stub-loaded resonator is presented, where four distinct mechanisms are utilized to create five transmission zeros (TZs), leading to sharp skirts and wide stopband.
Abstract: A miniature harmonic-suppressed microstrip band pass filter (BPF) with a new triple-mode stub-loaded resonator is presented in this letter. Four distinct mechanisms are utilized to create five transmission zeros (TZs), leading to sharp skirts and wide stopband. Both simulation and measurement results are presented. The simulated/measured minimum passband insertion loss is 0.66 dB/0.78 dB and the 20 dB rejection bandwidth is extended up to 4/0. The size of the filter is about 0.23 λg × 0.17 λg, where λg is the guided wavelength at the center frequency.
42 citations
TL;DR: In this article, a spectral Green's function approach is used to derive an accurate expression for the active impedance of an infinite array, which is validated through comparison with full-wave simulations when the array scans are in principal planes.
Abstract: This paper introduces a rigorous and effective modeling framework for the continuous transverse stub (CTS) array, based on a spectral Green’s function approach. A multimodal expansion of the equivalent currents over the slots is used to derive an accurate expression for the active impedance of an infinite array. This formula is validated through comparisons with full-wave simulations when the array scans are in principal planes. The mathematical formulation highlights the broadband properties of CTS arrays and accurately predicts the impact of the geometrical parameters on the active impedance, as a function of frequency and scan angle. The discussion of the results provides physical insights to outline effective design strategies.
41 citations