Topic
Subthreshold conduction
About: Subthreshold conduction is a(n) research topic. Over the lifetime, 6343 publication(s) have been published within this topic receiving 131957 citation(s). The topic is also known as: Subthreshold leakage.
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TL;DR: The present study arose from the chance observation that end-plates of resting muscle fibres are the seat of spontaneous electric discharges which have the character of miniature end-plate potentials.
Abstract: The present study arose from the chance observation that end-plates of resting muscle fibres are the seat of spontaneous electric discharges which have the character of miniature end-plate potentials. The occurrence of spontaneous subthreshold activity at an apparently normal synapse is of some general interest, and a full description will be given here of observations which have been briefly reported elsewhere (Fatt & Katz, 1950a).
1,685 citations
IBM1
TL;DR: The end result is that there is no single end point for scaling, but that instead there are many end points, each optimally adapted to its particular applications.
Abstract: This paper presents the current state of understanding of the factors that limit the continued scaling of Si complementary metal-oxide-semiconductor (CMOS) technology and provides an analysis of the ways in which application-related considerations enter into the determination of these limits. The physical origins of these limits are primarily in the tunneling currents, which leak through the various barriers in a MOS field-effect transistor (MOSFET) when it becomes very small, and in the thermally generated subthreshold currents. The dependence of these leakages on MOSFET geometry and structure is discussed along with design criteria for minimizing short-channel effects and other issues related to scaling. Scaling limits due to these leakage currents arise from application constraints related to power consumption and circuit functionality. We describe how these constraints work out for some of the most important application classes: dynamic random access memory (DRAM), static random access memory (SRAM), low-power portable devices, and moderate and high-performance CMOS logic. As a summary, we provide a table of our estimates of the scaling limits for various applications and device types. The end result is that there is no single end point for scaling, but that instead there are many end points, each optimally adapted to its particular applications.
1,288 citations
TL;DR: Multilayer MoS(2) phototransistors further exhibit high room temperature mobilities, near-ideal subthreshold swings, low operating gate biases, and negligible shifts in the threshold voltages during illumination.
Abstract: Phototransistors based on multilayer MoS(2) crystals are demonstrated with a wider spectral response and higher photoresponsivity than single-layer MoS(2) phototransistors. Multilayer MoS(2) phototransistors further exhibit high room temperature mobilities (>70 cm(2) V(-1) s(-1) ), near-ideal subthreshold swings (~70 mV decade(-1) ), low operating gate biases (<5 V), and negligible shifts in the threshold voltages during illumination.
877 citations
TL;DR: In this article, the scaling of fully depleted SOI devices is considered and the concept of controlling horizontal leakage through vertical structures is highlighted, and several structural variations of conventional SOI structures are discussed in terms of a natural length scale to guide the design.
Abstract: Scaling the Si MOSFET is reconsidered. Requirements on subthreshold leakage control force conventional scaling to use high doping as the device dimension penetrates into the deep-submicrometer regime, leading to an undesirably large junction capacitance and degraded mobility. By studying the scaling of fully depleted SOI devices, the important concept of controlling horizontal leakage through vertical structures is highlighted. Several structural variations of conventional SOI structures are discussed in terms of a natural length scale to guide the design. The concept of vertical doping engineering can also be realized in bulk Si to obtain good subthreshold characteristics without large junction capacitance or heavy channel doping. >
860 citations
TL;DR: Several of the extraction methods currently used to determine the value of threshold voltage from the measured drain current versus gate voltage transfer characteristics, focusing specially on single-crystal bulk MOSFETs are reviewed.
Abstract: The threshold voltage value, which is the most important electrical parameter in modeling MOSFETs, can be extracted from either measured drain current or capacitance characteristics, using a single or more transistors. Practical circuits based on some of the most common methods are available to automatically and quickly measure the threshold voltage. This article reviews and assesses several of the extraction methods currently used to determine the value of threshold voltage from the measured drain current versus gate voltage transfer characteristics. The assessment focuses specially on single-crystal bulk MOSFETs. It includes 11 different methods that use the transfer characteristics measured under linear regime operation conditions. Additionally two methods for threshold voltage extraction under saturation conditions and one specifically suitable for non-crystalline thin film MOSFETs are also included. Practical implementation of the several methods presented is illustrated and their performances are compared under the same challenging conditions: the measured characteristics of an enhancement-mode n-channel single-crystal silicon bulk MOSFET with state-of-the-art short-channel length, and an experimental n-channel a-Si:H thin film MOSFET. 2002 Elsevier Science Ltd. All rights reserved.
728 citations